AX2000-1FG896I

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 330 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-1FG896I – Axcelerator Field Programmable Gate Array (FPGA) IC, 896-BGA

The AX2000-1FG896I is an Axcelerator antifuse FPGA offering up to 2,000,000 equivalent system gates in a nonvolatile, single-chip solution. Built on the AX architecture and a CMOS antifuse process, it provides high internal performance, embedded memory and on-chip FIFO control suitable for designs requiring deterministic timing and secure configuration.

This device targets high-performance and industrial designs that need dense logic, flexible multi‑standard I/Os and robust temperature support. Key value propositions include high-frequency system performance, integrated embedded SRAM/FIFO resources and a compact 896-ball fine BGA package for surface-mount applications.

Key Features

  • Core Logic  Up to 2,000,000 equivalent system gates implemented across 32,256 logic elements, enabling dense combinatorial and registered logic integration.
  • Embedded Memory & FIFOs  Approximately 0.295 Mbits of on-chip SRAM organized as variable-aspect 4,608-bit RAM blocks with programmable FIFO control logic for buffering and width-configurable read/write ports.
  • I/O Flexibility  586 user I/Os on this part with support for bank-selectable mixed-voltage operation and differential standards; family-level capability includes LVDS up to 700 Mb/s and a wide set of single-ended and differential I/O standards.
  • Clocking & PLLs  Segmentable clock resources and an embedded PLL (family-level) with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for clock management and timing control.
  • Performance  System-level performance figures from the family include 350+ MHz system performance and 500+ MHz internal performance for demanding timing requirements.
  • Power & Core Voltage  Core supply operation centered around 1.5 V (specified 1.425 V to 1.575 V for this device) to support low-power core operation while enabling mixed I/O voltage domains.
  • Packaging & Mounting  Surface-mount 896-FBGA (31 × 31 mm) package case for high-density board designs and reliable soldered mounting.
  • Industrial Grade & Temperature Range  Rated for industrial operation from −40 °C to +85 °C.
  • Security & Test  Nonvolatile antifuse programming with FuseLock™ protection against reverse engineering and boundary-scan (IEEE 1149.1 JTAG) for board-level testability and diagnostics.
  • Standards & Compliance  RoHS-compliant manufacturing and lead-free packaging options available.

Typical Applications

  • High-speed data processing  Use the device’s embedded FIFOs and high internal performance to implement real-time data buffering and processing pipelines.
  • Protocol bridging and interface control  Leverage multi-standard, bank-selectable I/Os and LVDS-capable channels to implement protocol translators and interface concentrators.
  • Secure, nonvolatile programmable logic  Antifuse programming and FuseLock™ provide a single-chip nonvolatile implementation for security-sensitive IP and fixed-function deployment.
  • Industrial automation and control  Industrial-grade temperature range and robust I/O flexibility suit factory automation, motion control and process-control applications.

Unique Advantages

  • High-density programmable logic: 32,256 logic elements and 2,000,000 equivalent gates allow large designs to be integrated on a single device, reducing board-level complexity.
  • Integrated buffering and memory: Nearly 0.295 Mbits of embedded SRAM with configurable FIFO control minimizes external memory needs and simplifies data-path design.
  • Deterministic timing and clock control: Segmentable clocks and an on-chip PLL provide predictable timing and the ability to synthesize required clock domains on-chip.
  • Secure nonvolatile configuration: Antifuse technology with FuseLock™ protects design IP and eliminates the need for external volatile configuration memory.
  • Industrial-ready packaging and temperature support: 896-FBGA surface-mount package combined with −40 °C to +85 °C rating supports deployment in industrial environments.
  • RoHS-compliant manufacturing: Enables use in applications requiring documented lead-free and restricted-substance compliance.

Why Choose AX2000-1FG896I?

The AX2000-1FG896I positions itself as a high-capacity, nonvolatile FPGA option for designers who need dense logic, embedded memory and secure configuration in a single surface-mount package. Its combination of 2,000,000 equivalent gates, 32,256 logic elements and on-chip SRAM/FIFO resources supports complex, high-performance designs while reducing external component count.

This device is appropriate for engineering teams targeting industrial and high-throughput applications that demand deterministic timing, flexible I/O standards and secure, one-time-programmable configuration. Long-term value comes from integrating multiple system functions on-chip and leveraging family-level clocking, PLL and I/O features to simplify system architecture.

Request a quote or submit an inquiry to get pricing and availability for the AX2000-1FG896I and discuss how it can fit into your next high-performance, secure FPGA design.

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