AX1000-FGG896M

The AX1000-FGG896M is a Microchip Axcelerator antifuse FPGA built on the AX architecture. It delivers a single-chip, nonvolatile FPGA solution with 1,000,000 equivalent system gates and 18,144 logic elements for demanding, security-conscious embedded designs.

Designed for applications that require high I/O density, deterministic timing and military-grade environmental performance, this device combines high-speed internal performance, integrated memory/FIFO resources and extensive I/O flexibility into a 896-ball BGA package.

Key Features

• Core Capacity — 1,000,000 equivalent system gates and 18,144 logic elements provide substantial programmable logic for complex designs.
• Embedded Memory & FIFOs — Approximately 0.166 Mbits (165,888 bits) of embedded SRAM with programmable FIFO control logic and width-configurable read/write ports for buffering and data-path functions.
• High Performance — System-level performance greater than 350 MHz and internal performance greater than 500 MHz, enabling high-speed logic and data processing.
• I/O Density & Flexibility — 516 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and differential/single-ended standards support; LVDS-capable I/Os up to 700 Mb/s.
• Clocking & PLL — Segmentable clock resources and embedded PLLs with 14–200 MHz input range and frequency synthesis capability up to 1 GHz for flexible clock management.
• Nonvolatile Antifuse Technology — Single-chip, nonvolatile programming with FuseLock™ protection to guard against reverse engineering and protect design IP.
• Deterministic Timing & Diagnostics — Deterministic, user-controllable timing and in-system diagnostic/debug capabilities (Microchip Silicon Explorer II) plus JTAG boundary-scan (IEEE 1149.1) support.
• Package & Mounting — 896-BGA surface-mount package (supplier package: 896-FBGA, 31 × 31 mm) for high-pin-count board designs.
• Power & Environmental — Core supply 1.425–1.575 V (1.5 V core), RoHS-compliant, and rated for military temperature range from −55 °C to 125 °C.

Typical Applications

• Defense & Aerospace Systems — Military-grade temperature range and antifuse nonvolatile security make the AX1000 suitable for secure, high-reliability electronics used in defense and aerospace platforms.
• High-Speed Communications — High internal performance, LVDS-capable I/Os and embedded FIFOs support data-path routing, protocol handling and interface bridging in communication equipment.
• Signal Processing & Embedded Compute — Large logic capacity and embedded RAM enable complex signal-processing algorithms, buffering and real-time data manipulation.

Unique Advantages

• Nonvolatile, IP-Protecting Programming: Antifuse-based single-chip programming with FuseLock™ helps secure designs against reverse engineering.
• High I/O Count with Mixed-Voltage Support: 516 user I/Os with bank-selectable mixed-voltage operation simplifies interface integration and reduces level-shifting needs.
• Deterministic Performance: Deterministic timing and embedded PLLs deliver predictable timing behavior for latency-sensitive applications.
• Built-in Memory & FIFO Control: On-chip SRAM blocks and programmable FIFO logic reduce external memory dependencies and simplify buffer management.
• Military Temperature Qualification: Rated for −55 °C to 125 °C to meet stringent environmental requirements for defense and harsh-environment systems.
• Comprehensive Diagnostics: In-system diagnostic and debug capability and JTAG boundary-scan support streamline bring-up and failure analysis.

Why Choose AX1000-FGG896M?

The AX1000-FGG896M positions itself where high logic capacity, extensive I/O and security converge with rugged environmental capability. Its antifuse nonvolatile architecture and FuseLock programming are particularly valuable for applications that require design security and permanent field-programmed configurations.

This device is ideal for engineers developing high-performance communications, signal-processing and defense-grade embedded systems that demand deterministic timing, integrated memory/FIFO resources and robust thermal performance. Backed by Microchip’s Axcelerator architecture and diagnostic tooling, it offers a scalable, secure platform for long-lived, high-reliability deployments.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the AX1000-FGG896M.