AX2000-1FG1152M

IC FPGA 684 I/O 1152FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 684 294912 1152-BGA

Quantity 136 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FPBGA (35x35)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1152-BGANumber of I/O684Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-1FG1152M – Axcelerator Field Programmable Gate Array (FPGA) IC 684 294912 1152-BGA

The AX2000-1FG1152M is an Axcelerator antifuse FPGA that implements Microchip's AX architecture on a CMOS antifuse process. It delivers up to two million equivalent system gates, extensive I/O flexibility and embedded memory, and is specified for military-grade operation.

Designed for high-performance, secure and deterministic logic implementations, this device targets applications that require high gate density, robust on-chip memory and high-speed I/O capability while operating across a wide temperature range.

Key Features

  • Core Architecture  AX antifuse-based FPGA architecture providing a single-chip, nonvolatile solution with deterministic and user-controllable timing.
  • Logic Resources  32,256 logic elements and up to 10,752 dedicated flip-flops, supporting designs up to 2,000,000 equivalent system gates.
  • Embedded Memory & FIFO  Approximately 0.295 Mbits of embedded SRAM/FIFO across 64 core RAM blocks with variable-aspect 4,608-bit RAM block organizations and programmable FIFO control logic.
  • I/O Flexibility  Up to 684 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V). Supports single-ended standards (LVTTL, LVCMOS, 3.3V PCI/PCI-X) and differential standards including LVDS and LVPECL; 700 Mb/s LVDS-capable I/Os.
  • Performance & Clocking  System performance in excess of 350 MHz and internal performance beyond 500 MHz. Segmentable clock resources and embedded PLLs (14–200 MHz input range) with frequency synthesis capabilities up to 1 GHz.
  • Power  Core supply range of 1.425 V to 1.575 V (nominal 1.5 V) designed for low-power core operation.
  • Package & Environmental  Surface-mount 1152-BGA (1152-FPBGA, 35 × 35 mm footprint) package, RoHS compliant, and specified for operation from -55 °C to 125 °C (military grade).
  • Security & Test  FuseLock™ programming technology to protect against reverse engineering, plus boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug via Microchip Silicon Explorer II.
  • Process & Integration  Manufactured on advanced 0.15 µm CMOS antifuse technology with seven metal layers to deliver ASIC-level performance in a programmable device.

Typical Applications

  • Defense & Military Systems  High-density, nonvolatile programmable logic for secure, mission-critical subsystems that require extended temperature operation and design protection.
  • High-Speed Communications  Backplane interfaces, link aggregation and protocol bridging leveraging high-performance PLLs and 700 Mb/s-capable LVDS I/Os.
  • ASIC Migration & Hardware Acceleration  Replace fixed-function ASIC blocks with reprogrammable logic to accelerate time-to-market while retaining ASIC-like performance and density.
  • Data Acquisition & Signal Processing  Real-time buffering and streaming using embedded SRAM/FIFO resources and high internal clock performance for low-latency processing.

Unique Advantages

  • High gate density: Enables complex, system-level integration with up to 2,000,000 equivalent system gates on a single device.
  • Flexible, bank-selectable I/Os: Mixed-voltage and multiple I/O standards reduce external level shifting and simplify multi-voltage system designs.
  • Deterministic timing and strong clocking: Segmentable clocks and on-chip PLLs simplify timing closure for high-performance designs.
  • Nonvolatile security: Antifuse technology with FuseLock protects intellectual property and prevents reverse engineering.
  • Military-grade temperature range: Rated for -55 °C to 125 °C, supporting demanding environmental requirements.
  • On-chip memory and FIFOs: Embedded SRAM and programmable FIFO logic provide efficient data buffering for streaming applications.

Why Choose AX2000-1FG1152M?

The AX2000-1FG1152M combines high gate capacity, extensive I/O flexibility and embedded memory in a nonvolatile antifuse FPGA targeted at secure, performance-sensitive applications. Its AX architecture and advanced CMOS antifuse process deliver ASIC-like performance while maintaining the adaptability of programmable logic.

This device is well suited to customers developing military, high-speed communications, data acquisition or ASIC-replacement designs that require deterministic timing, IP protection and a broad operating temperature range. Built-in diagnostic and debug capabilities support in-system validation and bring-up for complex designs.

Request a quote or submit an inquiry for pricing and availability to evaluate the AX2000-1FG1152M for your next high-performance, secure FPGA design.

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