AX1000-FGG676M

The AX1000-FGG676M is a Microchip Axcelerator antifuse FPGA based on the AX architecture, offering a single-chip, nonvolatile solution with deterministic timing and on-chip embedded memory. Designed for high-performance and secure applications, this device delivers 1,000,000 equivalent system gates, 18,144 logic elements, and 165,888 bits of embedded RAM/FIFO for demanding signal processing, communications, and defense-grade systems.

With segmentable clock resources, on-chip PLLs, and flexible multi-standard I/Os, the AX1000-FGG676M targets systems that require high throughput, robust I/O options, and operation across a wide military temperature range.

Key Features

• Core Capacity — 1,000,000 equivalent system gates and 18,144 logic elements provide substantial programmable logic for complex designs.
• Embedded Memory — 165,888 total RAM bits (approximately 0.166 Mbits) with variable-aspect RAM blocks and embedded FIFO control logic for buffering and packet handling.
• I/O Density & Standards — 418 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and high-speed differential interfaces including LVDS and LVPECL capability up to 700 Mb/s.
• Performance — System performance above 350 MHz and internal performance above 500 MHz as described for the Axcelerator family.
• Clocking & PLLs — Segmentable clock resources and embedded PLLs supporting 14–200 MHz input range and frequency synthesis up to 1 GHz for flexible timing architectures.
• Security & Nonvolatile Programming — Antifuse, single‑chip nonvolatile programming technology with FuseLock™ to protect designs against reverse engineering.
• Power — Low-voltage core operation specified at 1.425 V to 1.575 V for reduced core power.
• Package & Mounting — 676-ball Fine BGA (27 × 27) surface-mount package (676-FBGA) for high-density board integration.
• Temperature & Grade — Military grade with operating range from −55 °C to +125 °C, suitable for rugged and defense applications.
• Standards & Test — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II.
• Environmental — RoHS-compliant.

Typical Applications

• Defense and Aerospace Systems — Military-grade temperature range and antifuse nonvolatile programming suit rugged, long-life electronic subsystems requiring secure, tamper-resistant logic.
• High-Speed Communications — Embedded FIFOs, high I/O count, and LVDS-capable interfaces support packet buffering, protocol bridging, and high-throughput data paths.
• Signal Processing — Large logic capacity and fast internal performance enable DSP front-ends, custom data path accelerators, and specialized processing engines.
• Telecom & Infrastructure — Deterministic timing, PLL-based clock synthesis, and multi-standard I/Os support timing-critical network equipment and backplane interfaces.

Unique Advantages

• Nonvolatile Antifuse Architecture: Eliminates the need for external configuration memory and delivers one-time programmable, tamper-resistant logic for secure deployments.
• High Logic and Memory Integration: Combines 1,000,000 gates with 165,888 bits of embedded RAM/FIFO to reduce external component count and simplify board design.
• Robust I/O Flexibility: Mixed-voltage, bank-selectable I/Os and high-speed LVDS capability provide adaptability across interface standards without added interface chips.
• Designed for Deterministic Systems: Segmentable clocks and on-chip PLLs enable tight timing control and predictable performance for latency-sensitive applications.
• Rugged Temperature Range: Military-grade operation from −55 °C to +125 °C supports deployment in harsh environments where reliability is critical.
• Security Features: FuseLock™ programming technology and single-chip nonvolatile configuration reduce risk of reverse engineering and protect IP.

Why Choose AX1000-FGG676M?

The AX1000-FGG676M is positioned as a high-capacity, secure, and high-performance antifuse FPGA for applications that require robust logic resources, on-chip RAM/FIFO, and a wide operating temperature range. Its combination of 1,000,000 equivalent gates, 18,144 logic elements, flexible high-speed I/Os, and deterministic clocking makes it suitable for defense, communications, and infrastructure designs that demand longevity and in-field security.

Choosing this device provides long-term value through a single-chip nonvolatile solution that reduces BOM complexity, supports demanding timing and I/O requirements, and is backed by architectural features such as embedded PLLs, extensive RAM/FIFO capabilities, and in-system diagnostic tools.

Request a quote or submit an RFQ to obtain pricing, availability, and lead-time information for the AX1000-FGG676M. Our team can provide technical details and support to help evaluate this device for your design requirements.