AX1000-FGG676I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA |
|---|---|
| Quantity | 436 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 418 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-FGG676I – Axcelerator Field Programmable Gate Array, 1,000,000 gates, 676‑BGA
The AX1000-FGG676I is an Axcelerator family FPGA from Microchip Technology built on the AX antifuse architecture. This single‑chip, nonvolatile FPGA delivers high-density programmable logic—approximately 1,000,000 equivalent system gates—with 18,144 logic elements and embedded SRAM/FIFO resources for complex, deterministic designs.
Designed for industrial applications, the device combines high performance (350+ MHz system, 500+ MHz internal), flexible multi‑standard I/Os and on‑chip memory to address high‑speed data processing, communications, and embedded control applications that require robust, nonvolatile programmable logic.
Key Features
- Core Architecture Antifuse-based AX architecture providing a single‑chip, nonvolatile solution with up to 1,000,000 equivalent system gates and 18,144 logic elements.
- Embedded Memory & FIFOs 165,888 total on‑chip RAM bits (approximately 0.166 Mbits) organized in variable-aspect RAM blocks with embedded FIFO control logic for efficient buffering and data flow.
- I/O Capacity & Standards 418 user I/Os with support for bank‑selectable, mixed-voltage operation and high‑speed interfaces; datasheet references LVDS capable I/Os at up to 700 Mb/s and broad multi‑standard I/O support.
- Clocking & PLL Segmentable clock resources and an embedded PLL with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for flexible clock management.
- Performance Documented system performance of 350+ MHz and internal performance of 500+ MHz to support demanding timing requirements.
- Power & Supply Core supply voltage range specified at 1.425 V to 1.575 V (nominal 1.5 V) for low‑power core operation.
- Package & Mounting 676‑FBGA (27 × 27 mm) fine‑pitch BGA, surface‑mount package suitable for compact, board‑level integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 85 °C for industrial environments.
- Design Security & Test Antifuse programming technology and FuseLock™ protection for IP security, plus IEEE 1149.1 (JTAG) boundary‑scan support and unique in‑system diagnostic capabilities.
- Compliance RoHS compliant.
Typical Applications
- High‑speed data transport and networking — Use the AX1000's high I/O count and LVDS‑capable interfaces for line‑rate protocol handling, serialization/deserialization, and packet processing.
- Signal processing and buffering — Embedded SRAM and FIFO control logic enable efficient streaming data paths and on‑chip buffering for DSP and real‑time processing blocks.
- Industrial automation and control — Industrial temperature rating and dense programmable logic suit complex motor control, machine vision pre‑processing, and centralized control fabrics.
- Custom embedded systems — High gate count and plentiful logic elements support application‑specific acceleration, protocol bridging, and glue logic consolidation.
Unique Advantages
- Nonvolatile single‑chip solution: Antifuse technology provides persistent configuration without external configuration memory, simplifying power‑up behavior and system design.
- High logic and memory density: 1,000,000 equivalent gates with 18,144 logic elements and 165,888 bits of embedded RAM support large, integrated designs on one device.
- High‑performance timing: 350+ MHz system and 500+ MHz internal performance enable demanding timing and throughput requirements.
- Flexible I/O and standards support: Bank‑selectable, mixed‑voltage I/Os and support for differential and single‑ended standards offer design flexibility across interfaces.
- Industrial readiness: Specified operating range of −40 °C to 85 °C and surface‑mount 676‑FBGA packaging for robust deployment in industrial systems.
- On‑chip clock synthesis and diagnostics: Integrated PLL and in‑system diagnostic/debug capabilities streamline clocking schemes and facilitate development and bring‑up.
Why Choose AX1000-FGG676I?
The AX1000-FGG676I positions itself where high density, nonvolatile configurability and industrial robustness are required. Its combination of approximately 1,000,000 equivalent gates, substantial embedded RAM, and high I/O count enables consolidation of complex functions onto a single FPGA, reducing component count and simplifying system architectures.
This device is well suited for engineering teams building high‑performance embedded systems, communications hardware, and industrial controllers that need deterministic timing, on‑chip memory buffering, and a secure, nonvolatile programmable fabric backed by Microchip’s Axcelerator family features.
Request a quote or submit an inquiry to discuss availability, lead times, and how AX1000‑FGG676I can be integrated into your next design.

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