AX1000-FGG484M

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

Quantity 1,395 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-FGG484M – Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

The AX1000-FGG484M is an Axcelerator family antifuse FPGA from Microchip Technology based on the AX architecture. It delivers a single-chip, nonvolatile solution combining algorithmic density, embedded memory/FIFO capability and high-performance I/O suitable for applications that require design security and deterministic timing.

Targeted at high-reliability and secure systems, this military-grade device provides up to 1,000,000 equivalent system gates with on-chip embedded SRAM/FIFO and a rich set of programmable I/O features for high-speed data interfaces and embedded processing tasks.

Key Features

  • Core Capacity — 1,000,000 equivalent system gates and 18,144 logic elements provide substantial programmable logic resources for complex designs.
  • Embedded Memory — 165,888 total RAM bits (approximately 0.166 Mbits) of on-chip SRAM/FIFO with variable-aspect RAM blocks and embedded FIFO control logic.
  • High-performance I/Os — 317 user I/Os with support for multi-standard, bank-selectable I/O and LVDS-capable interfaces up to 700 Mb/s (family capability).
  • Performance and Clocking — Family-level performance figures include 350+ MHz system performance, 500+ MHz internal performance, segmentable clock resources and an embedded PLL with 14–200 MHz input range and frequency synthesis up to 1 GHz.
  • Nonvolatile, Secure Programming — Antifuse-based single-chip nonvolatile solution with FuseLock programming technology to protect against reverse engineering and design theft.
  • Package and Mounting — 484-ball Fine PBGA (484-FPBGA, 23 × 23) surface-mount package in a 484-BGA footprint suited for compact, board-level integration.
  • Power and Operating Range — Core supply 1.425 V to 1.575 V; military-grade operating temperature range of -55 °C to 125 °C for demanding environments.
  • Standards and Tools — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II (family features).
  • Compliance — RoHS-compliant.

Typical Applications

  • Secure Military Communications — Antifuse nonvolatile programming and FuseLock protection help safeguard IP in secure communication and defense systems operating across -55 °C to 125 °C.
  • High-Speed Data Interfaces — LVDS-capable I/Os and high internal performance support high-throughput serial and parallel data processing tasks.
  • Embedded Signal Processing — Large logic capacity and on-chip SRAM/FIFO enable implementation of real-time signal processing and buffering functions.
  • Deterministic Control Systems — Segmentable clocks, deterministic timing and embedded PLLs make the device suitable for systems that require precise timing and synchronization.

Unique Advantages

  • Nonvolatile, One-Time Programmable Security: Antifuse architecture with FuseLock programming technology protects designs against reverse engineering and IP theft.
  • High Logic Density: One million equivalent gates and 18,144 logic elements allow consolidation of complex functions onto a single device, reducing board-level BOM.
  • On-Chip Memory and FIFOs: Approximately 0.166 Mbits of embedded SRAM/FIFO and configurable RAM block organizations streamline data buffering and memory-intensive tasks.
  • Robust I/O Flexibility: Bank-selectable, multi-standard I/Os and LVDS capability support a broad range of interface standards and high-speed signaling.
  • Wide Operating Range: Military-grade temperature rating (-55 °C to 125 °C) and RoHS compliance ensure suitability for demanding environments while meeting regulatory requirements.
  • Deterministic Timing and Clocking: Segmentable clocks and an embedded PLL with broad input range provide timing control for synchronized system designs.

Why Choose AX1000-FGG484M?

The AX1000-FGG484M combines antifuse nonvolatile programming, substantial logic capacity and embedded memory to address secure, high-performance embedded systems. Its military-grade temperature range and surface-mount 484-FPBGA package make it appropriate for rugged applications where long-term reliability and IP protection are priorities.

For designs that require deterministic timing, flexible high-speed I/O and a single-chip nonvolatile solution, this Axcelerator device provides a tightly integrated option that reduces system complexity while maintaining strong security and performance characteristics.

Request a quote or submit a pricing and availability inquiry to get more information about AX1000-FGG484M and how it can fit your next design.

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