AX1000-FGG676
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA |
|---|---|
| Quantity | 1,443 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 418 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-FGG676 – Axcelerator FPGA IC, 1,000,000 gates, 676-FBGA (27×27)
The AX1000-FGG676 is an Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX architecture and CMOS antifuse programming technology. It delivers a single-chip, nonvolatile FPGA solution that combines high internal performance, flexible multi-standard I/Os and embedded memory to address demanding digital system designs.
Designed for commercial-temperature applications, the device targets high-performance digital systems that require deterministic timing, on-chip buffering and secure, one-time programmable logic in a surface-mount 676-FBGA (27×27) package.
Key Features
- Core Capacity — Approximately 1,000,000 equivalent system gates with 18,144 logic elements, providing substantial programmable logic density for complex designs.
- Embedded Memory — Total on-chip embedded memory of 165,888 bits (approximately 0.166 Mbits) with variable-aspect RAM blocks and programmable FIFO control logic for buffering and data staging.
- High Performance — System performance exceeding 350+ MHz and internal performance above 500+ MHz as specified for Axcelerator devices, plus high-performance embedded FIFOs.
- Flexible I/O — 418 user I/Os, bank-selectable multi‑voltage operation (1.5V, 1.8V, 2.5V, 3.3V), support for single-ended and differential standards including LVDS and LVPECL, and 700 Mb/s LVDS-capable I/Os.
- Programmable Clocking — Segmentable clock resources and embedded phase-locked loop (PLL) with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for precise clock management.
- Secure, Nonvolatile Programming — Antifuse-based single-chip nonvolatile architecture with FuseLock programming technology to help protect against reverse engineering and design theft.
- Package & Mounting — 676-FBGA (27×27) / 676-BGA package, surface-mount mounting for compact board integration; RoHS compliant.
- Power & Temperature — Core supply voltage range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 70 °C.
- Debug & Test — Deterministic, user-controllable timing with boundary-scan (IEEE 1149.1) and in-system diagnostic capability with Microchip Silicon Explorer II.
Typical Applications
- High-speed data interfaces — Use the device’s 700 Mb/s LVDS-capable I/Os and embedded FIFOs for protocol bridging, serialization/deserialization and interface termination in high-throughput designs.
- Packet buffering and data processing — Embedded SRAM/FIFO and programmable FIFO control logic enable on-chip buffering for packet handling and streaming data applications.
- Timing-critical digital systems — Segmentable clocks and an on-chip PLL (14–200 MHz input, up to 1 GHz synthesis) support deterministic timing and clock synthesis for synchronous designs.
- Secure, nonvolatile logic — Antifuse programming and FuseLock technology provide a single-chip, tamper-resistant implementation for designs where IP protection and one-time programmable logic are required.
Unique Advantages
- High raw logic density: 1,000,000 equivalent gates and 18,144 logic elements let you implement large, complex functions on a single device, reducing board-level integration.
- Embedded memory with FIFO control: 165,888 bits of on-chip RAM and programmable FIFO logic simplify buffering and streaming data paths without external memory.
- Multi-standard, bank-selectable I/Os: Support for multiple voltage levels and differential standards provides interface flexibility and reduces the need for level-shifters.
- Deterministic clocking and PLL synthesis: Segmentable clocks and a wide-range PLL support precise timing architectures and flexible frequency generation.
- Nonvolatile, secure programming: Antifuse-based single-chip solution with FuseLock technology protects design IP and removes the need for external configuration devices.
- Production-ready package: Surface-mount 676-FBGA (27×27) packaging provides a compact footprint for high-density board designs while remaining RoHS compliant.
Why Choose AX1000-FGG676?
The AX1000-FGG676 positions itself as a high-density, nonvolatile FPGA option for commercial-temperature systems that demand substantial logic capacity, deterministic timing and flexible high-speed I/O. Its combination of 1,000,000 equivalent gates, embedded SRAM/FIFO resources and programmable clocking makes it suitable for designs that require on-chip buffering, timing control and secure one-time programmable logic.
Backed by Microchip’s Axcelerator architecture and in-system diagnostic support, the AX1000-FGG676 offers a balance of performance, integration and IP protection for design teams targeting compact, high-performance digital systems with single-chip nonvolatile programmability.
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