AX2000-1FGG896

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 23 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-1FGG896 – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

The AX2000-1FGG896 is an Axcelerator antifuse FPGA built on Microchip's AX architecture, delivering a single‑chip, nonvolatile programmable solution for high‑performance digital designs. This device provides up to 2,000,000 equivalent system gates with 32,256 logic elements and approximately 0.295 Mbits of embedded SRAM/FIFO, making it suited to complex logic integration and on‑chip buffering.

Designed for applications that require high internal performance and flexible I/O, the device includes segmentable clocks, embedded PLLs, and bank‑selectable multi‑standard I/Os. The AX2000-1FGG896 operates from a 1.425 V to 1.575 V core supply and is specified for commercial temperature operation (0 °C to 70 °C) in an 896‑ball BGA surface‑mount package.

Key Features

  • Core Performance — System performance capability of 350+ MHz and internal performance above 500+ MHz, delivering deterministic timing for demanding logic paths.
  • Logic Resources — Up to 2,000,000 equivalent system gates with 32,256 logic elements and 10,752 dedicated flip‑flops to implement large, complex digital functions on a single device.
  • Embedded Memory and FIFOs — Approximately 0.295 Mbits of embedded SRAM organized in configurable RAM blocks with programmable FIFO control logic for efficient data buffering and width‑configurable ports.
  • Flexible I/O — 586 user I/Os with support for multi‑voltage operation (1.5 V, 1.8 V, 2.5 V, 3.3 V) and high‑speed standards including LVDS (700 Mb/s capable); bank‑selectable I/O configuration provides design flexibility.
  • Clocking and PLLs — Segmentable clock resources and embedded PLLs with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for precise timing and clock generation.
  • Programming and Security — Antifuse, single‑chip nonvolatile programming with FuseLock™ technology to protect designs against reverse engineering and unauthorized modification.
  • Package and Mounting — Surface‑mount 896‑BGA (896‑FBGA, 31 × 31) package suitable for compact, high‑density board layouts.
  • Power and Temperature — 1.425 V to 1.575 V core supply range (nominal 1.5 V core) and commercial operating temperature range of 0 °C to 70 °C.
  • Test and Debug — Boundary‑scan compliant with IEEE 1149.1 (JTAG) and in‑system diagnostic/debug capability via Microchip Silicon Explorer II.

Typical Applications

  • High‑speed data capture and buffering — Embedded FIFOs and LVDS‑capable I/Os enable reliable high‑rate data buffering and width‑configurable memory interfaces for data acquisition systems.
  • Telecommunications and networking — High logic capacity, abundant I/Os, and on‑chip PLL frequency synthesis support custom packet processing, protocol bridging, and clocking requirements.
  • Secure system consolidation — Antifuse nonvolatile programming and FuseLock technology provide a secure platform for integrating multiple functions while protecting intellectual property.
  • Complex control and signal processing — Large logic resources and segmentable clock architecture suit designs that require deterministic timing, multiple clock domains, and extensive combinational and sequential logic.

Unique Advantages

  • Highly integrated single‑chip solution: Combines multi‑million gate capacity, embedded memory, PLLs and abundant I/Os to reduce board-level BOM and interconnect complexity.
  • Deterministic, high internal performance: Documented system and internal performance targets support timing‑sensitive designs with predictable behavior.
  • Flexible, multi‑standard I/O: Bank‑selectable I/O voltages and support for differential and single‑ended standards simplify interfacing to a wide range of peripherals and transceivers.
  • Secure, nonvolatile programming: Antifuse technology plus FuseLock™ protects designs from reverse engineering and unauthorized reprogramming.
  • On‑chip FIFO and memory configurability: Variable‑aspect RAM blocks and programmable FIFO logic streamline data buffering and width conversion tasks without external SRAM.
  • Compact BGA package: 896‑ball FBGA (31 × 31 mm) enables high I/O density in space‑constrained designs.

Why Choose AX2000-1FGG896?

The AX2000-1FGG896 is positioned for designs that require multi‑million gate capacity, robust embedded memory, and a secure, nonvolatile FPGA fabric. Its combination of high internal performance, segmentable clocks and on‑chip PLLs makes it suitable for timing‑critical and I/O‑intensive applications that benefit from deterministic behavior and integrated FIFO buffering.

This device is well suited to engineers and teams consolidating complex logic and interfaces onto a single programmable IC while maintaining design security. The AX2000-1FGG896 delivers a balance of performance, integration and I/O flexibility that supports scalable, long‑lifecycle system designs.

Request a quote or submit an RFQ to review current availability and pricing for the AX2000-1FGG896.

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