AX1000-FG484I

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

Quantity 238 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-FG484I – Axcelerator Field Programmable Gate Array (FPGA) IC, 484-BGA, Industrial

The AX1000-FG484I is an Axcelerator antifuse FPGA implementing Microchip’s AX architecture as a single-chip, nonvolatile solution optimized for high-performance, deterministic designs. With a 1,000,000‑gate equivalent capacity, 18,144 logic elements and 317 user I/Os, the device targets demanding industrial and embedded applications that require high internal throughput, configurable I/O standards and on-chip memory/FIFO capabilities.

Key Features

  • Core architecture — AX antifuse architecture with single-chip nonvolatile programming and FuseLock programming technology for design protection.
  • Logic capacity — 1,000,000 equivalent system gates and 18,144 logic elements (logic element cells) for complex custom logic implementations.
  • Embedded memory and FIFO — 165,888 total bits of embedded RAM (approximately 0.166 Mbits) with programmable FIFO control logic for buffering and width-configurable read/write ports.
  • I/O flexibility — 317 user I/Os with support for multi-standard I/Os (bank-selectable); device family supports high-speed differential standards including LVDS and LVPECL and up to 700 Mb/s LVDS-capable I/Os.
  • Performance — System and internal performance characteristics documented in the Axcelerator family (350+ MHz system, 500+ MHz internal) and high-performance embedded FIFOs for throughput-sensitive designs.
  • Clocking and PLL — Segmentable clock resources and embedded PLLs with frequency synthesis capabilities (14–200 MHz input range; synthesis up to 1 GHz as documented for the family).
  • Process and reliability — Manufactured on a 0.15 μm CMOS antifuse process with seven metal layers; RoHS compliant.
  • Power and packaging — Core voltage supply range 1.425 V to 1.575 V; surface-mount 484‑BGA package (484‑FPBGA, 23×23). Grade: Industrial; operating temperature −40°C to 85°C.

Typical Applications

  • High-speed data acquisition — Use embedded FIFOs and LVDS-capable I/Os to implement deterministic, high-throughput capture and buffering pipelines.
  • Interface bridging and protocol conversion — Leverage the device’s multi-standard I/O support and abundant logic elements to translate between disparate bus and serial standards.
  • Industrial control and automation — Industrial-grade temperature range and a high logic count enable complex control algorithms, real-time processing and robust I/O handling.
  • Embedded system acceleration — Offload compute-intensive tasks to custom FPGA logic while using on-chip SRAM blocks and PLLs for synchronized, low-latency processing.

Unique Advantages

  • Nonvolatile, single-chip solution — Antifuse-based programming provides permanent configuration without external configuration memory.
  • High-capacity programmable logic — 1,000,000 equivalent gates and 18,144 logic elements support large, integrated designs and reduce the need for multiple devices.
  • Deterministic timing and clocking — Segmentable clocks and embedded PLLs enable precise, user-controllable timing for synchronized system designs.
  • Embedded memory with FIFO control — On-chip RAM blocks and FIFO logic simplify data buffering and width adaptation, reducing board-level memory requirements.
  • Flexible, high-speed I/O — Bank-selectable multi-voltage I/Os and LVDS-capable channels support a wide range of interface standards and high-speed links.
  • Industrial-grade robustness — Surface-mount 484‑BGA packaging, RoHS compliance and −40°C to 85°C operating range meet industrial deployment needs.

Why Choose AX1000-FG484I?

The AX1000-FG484I combines Microchip’s AX antifuse architecture with substantial logic capacity, embedded SRAM/FIFO resources and flexible high-speed I/O to deliver a deterministic, nonvolatile FPGA platform for industrial and embedded applications. Its combination of performance-oriented architecture, programmable clocking and on-chip memory makes it well suited for designers needing integrated data-paths, protocol handling and real-time processing in a single device.

With industrial temperature grading, a compact 484‑BGA surface-mount package and controlled core voltage range, the AX1000-FG484I provides a scalable, reliable building block for long-life fielded systems where consistent timing, security and throughput matter.

Request a quote or submit an inquiry to discuss availability and volume pricing for the AX1000-FG484I. Our team can provide technical details and support to help validate the device in your design.

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