AX2000-1FGG896
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 23 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-1FGG896 – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
The AX2000-1FGG896 is an Axcelerator antifuse FPGA built on Microchip's AX architecture, delivering a single‑chip, nonvolatile programmable solution for high‑performance digital designs. This device provides up to 2,000,000 equivalent system gates with 32,256 logic elements and approximately 0.295 Mbits of embedded SRAM/FIFO, making it suited to complex logic integration and on‑chip buffering.
Designed for applications that require high internal performance and flexible I/O, the device includes segmentable clocks, embedded PLLs, and bank‑selectable multi‑standard I/Os. The AX2000-1FGG896 operates from a 1.425 V to 1.575 V core supply and is specified for commercial temperature operation (0 °C to 70 °C) in an 896‑ball BGA surface‑mount package.
Key Features
- Core Performance — System performance capability of 350+ MHz and internal performance above 500+ MHz, delivering deterministic timing for demanding logic paths.
- Logic Resources — Up to 2,000,000 equivalent system gates with 32,256 logic elements and 10,752 dedicated flip‑flops to implement large, complex digital functions on a single device.
- Embedded Memory and FIFOs — Approximately 0.295 Mbits of embedded SRAM organized in configurable RAM blocks with programmable FIFO control logic for efficient data buffering and width‑configurable ports.
- Flexible I/O — 586 user I/Os with support for multi‑voltage operation (1.5 V, 1.8 V, 2.5 V, 3.3 V) and high‑speed standards including LVDS (700 Mb/s capable); bank‑selectable I/O configuration provides design flexibility.
- Clocking and PLLs — Segmentable clock resources and embedded PLLs with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for precise timing and clock generation.
- Programming and Security — Antifuse, single‑chip nonvolatile programming with FuseLock™ technology to protect designs against reverse engineering and unauthorized modification.
- Package and Mounting — Surface‑mount 896‑BGA (896‑FBGA, 31 × 31) package suitable for compact, high‑density board layouts.
- Power and Temperature — 1.425 V to 1.575 V core supply range (nominal 1.5 V core) and commercial operating temperature range of 0 °C to 70 °C.
- Test and Debug — Boundary‑scan compliant with IEEE 1149.1 (JTAG) and in‑system diagnostic/debug capability via Microchip Silicon Explorer II.
Typical Applications
- High‑speed data capture and buffering — Embedded FIFOs and LVDS‑capable I/Os enable reliable high‑rate data buffering and width‑configurable memory interfaces for data acquisition systems.
- Telecommunications and networking — High logic capacity, abundant I/Os, and on‑chip PLL frequency synthesis support custom packet processing, protocol bridging, and clocking requirements.
- Secure system consolidation — Antifuse nonvolatile programming and FuseLock technology provide a secure platform for integrating multiple functions while protecting intellectual property.
- Complex control and signal processing — Large logic resources and segmentable clock architecture suit designs that require deterministic timing, multiple clock domains, and extensive combinational and sequential logic.
Unique Advantages
- Highly integrated single‑chip solution: Combines multi‑million gate capacity, embedded memory, PLLs and abundant I/Os to reduce board-level BOM and interconnect complexity.
- Deterministic, high internal performance: Documented system and internal performance targets support timing‑sensitive designs with predictable behavior.
- Flexible, multi‑standard I/O: Bank‑selectable I/O voltages and support for differential and single‑ended standards simplify interfacing to a wide range of peripherals and transceivers.
- Secure, nonvolatile programming: Antifuse technology plus FuseLock™ protects designs from reverse engineering and unauthorized reprogramming.
- On‑chip FIFO and memory configurability: Variable‑aspect RAM blocks and programmable FIFO logic streamline data buffering and width conversion tasks without external SRAM.
- Compact BGA package: 896‑ball FBGA (31 × 31 mm) enables high I/O density in space‑constrained designs.
Why Choose AX2000-1FGG896?
The AX2000-1FGG896 is positioned for designs that require multi‑million gate capacity, robust embedded memory, and a secure, nonvolatile FPGA fabric. Its combination of high internal performance, segmentable clocks and on‑chip PLLs makes it suitable for timing‑critical and I/O‑intensive applications that benefit from deterministic behavior and integrated FIFO buffering.
This device is well suited to engineers and teams consolidating complex logic and interfaces onto a single programmable IC while maintaining design security. The AX2000-1FGG896 delivers a balance of performance, integration and I/O flexibility that supports scalable, long‑lifecycle system designs.
Request a quote or submit an RFQ to review current availability and pricing for the AX2000-1FGG896.

Date Founded: 1989
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