AX2000-1CGS624M

IC FPGA 418 I/O 624CCGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 294912 624-BCCGA

Quantity 817 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time48 Weeks
Datasheet

Specifications & Environmental

Device Package624-CCGA (32.5x32.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case624-BCCGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodThrough HoleRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-1CGS624M – Axcelerator Field Programmable Gate Array (FPGA) IC 418 294912 624-BCCGA

The AX2000-1CGS624M is an Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture. It delivers a single-chip, nonvolatile FPGA solution with high logic capacity and embedded memory, designed for high-performance and security-conscious applications.

With 2,000,000 equivalent system gates, segmentable clocks, embedded PLLs, and on-chip SRAM/FIFO control, this device targets designs that require significant logic resources, large I/O counts and deterministic timing across a wide operating temperature range consistent with military-grade requirements.

Key Features

  • Core Capacity – 2,000,000 equivalent system gates and 32,256 logic elements provide substantial on-chip logic resources for complex FPGA implementations.
  • Embedded Memory – Approximately 295 kbits of embedded SRAM/FIFO with variable-aspect 4,608-bit RAM blocks and independent width-configurable read/write ports.
  • I/O and Interfaces – 418 user I/Os with support for mixed-voltage operation and bank-selectable I/O standards; LVDS-capable channels up to documented rates in the datasheet and programmable drive/slew options.
  • Performance – System-level performance characteristics called out in the family documentation include 350+ MHz system performance and 500+ MHz internal performance, plus high-performance embedded FIFOs.
  • Clocking and PLLs – Segmentable clock resources with embedded PLLs providing a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
  • Voltage and Power – Core supply range specified at 1.425 V to 1.575 V for the device core.
  • Package and Mounting – Supplied in a 624-BCCGA package (supplier package listed as 624-CCGA, 32.5 × 32.5 mm); mounting type: through hole.
  • Temperature and Grade – Military grade device with an operating temperature range of −55 °C to 125 °C.
  • Security and Test – Nonvolatile single-chip antifuse solution with FuseLock™ programming protection; boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II.
  • Regulatory – RoHS compliant.

Typical Applications

  • Military and Aerospace Systems – Military-grade temperature range and nonvolatile antifuse architecture make the device suitable for mission-critical electronics that require long-term configuration retention and security.
  • High-Speed Data Transport – High-performance embedded FIFOs and LVDS-capable I/Os support designs requiring robust high-speed serial data handling and protocol bridging.
  • Deterministic Logic and Timing – Segmentable clocks, embedded PLLs and deterministic timing controls are well suited to systems needing tight timing control and predictable latency.
  • Complex System Integration – Large logic capacity and significant I/O count enable consolidation of multiple functions onto a single FPGA for reduced board-level complexity.

Unique Advantages

  • Single-Chip Nonvolatile Architecture: Antifuse-based, nonvolatile configuration eliminates the need for external configuration memory and delivers inherent design security.
  • High Logic and I/O Density: Two million equivalent gates with 32,256 logic elements and 418 I/Os enable integration of complex subsystems on a single device.
  • Embedded Memory and FIFOs: Approximately 295 kbits of on-chip SRAM with embedded FIFO control simplifies high-throughput buffering without external memory.
  • Designed for Secure Deployments: FuseLock programming technology and in-system diagnostic tools provide protection against reverse engineering and assist design validation.
  • Robust Operating Range: Military-grade temperature rating (−55 °C to 125 °C) supports use in harsh environments where extended thermal tolerance is required.
  • Flexible Clocking: Segmentable clocks and embedded PLLs with wide input range and high-frequency synthesis capability enable advanced timing architectures.

Why Choose AX2000-1CGS624M?

The AX2000-1CGS624M positions itself as a high-capacity, secure, and thermally robust FPGA for applications that demand nonvolatile configuration, significant on-chip logic and memory, and a large, flexible I/O estate. Its antifuse-based architecture combined with FuseLock protection and in-system debug facilities supports long-lived, secure deployments.

This device is a fit for designers consolidating complex subsystems into a single FPGA in environments that require wide temperature tolerance and secure configuration retention. The combination of embedded memory, high-performance FIFOs, programmable I/Os and PLL-based clocking provides a foundation for deterministic, high-throughput designs.

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