AX2000-2FG896
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 314 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-2FG896 – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
The AX2000-2FG896 Axcelerator FPGA is a high-density antifuse-based programmable device using Microchip’s AX architecture. It delivers up to 2,000,000 equivalent system gates with single-chip nonvolatile programming, embedded SRAM/FIFO control, segmentable clocks and integrated PLLs for system-level designs that require high-performance, secure logic integration.
Targeted for commercial applications, this device combines a large logic fabric, substantial embedded memory and broad I/O flexibility to consolidate complex digital functions and high-speed interfaces into a single surface-mount 896-FBGA package.
Key Features
- Core Capacity — Approximately 2,000,000 equivalent system gates and 32,256 logic elements provide large-scale logic integration for complex designs.
- Logic Resources — Up to 10,752 dedicated flip-flops and deterministic, user-controllable timing for precise synchronous designs.
- Embedded Memory & FIFO — Approximately 295 kbits of embedded SRAM organized in configurable blocks with programmable FIFO control logic for buffering and packet processing.
- I/O Flexibility — 586 user I/Os on this part with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for a range of single-ended and differential standards noted in the family.
- High-Speed Performance — Family-level performance boundaries include 350+ MHz system performance and 500+ MHz internal performance; I/Os are LVDS-capable to 700 Mb/s where supported.
- Clocking & PLL — Segmentable clock resources and embedded PLLs with a 14–200 MHz input range and frequency synthesis up to 1 GHz for flexible clocking schemes.
- Nonvolatile Antifuse Technology — Single-chip, nonvolatile programming with FuseLock programming technology for design protection and anti-reverse-engineering benefits.
- Package & Supply — Supplied in an 896-FBGA package (31×31); core voltage range 1.425 V to 1.575 V and commercial operating temperature 0 °C to 70 °C.
- Development & Test — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic/debug capability available within the family.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High-performance system consolidation — Integrate multiple digital subsystems into a single, nonvolatile FPGA to reduce board-level complexity and component count.
- Packet buffering and FIFO-based interfaces — Use embedded SRAM and programmable FIFO control logic for buffering in high-throughput data paths.
- High-speed serial and parallel I/O — Leverage LVDS-capable I/Os and bank-selectable voltage options to interface with a variety of high-speed peripherals and transceivers.
Unique Advantages
- Single-chip nonvolatile solution: Antifuse architecture provides permanent programming on-chip, removing the need for external configuration memory.
- Large-scale integration: 2,000,000 equivalent gates and 32,256 logic elements enable consolidation of complex functions that might otherwise require multiple devices.
- Embedded memory with FIFO control: Approximately 295 kbits of on-chip RAM and programmable FIFO logic simplify data buffering and stream processing.
- Flexible, multi-standard I/Os: Bank-selectable mixed-voltage I/O support broad interface options without external level translators.
- Deterministic timing and clocking: Segmentable clocks and integrated PLLs allow precise timing architectures and local clock synthesis up to 1 GHz.
- Design protection: FuseLock programming technology protects design IP against reverse engineering.
Why Choose AX2000-2FG896?
The AX2000-2FG896 combines high gate capacity, substantial embedded memory and a comprehensive I/O set in a single 896-FBGA package, making it suited to commercial designs that require consolidation of high-performance digital logic and robust, nonvolatile programming. Its antifuse-based AX architecture delivers deterministic timing, integrated PLLs and embedded FIFO resources to simplify system design and enable reliable operation within the specified commercial temperature and supply ranges.
This device is appropriate for engineering teams looking to reduce BOM complexity while maintaining high internal performance and flexible interfacing options. Backed by family-level diagnostic and boundary-scan capabilities, it supports development and manufacturing test flows for demanding commercial applications.
Request a quote or submit an inquiry to evaluate AX2000-2FG896 for your next design and to obtain pricing and availability information.

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