AX1000-FG676I

IC FPGA 418 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

Quantity 1,795 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-FG676I – Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

The AX1000-FG676I is a Microchip Axcelerator-series antifuse FPGA built on the AX architecture. It provides a nonvolatile, single-chip programmable solution with on-chip embedded SRAM/FIFO control and system-level resources such as segmentable clocks and integrated PLLs.

Designed for designs that require high-performance programmable logic, deterministic timing and on-chip memory, this device delivers up to 1,000,000 equivalent system gates, 18,144 logic elements and a rich I/O complement for demanding embedded applications.

Key Features

  • Core Architecture  Antifuse-based Axcelerator architecture providing a single-chip, nonvolatile solution and deterministic timing characteristics.
  • Logic Capacity  Approximately 1,000,000 equivalent system gates implemented as 18,144 logic elements to support complex custom logic.
  • Embedded Memory  Approximately 0.166 Mbits (165,888 bits) of embedded SRAM/FIFO with programmable FIFO control and variable-aspect RAM blocks.
  • I/O and Interface Flexibility  418 user I/Os with multi-standard, bank-selectable I/O support including single-ended and differential standards and LVDS-capable channels (700 Mb/s listed in series benefits).
  • Clocking and PLL  Segmentable clock resources and embedded PLLs with a 14–200 MHz input range and frequency synthesis capabilities (series-level capability up to 1 GHz).
  • Performance Highlights  Series-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance as listed in the Axcelerator family documentation.
  • Power and Supply  Core supply operating range of 1.425 V to 1.575 V (centered around 1.5 V) for low-power core operation.
  • Package and Mounting  676-ball fine BGA (676-FBGA, 27 × 27) surface-mount package for high-density PCB integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to +85 °C, suitable for industrial-temperature applications.
  • Security & Reliability  FuseLock™ programming technology and single-chip nonvolatile antifuse implementation to protect designs against reverse engineering.
  • Standards & Testability  Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug support noted for the Axcelerator family.
  • Compliance  RoHS compliant.

Typical Applications

  • High-speed I/O and SerDes Front-ends  Use the device’s LVDS-capable I/Os and high I/O count for interfacing high-speed serial links and parallel data buses.
  • Embedded Memory and FIFO Control  Implement buffering, FIFO management and custom memory interfaces using the device’s embedded SRAM blocks and programmable FIFO logic.
  • Deterministic Logic and Timing Control  Leverage segmentable clocks and embedded PLLs for systems that require controlled clock domains and on-chip frequency synthesis.
  • Secure, Nonvolatile Custom Logic  Deploy permanent, antifuse-programmed logic where design security and nonvolatile configuration are required.

Unique Advantages

  • Nonvolatile, antifuse programmability: Protects design IP with a single-chip, permanently programmed solution.
  • High-density logic in a compact package: 1,000,000 equivalent system gates and 18,144 logic elements in a 676-FBGA footprint reduce board-level complexity.
  • On-chip embedded memory: Approximately 0.166 Mbits of SRAM/FIFO and programmable FIFO control reduce external memory requirements and simplify data buffering.
  • Flexible, multi-standard I/Os: Bank-selectable I/O standards and high-speed LVDS capability provide broad interface compatibility without external translation logic.
  • Industrial operating range: −40 °C to +85 °C rating supports deployment in industrial-temperature environments.
  • Deterministic clocking and PLLs: Segmentable clocks and on-chip PLLs enable precise timing control and frequency synthesis within system designs.

Why Choose AX1000-FG676I?

The AX1000-FG676I combines Microchip’s Axcelerator antifuse architecture with high logic density, embedded SRAM/FIFO resources and a broad, high-speed I/O set—delivering a nonvolatile FPGA option for designs that need durable configuration, deterministic timing and integrated memory. Its industrial temperature rating and RoHS compliance make it suitable for robust embedded systems requiring reliable operation across a wide thermal range.

This device is appropriate for engineers building systems that benefit from on-chip FIFO/memory, extensive I/O flexibility and secure, permanent configuration. Series-level capabilities such as segmentable clocks, PLLs and in-system diagnostic/debug features further support complex, high-performance designs.

Request a quote or submit a sales inquiry to receive pricing and availability information for the AX1000-FG676I. Detailed technical specifications are available in the manufacturer’s Axcelerator family documentation.

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