AX1000-2BGG729I

IC FPGA 516 I/O 729BGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

Quantity 788 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package729-PBGA (35x35)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case729-BBGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-2BGG729I – Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

The AX1000-2BGG729I is an Axcelerator family FPGA from Microchip Technology built on the AX architecture and a CMOS antifuse process. It delivers a high-performance, single-chip nonvolatile programmable solution targeted at demanding embedded and industrial designs that require significant logic capacity, abundant I/O, and on-chip memory.

This device combines roughly 1,000,000 equivalent system gates with 18,144 logic elements, approximately 0.166 Mbits of embedded memory, and 516 user I/Os to support high-throughput signal processing, communications interfaces, and complex control applications.

Key Features

  • Core Performance System performance above 350 MHz and internal performance up to 500+ MHz as documented for the Axcelerator family, providing headroom for timing-critical designs.
  • Logic Capacity Approximately 1,000,000 equivalent system gates implemented as 18,144 logic elements, enabling крупных combinatorial and sequential designs.
  • Embedded Memory and FIFOs 36 core RAM blocks totaling 165,888 bits (approximately 0.166 Mbits) with embedded FIFO control logic for buffering and streaming data paths.
  • I/O Count and Standards 516 user I/Os with multi-standard support (1.5V, 1.8V, 2.5V, 3.3V mixed-voltage operation) and LVDS-capable differential I/Os supporting up to 700 Mb/s signaling.
  • Clocking and PLLs Segmentable clock resources and embedded PLLs with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for flexible clocking architectures.
  • Power and Supply Core supply specified at 1.425 V to 1.575 V (nominal 1.5V core voltage for low-power operation).
  • Package and Assembly 729-BBGA package (supplier package 729-PBGA, 35 × 35 mm) designed for surface-mount assembly.
  • Industrial Temperature Range Rated for operation from −40°C to +85°C for deployment in industrial environments.
  • Security and Test Nonvolatile antifuse programming with FuseLock™ protection, IEEE 1149.1 (JTAG) boundary-scan support, and Microchip Silicon Explorer II in-system diagnostic capability.
  • Design Flexibility Footprint-compatible packaging, bank-selectable I/Os (8 banks), programmable slew rate/drive strength, and input delay/weak pull options to ease board-level integration.
  • Regulatory RoHS compliant.

Typical Applications

  • High-Speed Communications Leverage LVDS-capable I/Os and high internal performance for serial links, data aggregation, and protocol bridging in communication equipment.
  • Signal Processing and Data Acquisition Embedded RAM blocks and FIFO control combined with high clock performance suit real-time processing, buffering, and streaming of sensor or RF data.
  • Industrial Control Systems Industrial temperature rating, extensive I/O, and deterministic timing make the device suitable for motor control, PLC interfaces, and factory automation logic.
  • Secure and IP-Sensitive Designs Antifuse nonvolatile programming and FuseLock™ protect design IP where reverse-engineering resistance and nonvolatile configuration are required.

Unique Advantages

  • Single-Chip Nonvolatile Solution: Antifuse-based architecture provides a one-time programmed, nonvolatile device that eliminates external configuration memory and simplifies system boot.
  • High Logic and I/O Density: 18,144 logic elements and 516 user I/Os enable complex designs with substantial peripheral connectivity without extensive external logic.
  • Embedded Memory with FIFO Support: 36 core RAM blocks and programmable FIFO control simplify high-throughput datapath implementations and reduce external buffering needs.
  • Flexible Multi-Standard I/Os: Bank-selectable, mixed-voltage I/O support and programmable drive/slew options make board-level integration and voltage interfacing straightforward.
  • Deterministic Clocking and PLLs: Segmentable clocks and on-chip PLLs (14–200 MHz input, synthesis up to 1 GHz) offer precise timing control for complex synchronous systems.
  • Industrial Robustness: Surface-mount 729-BBGA package and −40°C to +85°C operating range meet typical industrial deployment requirements.

Why Choose AX1000-2BGG729I?

The AX1000-2BGG729I positions itself as a high-capacity, nonvolatile FPGA for designers needing a balance of logic density, abundant I/O, embedded memory, and resilient operation across industrial temperature ranges. Its antifuse-based one-time programming model, FuseLock protection, and in-system diagnostic capability support secure, reliable deployments where nonvolatile configuration and IP protection are priorities.

This device is suited to system architects building high-throughput communications, signal processing, or industrial control solutions who need integrated PLLs, segmentable clocks, and flexible multi-standard I/Os to simplify board design and reduce external components.

Request a quote or contact sales to inquire about availability, lead times, and pricing for the AX1000-2BGG729I.

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