AX1000-FGG676

IC FPGA 418 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

Quantity 1,443 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case676-BGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-FGG676 – Axcelerator FPGA IC, 1,000,000 gates, 676-FBGA (27×27)

The AX1000-FGG676 is an Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX architecture and CMOS antifuse programming technology. It delivers a single-chip, nonvolatile FPGA solution that combines high internal performance, flexible multi-standard I/Os and embedded memory to address demanding digital system designs.

Designed for commercial-temperature applications, the device targets high-performance digital systems that require deterministic timing, on-chip buffering and secure, one-time programmable logic in a surface-mount 676-FBGA (27×27) package.

Key Features

  • Core Capacity — Approximately 1,000,000 equivalent system gates with 18,144 logic elements, providing substantial programmable logic density for complex designs.
  • Embedded Memory — Total on-chip embedded memory of 165,888 bits (approximately 0.166 Mbits) with variable-aspect RAM blocks and programmable FIFO control logic for buffering and data staging.
  • High Performance — System performance exceeding 350+ MHz and internal performance above 500+ MHz as specified for Axcelerator devices, plus high-performance embedded FIFOs.
  • Flexible I/O — 418 user I/Os, bank-selectable multi‑voltage operation (1.5V, 1.8V, 2.5V, 3.3V), support for single-ended and differential standards including LVDS and LVPECL, and 700 Mb/s LVDS-capable I/Os.
  • Programmable Clocking — Segmentable clock resources and embedded phase-locked loop (PLL) with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for precise clock management.
  • Secure, Nonvolatile Programming — Antifuse-based single-chip nonvolatile architecture with FuseLock programming technology to help protect against reverse engineering and design theft.
  • Package & Mounting — 676-FBGA (27×27) / 676-BGA package, surface-mount mounting for compact board integration; RoHS compliant.
  • Power & Temperature — Core supply voltage range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 70 °C.
  • Debug & Test — Deterministic, user-controllable timing with boundary-scan (IEEE 1149.1) and in-system diagnostic capability with Microchip Silicon Explorer II.

Typical Applications

  • High-speed data interfaces — Use the device’s 700 Mb/s LVDS-capable I/Os and embedded FIFOs for protocol bridging, serialization/deserialization and interface termination in high-throughput designs.
  • Packet buffering and data processing — Embedded SRAM/FIFO and programmable FIFO control logic enable on-chip buffering for packet handling and streaming data applications.
  • Timing-critical digital systems — Segmentable clocks and an on-chip PLL (14–200 MHz input, up to 1 GHz synthesis) support deterministic timing and clock synthesis for synchronous designs.
  • Secure, nonvolatile logic — Antifuse programming and FuseLock technology provide a single-chip, tamper-resistant implementation for designs where IP protection and one-time programmable logic are required.

Unique Advantages

  • High raw logic density: 1,000,000 equivalent gates and 18,144 logic elements let you implement large, complex functions on a single device, reducing board-level integration.
  • Embedded memory with FIFO control: 165,888 bits of on-chip RAM and programmable FIFO logic simplify buffering and streaming data paths without external memory.
  • Multi-standard, bank-selectable I/Os: Support for multiple voltage levels and differential standards provides interface flexibility and reduces the need for level-shifters.
  • Deterministic clocking and PLL synthesis: Segmentable clocks and a wide-range PLL support precise timing architectures and flexible frequency generation.
  • Nonvolatile, secure programming: Antifuse-based single-chip solution with FuseLock technology protects design IP and removes the need for external configuration devices.
  • Production-ready package: Surface-mount 676-FBGA (27×27) packaging provides a compact footprint for high-density board designs while remaining RoHS compliant.

Why Choose AX1000-FGG676?

The AX1000-FGG676 positions itself as a high-density, nonvolatile FPGA option for commercial-temperature systems that demand substantial logic capacity, deterministic timing and flexible high-speed I/O. Its combination of 1,000,000 equivalent gates, embedded SRAM/FIFO resources and programmable clocking makes it suitable for designs that require on-chip buffering, timing control and secure one-time programmable logic.

Backed by Microchip’s Axcelerator architecture and in-system diagnostic support, the AX1000-FGG676 offers a balance of performance, integration and IP protection for design teams targeting compact, high-performance digital systems with single-chip nonvolatile programmability.

Request a quote or submit a sales inquiry to obtain availability, lead times and pricing for the AX1000-FGG676.

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