AX2000-1FG896I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 330 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-1FG896I – Axcelerator Field Programmable Gate Array (FPGA) IC, 896-BGA
The AX2000-1FG896I is an Axcelerator antifuse FPGA offering up to 2,000,000 equivalent system gates in a nonvolatile, single-chip solution. Built on the AX architecture and a CMOS antifuse process, it provides high internal performance, embedded memory and on-chip FIFO control suitable for designs requiring deterministic timing and secure configuration.
This device targets high-performance and industrial designs that need dense logic, flexible multi‑standard I/Os and robust temperature support. Key value propositions include high-frequency system performance, integrated embedded SRAM/FIFO resources and a compact 896-ball fine BGA package for surface-mount applications.
Key Features
- Core Logic Up to 2,000,000 equivalent system gates implemented across 32,256 logic elements, enabling dense combinatorial and registered logic integration.
- Embedded Memory & FIFOs Approximately 0.295 Mbits of on-chip SRAM organized as variable-aspect 4,608-bit RAM blocks with programmable FIFO control logic for buffering and width-configurable read/write ports.
- I/O Flexibility 586 user I/Os on this part with support for bank-selectable mixed-voltage operation and differential standards; family-level capability includes LVDS up to 700 Mb/s and a wide set of single-ended and differential I/O standards.
- Clocking & PLLs Segmentable clock resources and an embedded PLL (family-level) with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for clock management and timing control.
- Performance System-level performance figures from the family include 350+ MHz system performance and 500+ MHz internal performance for demanding timing requirements.
- Power & Core Voltage Core supply operation centered around 1.5 V (specified 1.425 V to 1.575 V for this device) to support low-power core operation while enabling mixed I/O voltage domains.
- Packaging & Mounting Surface-mount 896-FBGA (31 × 31 mm) package case for high-density board designs and reliable soldered mounting.
- Industrial Grade & Temperature Range Rated for industrial operation from −40 °C to +85 °C.
- Security & Test Nonvolatile antifuse programming with FuseLock™ protection against reverse engineering and boundary-scan (IEEE 1149.1 JTAG) for board-level testability and diagnostics.
- Standards & Compliance RoHS-compliant manufacturing and lead-free packaging options available.
Typical Applications
- High-speed data processing Use the device’s embedded FIFOs and high internal performance to implement real-time data buffering and processing pipelines.
- Protocol bridging and interface control Leverage multi-standard, bank-selectable I/Os and LVDS-capable channels to implement protocol translators and interface concentrators.
- Secure, nonvolatile programmable logic Antifuse programming and FuseLock™ provide a single-chip nonvolatile implementation for security-sensitive IP and fixed-function deployment.
- Industrial automation and control Industrial-grade temperature range and robust I/O flexibility suit factory automation, motion control and process-control applications.
Unique Advantages
- High-density programmable logic: 32,256 logic elements and 2,000,000 equivalent gates allow large designs to be integrated on a single device, reducing board-level complexity.
- Integrated buffering and memory: Nearly 0.295 Mbits of embedded SRAM with configurable FIFO control minimizes external memory needs and simplifies data-path design.
- Deterministic timing and clock control: Segmentable clocks and an on-chip PLL provide predictable timing and the ability to synthesize required clock domains on-chip.
- Secure nonvolatile configuration: Antifuse technology with FuseLock™ protects design IP and eliminates the need for external volatile configuration memory.
- Industrial-ready packaging and temperature support: 896-FBGA surface-mount package combined with −40 °C to +85 °C rating supports deployment in industrial environments.
- RoHS-compliant manufacturing: Enables use in applications requiring documented lead-free and restricted-substance compliance.
Why Choose AX2000-1FG896I?
The AX2000-1FG896I positions itself as a high-capacity, nonvolatile FPGA option for designers who need dense logic, embedded memory and secure configuration in a single surface-mount package. Its combination of 2,000,000 equivalent gates, 32,256 logic elements and on-chip SRAM/FIFO resources supports complex, high-performance designs while reducing external component count.
This device is appropriate for engineering teams targeting industrial and high-throughput applications that demand deterministic timing, flexible I/O standards and secure, one-time-programmable configuration. Long-term value comes from integrating multiple system functions on-chip and leveraging family-level clocking, PLL and I/O features to simplify system architecture.
Request a quote or submit an inquiry to get pricing and availability for the AX2000-1FG896I and discuss how it can fit into your next high-performance, secure FPGA design.

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