AX1000-2FG676I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA |
|---|---|
| Quantity | 1,722 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 418 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-2FG676I – Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA
The AX1000-2FG676I is an Axcelerator® antifuse FPGA from Microchip Technology built on the AX architecture. It delivers a single‑chip, nonvolatile implementation with on‑chip embedded SRAM/FIFO control logic, segmentable clocks and integrated PLLs for system‑level timing control. With industrial temperature grading and a 676‑FBGA package, this device targets designs requiring robust, deterministic programmable logic with substantial I/O and embedded memory resources.
Key Features
- Core Performance — Antifuse-based AX architecture providing up to 1,000,000 equivalent system gates and 18,144 logic element cells for complex logic integration.
- Embedded Memory & FIFOs — Total on-chip memory of 165,888 bits (approximately 0.166 Mbits) organized in configurable RAM blocks with embedded FIFO control logic.
- I/O Flexibility — 418 user I/Os with multi‑standard, bank‑selectable support including high‑speed differential signaling; LVDS capable to 700 Mb/s.
- Clocking & PLLs — Segmentable clock resources plus embedded PLLs with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for precise clock management.
- Deterministic Timing & Diagnostics — User‑controllable timing characteristics and in‑system diagnostic/debug capability via Microchip Silicon Explorer II; JTAG boundary‑scan support (IEEE 1149.1).
- Power & Voltage — Core supply range 1.425 V to 1.575 V, supporting low‑voltage operation consistent with antifuse-based single‑chip solutions.
- Package & Mounting — 676‑BGA (676‑FBGA, 27×27) surface‑mount package suitable for board‑level integration in compact systems.
- Industrial Grade & Compliance — Rated for –40 °C to 85 °C operating temperature and RoHS compliant.
- Security & Programming — Antifuse programming with FuseLock™ technology to protect designs against reverse engineering and unauthorized access.
Typical Applications
- High‑speed data interfaces — Use embedded FIFOs and LVDS‑capable I/Os to buffer and transport data streams at hundreds of megabits per second.
- Protocol bridging and I/O aggregation — Leverage 418 I/Os and bank‑selectable standards to implement custom interface conversions and multi‑standard front ends.
- Timing‑sensitive control systems — Segmentable clocks and integrated PLLs enable stable, deterministic timing for real‑time and industrial automation applications.
Unique Advantages
- Nonvolatile single‑chip solution: Antifuse implementation stores configuration permanently on device, removing the need for external configuration memory.
- Substantial on‑chip resources: 18,144 logic element cells and approximately 0.166 Mbits of embedded memory simplify designs by reducing external SRAM requirements.
- Robust high‑speed I/O: LVDS capability to 700 Mb/s and programmable I/O standards support mixed‑voltage interfaces without additional translation hardware.
- Deterministic clocking: Segmentable clocks plus PLL frequency synthesis deliver precise timing control for high‑performance signal processing tasks.
- Industrial reliability: –40 °C to 85 °C rating and surface‑mount 676‑FBGA package support deployment in industrial environments.
- Design security: FuseLock™ programming protects intellectual property and guards against reverse engineering.
Why Choose AX1000-2FG676I?
The AX1000-2FG676I positions itself as a high‑performance, nonvolatile FPGA option for engineers who need deterministic timing, substantial logic and embedded memory, and flexible high‑speed I/O in an industrial‑grade package. Its antifuse architecture and integrated system features—PLLs, embedded FIFOs, and robust I/O standards—help reduce external components and simplify system architecture.
Choose this device when your design requires a compact BGA package, industrial operating range, and on‑chip resources that support heavy logic integration and high‑throughput interfaces while benefiting from in‑system diagnostic capabilities and programming security.
Request a quote or submit a product inquiry to receive pricing and availability for the AX1000-2FG676I. Our team can provide configuration details and lead‑time information to support your design schedule.

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