AX1000-FGG676I

IC FPGA 418 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

Quantity 436 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-FGG676I – Axcelerator Field Programmable Gate Array, 1,000,000 gates, 676‑BGA

The AX1000-FGG676I is an Axcelerator family FPGA from Microchip Technology built on the AX antifuse architecture. This single‑chip, nonvolatile FPGA delivers high-density programmable logic—approximately 1,000,000 equivalent system gates—with 18,144 logic elements and embedded SRAM/FIFO resources for complex, deterministic designs.

Designed for industrial applications, the device combines high performance (350+ MHz system, 500+ MHz internal), flexible multi‑standard I/Os and on‑chip memory to address high‑speed data processing, communications, and embedded control applications that require robust, nonvolatile programmable logic.

Key Features

  • Core Architecture Antifuse-based AX architecture providing a single‑chip, nonvolatile solution with up to 1,000,000 equivalent system gates and 18,144 logic elements.
  • Embedded Memory & FIFOs 165,888 total on‑chip RAM bits (approximately 0.166 Mbits) organized in variable-aspect RAM blocks with embedded FIFO control logic for efficient buffering and data flow.
  • I/O Capacity & Standards 418 user I/Os with support for bank‑selectable, mixed-voltage operation and high‑speed interfaces; datasheet references LVDS capable I/Os at up to 700 Mb/s and broad multi‑standard I/O support.
  • Clocking & PLL Segmentable clock resources and an embedded PLL with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for flexible clock management.
  • Performance Documented system performance of 350+ MHz and internal performance of 500+ MHz to support demanding timing requirements.
  • Power & Supply Core supply voltage range specified at 1.425 V to 1.575 V (nominal 1.5 V) for low‑power core operation.
  • Package & Mounting 676‑FBGA (27 × 27 mm) fine‑pitch BGA, surface‑mount package suitable for compact, board‑level integration.
  • Industrial Temperature Grade Rated for operation from −40 °C to 85 °C for industrial environments.
  • Design Security & Test Antifuse programming technology and FuseLock™ protection for IP security, plus IEEE 1149.1 (JTAG) boundary‑scan support and unique in‑system diagnostic capabilities.
  • Compliance RoHS compliant.

Typical Applications

  • High‑speed data transport and networking — Use the AX1000's high I/O count and LVDS‑capable interfaces for line‑rate protocol handling, serialization/deserialization, and packet processing.
  • Signal processing and buffering — Embedded SRAM and FIFO control logic enable efficient streaming data paths and on‑chip buffering for DSP and real‑time processing blocks.
  • Industrial automation and control — Industrial temperature rating and dense programmable logic suit complex motor control, machine vision pre‑processing, and centralized control fabrics.
  • Custom embedded systems — High gate count and plentiful logic elements support application‑specific acceleration, protocol bridging, and glue logic consolidation.

Unique Advantages

  • Nonvolatile single‑chip solution: Antifuse technology provides persistent configuration without external configuration memory, simplifying power‑up behavior and system design.
  • High logic and memory density: 1,000,000 equivalent gates with 18,144 logic elements and 165,888 bits of embedded RAM support large, integrated designs on one device.
  • High‑performance timing: 350+ MHz system and 500+ MHz internal performance enable demanding timing and throughput requirements.
  • Flexible I/O and standards support: Bank‑selectable, mixed‑voltage I/Os and support for differential and single‑ended standards offer design flexibility across interfaces.
  • Industrial readiness: Specified operating range of −40 °C to 85 °C and surface‑mount 676‑FBGA packaging for robust deployment in industrial systems.
  • On‑chip clock synthesis and diagnostics: Integrated PLL and in‑system diagnostic/debug capabilities streamline clocking schemes and facilitate development and bring‑up.

Why Choose AX1000-FGG676I?

The AX1000-FGG676I positions itself where high density, nonvolatile configurability and industrial robustness are required. Its combination of approximately 1,000,000 equivalent gates, substantial embedded RAM, and high I/O count enables consolidation of complex functions onto a single FPGA, reducing component count and simplifying system architectures.

This device is well suited for engineering teams building high‑performance embedded systems, communications hardware, and industrial controllers that need deterministic timing, on‑chip memory buffering, and a secure, nonvolatile programmable fabric backed by Microchip’s Axcelerator family features.

Request a quote or submit an inquiry to discuss availability, lead times, and how AX1000‑FGG676I can be integrated into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up