AX1000-FGG484I

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

Quantity 220 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-FGG484I – Axcelerator Field Programmable Gate Array (FPGA) IC, 317 I/Os, ~0.166 Mbits embedded RAM, 484-BGA

The AX1000-FGG484I is an Axcelerator family FPGA built on Microchip’s AX architecture and a CMOS antifuse process (0.15 µm, seven metal layers). This single-chip, nonvolatile FPGA combines substantial logic capacity, embedded SRAM/FIFO resources and flexible multi-standard I/Os for demanding industrial and communications-oriented designs.

Designed for applications that require deterministic timing, high-speed interfaces and robust operation, the device delivers high internal performance and integrated system features while operating across an industrial temperature range and low-voltage core supply.

Key Features

  • Core & Capacity — Approximately 1,000,000 equivalent system gates with 18,144 logic elements, enabling complex logic integration on a single device.
  • Embedded Memory & FIFOs — Approximately 0.166 Mbits (165,888 bits) of embedded SRAM organized across 36 core RAM blocks with programmable FIFO control logic for packet buffering and data staging.
  • High-Speed Performance — Datasheet-listed system and internal performance characteristics (350+ MHz system performance, 500+ MHz internal performance) for timing-critical designs.
  • I/O Flexibility — 317 user I/Os on this package; bank-selectable, mixed-voltage support (1.5V, 1.8V, 2.5V, 3.3V) and differential standards including LVDS with up to 700 Mb/s capable channels.
  • Clocking & PLLs — Segmentable clock resources and embedded PLLs (with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz) for precise clock domain management.
  • Nonvolatile Antifuse Technology — Single-chip, nonvolatile configuration for secure, stable operation without external configuration memory; FuseLock™ programming protects against reverse engineering.
  • Package & Thermal — 484-BGA (484-FPBGA, 23 × 23) surface-mount package; industrial grade operation from −40 °C to +85 °C.
  • Power — Core supply range specified at 1.425 V to 1.575 V to match the device’s low-voltage core requirements.
  • Diagnostics & Test — Deterministic timing, boundary-scan (IEEE 1149.1) support and in-system diagnostic/debug capability via Microchip Silicon Explorer II.
  • Compliance — RoHS-compliant.

Typical Applications

  • Industrial Control — Deterministic timing and industrial temperature grading make this FPGA suitable for motion control, PLC extensions and sensor aggregation where on-chip logic and embedded FIFOs reduce system complexity.
  • High-Speed Communications — Flexible I/O standards and LVDS capability up to 700 Mb/s combined with embedded FIFOs for line buffering enable protocol bridging, interface conversion and data-path acceleration.
  • Instrumentation & Test — High internal performance, programmable clocks and PLL frequency synthesis support precision timing, data acquisition front-ends and real-time signal processing tasks.
  • Secure Embedded Systems — Nonvolatile antifuse configuration and FuseLock programming technology provide a secure, single-chip solution for designs requiring protection against reverse engineering.

Unique Advantages

  • High Integration Density: One million equivalent gates and 18,144 logic elements reduce board-level component count and simplify system architecture.
  • Embedded Memory with FIFO Control: 165,888 bits of embedded SRAM and programmable FIFO logic provide deterministic buffering for packetized and streaming data flows.
  • Flexible, Mixed-Voltage I/Os: Bank-selectable I/O standards and multi-voltage operation ease interface compatibility across legacy and modern peripherals.
  • Deterministic Clocking: Segmentable clock resources and multiple PLLs enable precise control of clock domains for latency-sensitive applications.
  • Industrial Reliability: Surface-mount 484-BGA packaging combined with an industrial operating range (−40 °C to +85 °C) supports deployment in rugged environments.
  • Built-in Security & Diagnostics: Nonvolatile antifuse programming plus FuseLock and Silicon Explorer II diagnostics help protect design IP and accelerate in-system validation.

Why Choose AX1000-FGG484I?

The AX1000-FGG484I is positioned for customers who need a high-performance, nonvolatile FPGA with substantial on-chip memory and versatile I/O options in an industrial-grade package. Its combination of logic capacity, embedded SRAM/FIFO resources, high-speed I/O capability and deterministic clocking makes it a strong choice for communications, industrial automation and instrumentation designs that demand integration and predictable timing.

Choosing this Axcelerator device delivers a compact implementation path for complex systems—reducing BOM count, providing secure configuration and enabling precise timing and high-throughput data handling on a single, RoHS-compliant FPGA.

Request a quote or submit an inquiry for part number AX1000-FGG484I to check pricing, availability and delivery options.

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