AX1000-BGG729I

IC FPGA 516 I/O 729BGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

Quantity 1,512 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package729-PBGA (35x35)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case729-BBGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-BGG729I – Axcelerator Field Programmable Gate Array IC, 516 I/Os, 165,888-bit Embedded RAM, 729-BBGA

The AX1000-BGG729I is an Axcelerator antifuse FPGA implementing Microchip's AX architecture as a single-chip, nonvolatile programmable logic solution. It delivers high-density logic (1,000,000 equivalent system gates) with 18,144 logic elements and embedded SRAM/FIFO resources suitable for industrial designs.

Designed for system-level integration, the device offers segmentable clocks, on-chip PLLs, high-speed I/Os and deterministic timing for applications that require secure, high-performance programmable logic in a surface-mount 729-BBGA package.

Key Features

  • Core Capacity — 1,000,000 equivalent system gates with 18,144 logic elements and up to 12,096 flip-flops, providing substantial programmable logic density for complex designs.
  • Embedded Memory — 165,888 bits of on-chip SRAM/FIFO (approximately 0.166 Mbits) with variable-aspect 4,608-bit RAM blocks and embedded FIFO control logic for buffering and packet handling.
  • I/O Flexibility — 516 user I/Os with bank-selectable I/O architecture (8 banks per chip) and mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V); supports single-ended and differential standards including LVTTL, LVCMOS, LVDS and LVPECL.
  • High-Speed Performance — Datasheet-specified system performance of 350+ MHz and internal performance above 500+ MHz, plus LVDS-capable I/Os up to 700 Mb/s for high-throughput interfaces.
  • Clocking and PLLs — Segmentable clock resources and embedded PLLs with an input range of 14–200 MHz and frequency synthesis capability up to 1 GHz to support complex timing architectures.
  • Nonvolatile Antifuse Technology & Security — Single-chip nonvolatile antifuse programming and FuseLock programming technology to protect designs against reverse engineering and unauthorized access.
  • Deterministic Timing & Debug — Deterministic, user-controllable timing and in-system diagnostic/debug capability with Microchip Silicon Explorer II to streamline validation and bring-up.
  • Package, Power and Temperature — Surface-mount 729-BBGA (supplier package: 729-PBGA, 35 × 35 mm), core supply 1.425 V to 1.575 V (nominal 1.5 V), industrial operating range −40 °C to +85 °C, RoHS compliant.

Typical Applications

  • High-performance digital processing — Large logic capacity and high internal/system performance enable processing engines and protocol offloads that require substantial programmable logic resources.
  • Secure embedded systems — Single-chip nonvolatile antifuse programming and FuseLock protection are suited to designs where IP protection and reverse-engineering resistance are required.
  • High-speed interface bridging — 516 flexible I/Os and LVDS-capable channels support high-throughput serial and parallel interfaces for protocol conversion and board-level bridging.
  • Buffered data transport and FIFO handling — Integrated SRAM/FIFO blocks with programmable FIFO control simplify packet buffering, stream alignment and memory-mapped data paths.

Unique Advantages

  • Highly integrated single-chip solution: Combines logic, embedded RAM/FIFO, PLLs and high-speed I/Os to reduce external components and simplify system design.
  • Deterministic timing and on-chip debug: User-controllable timing and Microchip's Silicon Explorer II support shorten debug cycles and improve time-to-market.
  • Flexible I/O standards: Bank-selectable mixed-voltage I/Os and support for multiple single-ended and differential standards enable broad interface compatibility without external translators.
  • Nonvolatile security: Antifuse technology and FuseLock programming protect design assets and provide a persistent, tamper-resistant configuration.
  • Industrial-grade operation: Specified for −40 °C to +85 °C operation and surface-mount 729-BBGA packaging for reliable deployment in industrial environments.

Why Choose AX1000-BGG729I?

The AX1000-BGG729I positions as a high-density, nonvolatile FPGA with features tailored for secure, deterministic and high-performance embedded systems. Its combination of 1,000,000 equivalent gates, 18,144 logic elements, substantial embedded RAM/FIFO, and flexible high-speed I/Os supports complex designs that require both throughput and configurability.

With antifuse programming technology, on-chip PLLs, and diagnostic/debug support, this device is well suited to designers seeking a robust programmable logic component for industrial applications where long-term stability, IP protection and reliable timing are priorities.

Request a quote or submit a purchasing inquiry today to evaluate AX1000-BGG729I for your design needs.

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