AX2000-1FG1152M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 684 294912 1152-BGA |
|---|---|
| Quantity | 136 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BGA | Number of I/O | 684 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-1FG1152M – Axcelerator Field Programmable Gate Array (FPGA) IC 684 294912 1152-BGA
The AX2000-1FG1152M is an Axcelerator antifuse FPGA that implements Microchip's AX architecture on a CMOS antifuse process. It delivers up to two million equivalent system gates, extensive I/O flexibility and embedded memory, and is specified for military-grade operation.
Designed for high-performance, secure and deterministic logic implementations, this device targets applications that require high gate density, robust on-chip memory and high-speed I/O capability while operating across a wide temperature range.
Key Features
- Core Architecture AX antifuse-based FPGA architecture providing a single-chip, nonvolatile solution with deterministic and user-controllable timing.
- Logic Resources 32,256 logic elements and up to 10,752 dedicated flip-flops, supporting designs up to 2,000,000 equivalent system gates.
- Embedded Memory & FIFO Approximately 0.295 Mbits of embedded SRAM/FIFO across 64 core RAM blocks with variable-aspect 4,608-bit RAM block organizations and programmable FIFO control logic.
- I/O Flexibility Up to 684 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V). Supports single-ended standards (LVTTL, LVCMOS, 3.3V PCI/PCI-X) and differential standards including LVDS and LVPECL; 700 Mb/s LVDS-capable I/Os.
- Performance & Clocking System performance in excess of 350 MHz and internal performance beyond 500 MHz. Segmentable clock resources and embedded PLLs (14–200 MHz input range) with frequency synthesis capabilities up to 1 GHz.
- Power Core supply range of 1.425 V to 1.575 V (nominal 1.5 V) designed for low-power core operation.
- Package & Environmental Surface-mount 1152-BGA (1152-FPBGA, 35 × 35 mm footprint) package, RoHS compliant, and specified for operation from -55 °C to 125 °C (military grade).
- Security & Test FuseLock™ programming technology to protect against reverse engineering, plus boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug via Microchip Silicon Explorer II.
- Process & Integration Manufactured on advanced 0.15 µm CMOS antifuse technology with seven metal layers to deliver ASIC-level performance in a programmable device.
Typical Applications
- Defense & Military Systems High-density, nonvolatile programmable logic for secure, mission-critical subsystems that require extended temperature operation and design protection.
- High-Speed Communications Backplane interfaces, link aggregation and protocol bridging leveraging high-performance PLLs and 700 Mb/s-capable LVDS I/Os.
- ASIC Migration & Hardware Acceleration Replace fixed-function ASIC blocks with reprogrammable logic to accelerate time-to-market while retaining ASIC-like performance and density.
- Data Acquisition & Signal Processing Real-time buffering and streaming using embedded SRAM/FIFO resources and high internal clock performance for low-latency processing.
Unique Advantages
- High gate density: Enables complex, system-level integration with up to 2,000,000 equivalent system gates on a single device.
- Flexible, bank-selectable I/Os: Mixed-voltage and multiple I/O standards reduce external level shifting and simplify multi-voltage system designs.
- Deterministic timing and strong clocking: Segmentable clocks and on-chip PLLs simplify timing closure for high-performance designs.
- Nonvolatile security: Antifuse technology with FuseLock protects intellectual property and prevents reverse engineering.
- Military-grade temperature range: Rated for -55 °C to 125 °C, supporting demanding environmental requirements.
- On-chip memory and FIFOs: Embedded SRAM and programmable FIFO logic provide efficient data buffering for streaming applications.
Why Choose AX2000-1FG1152M?
The AX2000-1FG1152M combines high gate capacity, extensive I/O flexibility and embedded memory in a nonvolatile antifuse FPGA targeted at secure, performance-sensitive applications. Its AX architecture and advanced CMOS antifuse process deliver ASIC-like performance while maintaining the adaptability of programmable logic.
This device is well suited to customers developing military, high-speed communications, data acquisition or ASIC-replacement designs that require deterministic timing, IP protection and a broad operating temperature range. Built-in diagnostic and debug capabilities support in-system validation and bring-up for complex designs.
Request a quote or submit an inquiry for pricing and availability to evaluate the AX2000-1FG1152M for your next high-performance, secure FPGA design.

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