AX1000-FGG484M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA |
|---|---|
| Quantity | 1,395 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 317 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-FGG484M – Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA
The AX1000-FGG484M is an Axcelerator family antifuse FPGA from Microchip Technology based on the AX architecture. It delivers a single-chip, nonvolatile solution combining algorithmic density, embedded memory/FIFO capability and high-performance I/O suitable for applications that require design security and deterministic timing.
Targeted at high-reliability and secure systems, this military-grade device provides up to 1,000,000 equivalent system gates with on-chip embedded SRAM/FIFO and a rich set of programmable I/O features for high-speed data interfaces and embedded processing tasks.
Key Features
- Core Capacity — 1,000,000 equivalent system gates and 18,144 logic elements provide substantial programmable logic resources for complex designs.
- Embedded Memory — 165,888 total RAM bits (approximately 0.166 Mbits) of on-chip SRAM/FIFO with variable-aspect RAM blocks and embedded FIFO control logic.
- High-performance I/Os — 317 user I/Os with support for multi-standard, bank-selectable I/O and LVDS-capable interfaces up to 700 Mb/s (family capability).
- Performance and Clocking — Family-level performance figures include 350+ MHz system performance, 500+ MHz internal performance, segmentable clock resources and an embedded PLL with 14–200 MHz input range and frequency synthesis up to 1 GHz.
- Nonvolatile, Secure Programming — Antifuse-based single-chip nonvolatile solution with FuseLock programming technology to protect against reverse engineering and design theft.
- Package and Mounting — 484-ball Fine PBGA (484-FPBGA, 23 × 23) surface-mount package in a 484-BGA footprint suited for compact, board-level integration.
- Power and Operating Range — Core supply 1.425 V to 1.575 V; military-grade operating temperature range of -55 °C to 125 °C for demanding environments.
- Standards and Tools — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II (family features).
- Compliance — RoHS-compliant.
Typical Applications
- Secure Military Communications — Antifuse nonvolatile programming and FuseLock protection help safeguard IP in secure communication and defense systems operating across -55 °C to 125 °C.
- High-Speed Data Interfaces — LVDS-capable I/Os and high internal performance support high-throughput serial and parallel data processing tasks.
- Embedded Signal Processing — Large logic capacity and on-chip SRAM/FIFO enable implementation of real-time signal processing and buffering functions.
- Deterministic Control Systems — Segmentable clocks, deterministic timing and embedded PLLs make the device suitable for systems that require precise timing and synchronization.
Unique Advantages
- Nonvolatile, One-Time Programmable Security: Antifuse architecture with FuseLock programming technology protects designs against reverse engineering and IP theft.
- High Logic Density: One million equivalent gates and 18,144 logic elements allow consolidation of complex functions onto a single device, reducing board-level BOM.
- On-Chip Memory and FIFOs: Approximately 0.166 Mbits of embedded SRAM/FIFO and configurable RAM block organizations streamline data buffering and memory-intensive tasks.
- Robust I/O Flexibility: Bank-selectable, multi-standard I/Os and LVDS capability support a broad range of interface standards and high-speed signaling.
- Wide Operating Range: Military-grade temperature rating (-55 °C to 125 °C) and RoHS compliance ensure suitability for demanding environments while meeting regulatory requirements.
- Deterministic Timing and Clocking: Segmentable clocks and an embedded PLL with broad input range provide timing control for synchronized system designs.
Why Choose AX1000-FGG484M?
The AX1000-FGG484M combines antifuse nonvolatile programming, substantial logic capacity and embedded memory to address secure, high-performance embedded systems. Its military-grade temperature range and surface-mount 484-FPBGA package make it appropriate for rugged applications where long-term reliability and IP protection are priorities.
For designs that require deterministic timing, flexible high-speed I/O and a single-chip nonvolatile solution, this Axcelerator device provides a tightly integrated option that reduces system complexity while maintaining strong security and performance characteristics.
Request a quote or submit a pricing and availability inquiry to get more information about AX1000-FGG484M and how it can fit your next design.

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