AX1000-FGG484I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA |
|---|---|
| Quantity | 220 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-FGG484I – Axcelerator Field Programmable Gate Array (FPGA) IC, 317 I/Os, ~0.166 Mbits embedded RAM, 484-BGA
The AX1000-FGG484I is an Axcelerator family FPGA built on Microchip’s AX architecture and a CMOS antifuse process (0.15 µm, seven metal layers). This single-chip, nonvolatile FPGA combines substantial logic capacity, embedded SRAM/FIFO resources and flexible multi-standard I/Os for demanding industrial and communications-oriented designs.
Designed for applications that require deterministic timing, high-speed interfaces and robust operation, the device delivers high internal performance and integrated system features while operating across an industrial temperature range and low-voltage core supply.
Key Features
- Core & Capacity — Approximately 1,000,000 equivalent system gates with 18,144 logic elements, enabling complex logic integration on a single device.
- Embedded Memory & FIFOs — Approximately 0.166 Mbits (165,888 bits) of embedded SRAM organized across 36 core RAM blocks with programmable FIFO control logic for packet buffering and data staging.
- High-Speed Performance — Datasheet-listed system and internal performance characteristics (350+ MHz system performance, 500+ MHz internal performance) for timing-critical designs.
- I/O Flexibility — 317 user I/Os on this package; bank-selectable, mixed-voltage support (1.5V, 1.8V, 2.5V, 3.3V) and differential standards including LVDS with up to 700 Mb/s capable channels.
- Clocking & PLLs — Segmentable clock resources and embedded PLLs (with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz) for precise clock domain management.
- Nonvolatile Antifuse Technology — Single-chip, nonvolatile configuration for secure, stable operation without external configuration memory; FuseLock™ programming protects against reverse engineering.
- Package & Thermal — 484-BGA (484-FPBGA, 23 × 23) surface-mount package; industrial grade operation from −40 °C to +85 °C.
- Power — Core supply range specified at 1.425 V to 1.575 V to match the device’s low-voltage core requirements.
- Diagnostics & Test — Deterministic timing, boundary-scan (IEEE 1149.1) support and in-system diagnostic/debug capability via Microchip Silicon Explorer II.
- Compliance — RoHS-compliant.
Typical Applications
- Industrial Control — Deterministic timing and industrial temperature grading make this FPGA suitable for motion control, PLC extensions and sensor aggregation where on-chip logic and embedded FIFOs reduce system complexity.
- High-Speed Communications — Flexible I/O standards and LVDS capability up to 700 Mb/s combined with embedded FIFOs for line buffering enable protocol bridging, interface conversion and data-path acceleration.
- Instrumentation & Test — High internal performance, programmable clocks and PLL frequency synthesis support precision timing, data acquisition front-ends and real-time signal processing tasks.
- Secure Embedded Systems — Nonvolatile antifuse configuration and FuseLock programming technology provide a secure, single-chip solution for designs requiring protection against reverse engineering.
Unique Advantages
- High Integration Density: One million equivalent gates and 18,144 logic elements reduce board-level component count and simplify system architecture.
- Embedded Memory with FIFO Control: 165,888 bits of embedded SRAM and programmable FIFO logic provide deterministic buffering for packetized and streaming data flows.
- Flexible, Mixed-Voltage I/Os: Bank-selectable I/O standards and multi-voltage operation ease interface compatibility across legacy and modern peripherals.
- Deterministic Clocking: Segmentable clock resources and multiple PLLs enable precise control of clock domains for latency-sensitive applications.
- Industrial Reliability: Surface-mount 484-BGA packaging combined with an industrial operating range (−40 °C to +85 °C) supports deployment in rugged environments.
- Built-in Security & Diagnostics: Nonvolatile antifuse programming plus FuseLock and Silicon Explorer II diagnostics help protect design IP and accelerate in-system validation.
Why Choose AX1000-FGG484I?
The AX1000-FGG484I is positioned for customers who need a high-performance, nonvolatile FPGA with substantial on-chip memory and versatile I/O options in an industrial-grade package. Its combination of logic capacity, embedded SRAM/FIFO resources, high-speed I/O capability and deterministic clocking makes it a strong choice for communications, industrial automation and instrumentation designs that demand integration and predictable timing.
Choosing this Axcelerator device delivers a compact implementation path for complex systems—reducing BOM count, providing secure configuration and enabling precise timing and high-throughput data handling on a single, RoHS-compliant FPGA.
Request a quote or submit an inquiry for part number AX1000-FGG484I to check pricing, availability and delivery options.

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