AX1000-BG729M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA |
|---|---|
| Quantity | 115 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 729-PBGA (35x35) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 729-BBGA | Number of I/O | 516 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-BG729M – Axcelerator Field Programmable Gate Array (FPGA) IC
The AX1000-BG729M is an Axcelerator family Field Programmable Gate Array from Microchip Technology built on the AX antifuse architecture. This single-chip, nonvolatile FPGA integrates high-density logic (1,000,000 equivalent system gates), substantial embedded memory, and flexible, multi-standard I/Os to address high-performance, security-sensitive designs.
Designed for military-grade applications and demanding operating environments, the device combines deterministic timing, segmentable clocks, and embedded PLLs with high-speed I/O capabilities to support complex system integration and on-chip data buffering.
Key Features
- Core Capacity – Approximately 1,000,000 equivalent system gates implemented with 18,144 logic elements (cells) for complex logic integration.
- Embedded Memory – 36 core RAM blocks providing a total of 165,888 bits (approximately 0.166 Mbits) of embedded SRAM/FIFO with programmable FIFO control logic and independent, width-configurable read/write ports.
- I/O Density & Standards – 516 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL; up to 258 LVDS channels on the AX1000 device.
- Performance – System and internal performance characteristics from the Axcelerator family include 350+ MHz system performance and 500+ MHz internal performance (family-level values), and I/Os capable of up to 700 Mb/s.
- Clocking & PLLs – Segmentable clock resources and embedded PLLs (eight PLLs for the AX1000) with a 14–200 MHz input range and frequency synthesis capability.
- Nonvolatile Antifuse Technology & Security – CMOS antifuse programming with FuseLock™ technology to protect design IP against reverse engineering and design theft.
- Power & Supply – Core supply specified at 1.425 V to 1.575 V; datasheet references a 1.5 V core voltage for low-power operation.
- Package & Temperature – 729-BBGA (supplier package 729-PBGA, 35 × 35 mm), surface-mount package; military-grade operating temperature range of −55 °C to 125 °C.
- Diagnostics & Test – In-system diagnostic and debug capability with Microchip Silicon Explorer II and JTAG (IEEE 1149.1) boundary-scan support.
- Standards & Configurability – Bank-selectable I/Os, programmable slew rate and drive strength, and input pull options for flexible signal interfacing across multiple voltage domains.
- Environmental – RoHS compliant.
Typical Applications
- Military & Aerospace Systems – Military-grade temperature range and nonvolatile antifuse programming make the AX1000 suitable for defense and aerospace designs requiring rugged, secure programmable logic.
- High-Speed Data Processing – Embedded FIFOs, substantial on-chip SRAM and high internal performance support data buffering and real-time signal processing tasks.
- Secure, IP-Sensitive Designs – FuseLock programming technology and antifuse nonvolatile configuration protect proprietary logic and prevent reverse engineering.
- High-Density I/O Interfaces – Large I/O count and multi-standard, banked I/Os enable complex system interfacing, high-speed serial links (LVDS), and mixed-voltage board designs.
Unique Advantages
- High integration density: Combines 1,000,000 equivalent gates and 18,144 logic elements to reduce external glue logic and simplify system design.
- On-chip memory with FIFO control: Approximately 0.166 Mbits of embedded memory and programmable FIFO logic for efficient data flow and reduced external memory requirements.
- Robust I/O flexibility: Bank-selectable, multi-voltage I/Os and broad standard support (LVTTL, LVCMOS, LVDS, LVPECL, SSTL, HSTL, GTL+) streamline mixed-signal and high-speed interface design.
- Security through hardware programming: Antifuse-based nonvolatile configuration and FuseLock™ protect design IP and deter reverse engineering.
- Designed for harsh environments: Military-grade temperature range (−55 °C to 125 °C) and surface-mount 729-BBGA packaging support reliable operation in demanding conditions.
- Deterministic timing and debug: Segmentable clocking, embedded PLLs, and in-system diagnostic support via Microchip Silicon Explorer II enable controllable timing and efficient debug workflows.
Why Choose AX1000-BG729M?
The AX1000-BG729M positions itself as a high-density, secure, and rugged FPGA solution for designs that require substantial on-chip logic, embedded memory, and flexible I/O in military and other demanding environments. Its antifuse nonvolatile architecture and FuseLock protection make it appropriate for IP-sensitive systems where security and long-term configuration stability matter.
Backed by Microchip Technology’s Axcelerator family features—segmentable clocks, multiple PLLs, extensive I/O options, and in-system diagnostic tools—this device offers a compact, integrated platform for engineers building high-performance, secure systems that benefit from deterministic timing and reduced external components.
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