AX1000-2FGG676I

IC FPGA 418 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

Quantity 1,182 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-2FGG676I – Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

The AX1000-2FGG676I is an Axcelerator antifuse FPGA from Microchip Technology built on the AX architecture. It is a single-chip, nonvolatile FPGA offering deterministic timing and system-level features including segmentable clocks, PLLs and embedded SRAM with FIFO control logic.

Designed for industrial applications, this device delivers high internal performance and flexible I/O capabilities while providing hardware-level programming protection. Key device parameters include 1,000,000 equivalent system gates, 18,144 logic elements, 418 user I/Os and approximately 0.166 Mbits of embedded memory.

Key Features

  • Core Architecture 
    Antifuse-based AX architecture provides a single-chip, nonvolatile solution with deterministic and user-controllable timing.
  • Logic Capacity 
    Approximately 1,000,000 equivalent system gates implemented as 18,144 logic elements to support complex logic and control functions.
  • Embedded Memory & FIFOs 
    Approximately 0.166 Mbits (165,888 bits) of on-chip SRAM with embedded FIFO control logic and independently width-configurable read/write ports.
  • High-Performance Timing 
    Segmentable clock resources plus an embedded PLL (14–200 MHz input range, frequency synthesis up to 1 GHz) support high-speed internal operation and flexible clocking.
  • I/O Flexibility 
    418 user I/Os with support for mixed-voltage operation and differential standards; datasheet notes LVDS-capable I/Os and high-speed signaling options.
  • Performance 
    Datasheet-cited performance: 350+ MHz system performance and 500+ MHz internal performance to address demanding processing paths.
  • Security & Reliability 
    FuseLock™ programming technology provides protection against reverse engineering and design theft; device is a single-chip nonvolatile solution.
  • Package & Industrial Grade 
    676-ball FBGA (27 × 27 mm) surface-mount package; industrial temperature grade with an operating range of −40 °C to +85 °C and core supply 1.425 V to 1.575 V. RoHS compliant.

Typical Applications

  • Industrial Control 
    Deterministic timing, industrial temperature rating and high logic density make the device suitable for complex control and sequencing tasks.
  • High-Speed Data Interfaces 
    High internal performance, embedded FIFOs and LVDS-capable I/Os support protocol bridging and high-throughput data paths.
  • Telecommunications and Networking 
    Segmentable clocks, embedded PLL and flexible I/O standards enable timing-sensitive packet processing and interface adaptation.
  • Instrumentation & Test Equipment 
    Large logic capacity and on-chip RAM/FIFO resources are useful for fast signal acquisition, buffering and real-time processing.

Unique Advantages

  • Nonvolatile, one-time programmable architecture 
    Antifuse-based single-chip solution eliminates the need for external configuration memory and provides stable, permanent configuration.
  • High integration reduces system BOM 
    On-chip SRAM, embedded FIFO control logic and PLLs minimize external components for buffering, clocking and memory.
  • Security-conscious programming 
    FuseLock™ programming technology protects intellectual property by preventing reverse engineering and design theft.
  • Deterministic timing and debug 
    User-controllable timing, segmentable clocking and in-system diagnostic capability support precise timing design and validation workflows.
  • Industrial-ready mechanical and electrical specs 
    Surface-mount 676-FBGA package, industrial temperature range and RoHS compliance simplify integration into production systems.

Why Choose AX1000-2FGG676I?

The AX1000-2FGG676I is positioned for designs that require permanent, high-density logic with deterministic performance and built-in security. With 18,144 logic elements, embedded SRAM/FIFO resources and a high I/O count, it addresses complex interface, buffering and processing requirements while eliminating external configuration memory.

This device is well suited to industrial and communications equipment where timing control, in-system diagnostics and IP protection are important. Its combination of processing performance, integrated memory and flexible I/O makes it a practical choice for engineers seeking a robust, long-term FPGA solution backed by Microchip's Axcelerator architecture.

Request a quote or submit a pricing and availability inquiry to receive product-level information and support for your design evaluation and procurement process.

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