AX2000-1LG624M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 418 294912 624-BCLGA |
|---|---|
| Quantity | 1,709 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 44 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 624-CLGA (32.5x32.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 624-BCLGA | Number of I/O | 418 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-1LG624M – Axcelerator Field Programmable Gate Array (FPGA) IC 418 294912 624-BCLGA
The AX2000-1LG624M is a Microchip Technology Axcelerator-series antifuse FPGA implementing the AX architecture. This single-chip, nonvolatile FPGA delivers high-density logic (2,000,000 equivalent system gates) with on-chip embedded RAM and flexible, multi-standard I/O, targeted for applications that require high performance and military-grade operating conditions.
Built on a CMOS antifuse process and designed for demanding environments, the device provides high internal performance, segmentable clock resources and integrated PLLs, making it suitable for high-speed communications, secure systems, and rugged embedded platforms.
Key Features
- Core & Architecture AX architecture antifuse FPGA; single-chip, nonvolatile solution supporting deterministic, user-controllable timing and FuseLock™ programming technology for design protection.
- Logic Capacity 2,000,000 equivalent system gates with 32,256 logic elements, enabling large-scale logic integration on one device.
- Embedded Memory & FIFOs Approximately 0.295 Mbits (294,912 bits) of embedded SRAM/FIFO with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for data buffering and high-throughput designs.
- I/O Flexibility 418 user I/Os with bank-selectable, multi-voltage support (1.5V, 1.8V, 2.5V, 3.3V), programmable slew and drive strength, and support for differential standards such as LVDS and LVPECL; 700 Mb/s LVDS-capable I/Os are supported.
- Performance & Clocking System performance exceeding 350 MHz and internal performance exceeding 500 MHz, with embedded PLLs (14–200 MHz input range) and frequency synthesis capability up to 1 GHz.
- Package & Electrical 624-BCLGA surface-mount package (32.5 × 32.5 mm) with a core supply range of 1.425 V to 1.575 V.
- Rugged Temperature & Military Grade Military-grade device qualification with operating temperature from −55 °C to 125 °C, suitable for temperature-critical and defense applications.
- System & Test Features Segmentable clock resources, chip-wide highway routing, boundary-scan (IEEE 1149.1 JTAG) compliance and in-system diagnostic/debug capability via Microchip Silicon Explorer II.
Typical Applications
- Defense & Aerospace Systems Military-grade temperature range and secure antifuse technology make the device suitable for rugged communications, telemetry and platform control systems.
- High-Speed Communications High internal performance, PLL frequency synthesis and LVDS-capable I/Os support front-end interfaces, data transport and line-rate processing tasks.
- Data Acquisition & Signal Processing Large logic capacity and embedded FIFO/SRAM resources enable real-time buffering, protocol handling and complex DSP control logic on a single device.
- Secure / Anti-Tamper Designs Nonvolatile antifuse programming combined with FuseLock™ technology provides protection against reverse engineering and design theft for sensitive systems.
Unique Advantages
- Highly integrated solution: Combines up to 2,000,000 equivalent system gates, 32,256 logic elements and embedded RAM on one nonvolatile chip to reduce external components and simplify system design.
- Performance-oriented architecture: Documented system and internal performance levels (350+ MHz / 500+ MHz) plus PLL frequency synthesis up to 1 GHz enable demanding timing and throughput requirements.
- Flexible multi-standard I/O: Bank-selectable, mixed-voltage I/Os and support for LVDS/LVPECL and other standards allow interfacing to a wide range of high-speed peripherals and links without complex level-shifting.
- Designed for harsh environments: Military-grade operating range (−55 °C to 125 °C) and surface-mount 624-BCLGA packaging address temperature-sensitive, ruggedized applications.
- Built-in security and testability: Antifuse nonvolatile programming with FuseLock and IEEE 1149.1 boundary-scan support simplifies production test and protects intellectual property.
- In-system visibility: Support for Microchip Silicon Explorer II provides diagnostic and debug capabilities for development and field troubleshooting.
Why Choose AX2000-1LG624M?
The AX2000-1LG624M positions itself as a high-performance, secure and rugged Axcelerator FPGA option for designs that require large logic capacity, embedded memory and multi-standard high-speed I/O. Its antifuse nonvolatile architecture and FuseLock protection reduce configuration overhead and help safeguard design IP.
With integrated PLLs, segmentable clocks and deterministic timing, this device suits applications demanding precise timing and high throughput, while the military-grade temperature range and surface-mount 624-BCLGA package provide a robust platform for defense, aerospace and other harsh-environment systems.
Request a quote or submit a sales inquiry to evaluate AX2000-1LG624M for your next design. Our team can provide pricing and availability information to help you move forward.

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