AX1000-2FG484

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

Quantity 977 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-2FG484 – Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

The AX1000-2FG484 is an Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture. It provides a single-chip, nonvolatile programmable solution with 1,000,000 gates and 18,144 logic elements for high-performance, deterministic logic implementation.

Targeted at commercial applications, this device integrates on-chip memory, segmentable clock resources and flexible multi-standard I/Os to address high-speed data processing, interface bridging and custom logic acceleration where secure, fixed-program operation and high internal performance are required.

Key Features

  • Core Capacity — 1,000,000 gates and 18,144 logic elements provide substantial programmable logic resources for complex designs.
  • Embedded Memory — Approximately 0.166 Mbits of embedded SRAM/FIFO (165,888 total bits) across 36 core RAM blocks, with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for buffering and packet handling.
  • I/O Flexibility — 317 user I/Os organized into bank-selectable groups (8 I/O banks per chip) with support for multiple single-ended and differential standards and LVDS capability up to 700 Mb/s.
  • Clocking & PLLs — Segmentable clock resources plus embedded PLLs with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for precise clock management and high-speed timing.
  • Performance — Architecture and process enable high internal and system performance, with datasheet guidance indicating 350+ MHz system performance and 500+ MHz internal performance.
  • Nonvolatile Antifuse Technology — Single-chip, nonvolatile programming with FuseLock programming technology for protection against reverse engineering and design theft.
  • Power & Supply — Core supply range of 1.425 V to 1.575 V (nominal 1.5 V) to support low-power core operation.
  • Packaging & Mounting — Surface-mount 484-FPBGA (23×23) package (484-BGA) suitable for compact board-level integration.
  • Commercial Temperature Grade — Rated for 0 °C to 70 °C operating temperature for commercial applications.
  • Diagnostics & Test — Deterministic timing, boundary-scan (IEEE 1149.1/JTAG) support and in-system diagnostic/debug capability as provided by Microchip Silicon Explorer II.

Typical Applications

  • High-speed data processing — Embedded SRAM/FIFO blocks and high internal performance enable buffering, packet handling and custom data-path implementations.
  • High-speed interfaces — LVDS-capable I/Os and programmable I/O standards support implementation of serial links and protocol bridging up to 700 Mb/s signaling.
  • ASIC replacement / Custom logic — Antifuse, nonvolatile architecture and high gate count support migration of application-specific logic to a programmable single-chip solution.
  • Clock-critical systems — Segmentable clocks and on-chip PLLs with wide input range and frequency synthesis help implement precise timing and clock generation for complex designs.

Unique Advantages

  • Single-chip nonvolatile solution: Antifuse architecture eliminates the need for external configuration storage and enables secure, one-time programmable designs.
  • Significant on-chip buffering: Approximately 0.166 Mbits of embedded SRAM and dedicated FIFO control logic reduce external memory requirements and simplify data flow handling.
  • Flexible multi-standard I/Os: Bank-selectable I/Os and support for a wide range of voltage standards provide interface versatility and simplify mixed-voltage designs.
  • High-performance clocking: Embedded PLLs and segmentable clocks permit flexible clock management and high-frequency synthesis for demanding timing requirements.
  • Security and IP protection: FuseLock programming technology and nonvolatile antifuse implementation protect designs against reverse engineering.
  • Compact, board-ready package: 484-FPBGA (23×23) BGA packaging supports high pin count in a footprint-compatible form factor for dense system integration.

Why Choose AX1000-2FG484?

The AX1000-2FG484 combines substantial programmable logic capacity with embedded memory, flexible high-speed I/Os and on-chip clock synthesis to deliver a secure, high-performance FPGA solution for commercial systems. Its antifuse, single-chip architecture offers nonvolatile configuration and design protection while reducing system-level complexity.

This device is suited to designers seeking a deterministic, high-throughput programmable device for data-path acceleration, protocol bridging and custom logic tasks in commercial-temperature applications. The combination of embedded FIFOs, PLLs and multi-standard I/Os provides a balanced platform for scalable designs where secure, fixed-function programmability is required.

If you would like pricing or availability information, request a quote or submit an inquiry to receive product details and next-step guidance for incorporating the AX1000-2FG484 into your design.

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