AX2000-1FGG896I

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 741 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-1FGG896I – Axcelerator Field Programmable Gate Array (FPGA) IC, 586 I/Os, 896‑BGA

The AX2000-1FGG896I is an Axcelerator family FPGA from Microchip Technology built on the AX antifuse architecture. This single-chip, nonvolatile FPGA delivers up to 2,000,000 equivalent system gates, extensive I/O capability and on‑chip SRAM/FIFO resources for high-performance, deterministic designs.

Designed for industrial applications, the device combines segmentable clocks, embedded PLLs, chip‑wide routing and configurable embedded memory to address demanding data‑movement, protocol bridging and real‑time processing use cases where high integration and predictable timing are required.

Key Features

  • Core Performance – Up to 2,000,000 equivalent system gates with reported system performance of 350+ MHz and internal performance up to 500+ MHz.
  • Logic Resources – 32,256 logic elements (CLBs) supporting large, complex logic implementations and high resource utilization.
  • Embedded Memory & FIFOs – Approximately 295 kbits of embedded SRAM/FIFO with variable-aspect 4,608‑bit RAM blocks and programmable FIFO control logic.
  • I/O Flexibility – 586 user I/Os with bank‑selectable, mixed‑voltage operation and differential standards support (including LVDS and LVPECL). I/Os are capable of 700 Mb/s LVDS signaling.
  • Clocking & Timing – Segmentable clock resources plus embedded PLLs (14–200 MHz input range) with frequency synthesis capabilities up to 1 GHz for flexible clock management.
  • Nonvolatile Antifuse Technology – Single‑chip, nonvolatile programming with FuseLock™ protection for design security and deterministic, user‑controllable timing.
  • Package & Supply – 896‑FBGA (31×31) fine ball grid array in a surface‑mount package; core voltage range 1.425 V to 1.575 V.
  • Industrial Grade – Rated operating temperature −40 °C to 85 °C and RoHS compliant for industrial environments.
  • Test & Debug – Boundary‑scan testing compliant with IEEE 1149.1 (JTAG) and in‑system diagnostic/debug capability (Microchip Silicon Explorer II referenced in family documentation).

Typical Applications

  • High‑speed Communications – Implement protocol bridging, SERDES front‑ends and packet processing using 586 I/Os and LVDS‑capable interfaces.
  • Industrial Control & Automation – Realize deterministic control logic and high‑density I/O aggregation with industrial temperature rating and on‑chip memory/FIFO buffering.
  • Data Acquisition & Instrumentation – Use embedded SRAM/FIFO blocks and high internal performance for real‑time data buffering and preprocessing.
  • High‑performance Signal Processing – Leverage the device’s large logic capacity, high internal clock speeds and PLL frequency synthesis for compute‑intensive pipelines.

Unique Advantages

  • High Gate Density: 2,000,000 equivalent system gates enable large, integration‑heavy designs that reduce external logic and simplify system architecture.
  • Substantial On‑Chip Memory: Approximately 295 kbits of embedded SRAM/FIFO supports wide, configurable data paths and deep buffering without external memory.
  • Flexible, High‑Speed I/O: Bank‑selectable mixed‑voltage I/Os and support for LVDS/LVPECL enable multi‑standard interface designs and high throughput links (700 Mb/s LVDS capable).
  • Deterministic Timing & Clocking: Segmentable clocks and embedded PLLs provide predictable timing and robust clock management for time‑critical systems.
  • Secure, Nonvolatile Programming: Antifuse-based single‑chip nonvolatile solution with FuseLock™ technology protects design IP and eliminates external configuration flash.
  • Industrial Reliability: Surface‑mount 896‑FBGA package and −40 °C to 85 °C operating range support deployment in industrial environments.

Why Choose AX2000-1FGG896I?

The AX2000-1FGG896I is positioned for applications that require very high logic capacity, extensive I/O and deterministic performance in an industrial‑grade, nonvolatile FPGA. Its combination of 32,256 logic elements, substantial embedded memory and flexible high‑speed I/Os makes it a strong choice for systems that benefit from single‑chip integration and predictable timing.

For designers seeking scalability and long‑term robustness, this Axcelerator device provides a tightly integrated feature set—advanced clocking, embedded FIFOs, and security‑focused programming—backed by Microchip Technology’s FPGA family documentation and tools referenced for in‑system diagnostics.

Request a quote or submit an inquiry to get pricing, availability and configuration details for the AX2000-1FGG896I. Our team can assist with lead times and volume options to support your project schedule.

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