AX2000-2FGG896I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 921 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-2FGG896I – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
The AX2000-2FGG896I is an Axcelerator family antifuse FPGA from Microchip Technology, offering a single-chip, nonvolatile programmable solution based on the AX architecture. It delivers high raw capacity—approximately 2,000,000 equivalent system gates—with 32,256 logic elements and approximately 0.295 Mbits of embedded SRAM/FIFO, making it suitable for demanding industrial and high-performance embedded applications.
Designed for secure, high-speed systems, the device combines segmentable clocks, embedded PLLs, flexible mixed-voltage I/Os and embedded FIFO control logic to accelerate data processing, interface bridging and timing-critical designs while supporting industrial temperature operation.
Key Features
- Core Capacity Approximately 2,000,000 equivalent system gates with 32,256 logic elements to implement large, complex logic functions.
- Embedded Memory Approximately 294,912 bits of on-chip SRAM in multiple core RAM blocks with configurable widths and embedded FIFO control logic for efficient buffering and packet handling.
- I/O and Interface Flexibility 586 user I/Os with support across multiple voltage domains; differential and single-ended standards and up to 700 Mb/s LVDS-capable I/Os are supported by the Axcelerator family architecture.
- High-Speed Timing Segmentable clock resources and embedded PLLs (14–200 MHz input range, with frequency synthesis capabilities up to 1 GHz) enable deterministic, user-controllable timing for high-performance designs.
- Performance System performance targets published for the family include 350+ MHz system performance and 500+ MHz internal performance for timing-critical logic paths.
- Power and Voltage Core supply range specified at 1.425 V to 1.575 V (nominal 1.5 V core operation) for low-power core operation.
- Package and Mounting 896-ball fine BGA (896-FBGA, 31 × 31 mm footprint) surface-mount package for high-density PCB integration.
- Industrial Temperature Rated for operation from −40 °C to 85 °C for industrial applications.
- Design Security FuseLock programming technology provides protection against reverse engineering and unauthorized access to design bitstreams.
- Standards & Testability Supports boundary-scan testing compliant with IEEE 1149.1 (JTAG) and includes in-system diagnostic and debug capability with vendor tools.
Typical Applications
- High-speed data aggregation and protocol bridging On-chip FIFOs, high I/O density and LVDS-capable interfaces make the device suitable for packet buffering, protocol conversion and data-path stabilization in networking or telecom equipment.
- Industrial control and automation Industrial temperature range, deterministic timing resources and abundant logic elements support motor control, motion systems and real-time control logic implementations.
- Secure embedded systems Nonvolatile antifuse technology and FuseLock programming provide a hardware-secure platform for designs where IP protection and single-chip nonvolatility are required.
- High-performance signal processing Large logic capacity and embedded memory blocks enable implementation of complex DSP pipelines, custom accelerators and data-processing engines.
Unique Advantages
- High logic capacity with embedded memory: Combine 32,256 logic elements and approximately 0.295 Mbits of SRAM to integrate large logic functions and local buffering on a single device, reducing board-level complexity.
- Flexible, mixed-voltage I/O support: Bank-selectable I/O voltages and multiple supported standards simplify mixed-signal interfacing and help minimize level-shifting components.
- Deterministic timing and high internal performance: Segmentable clocks and on-chip PLLs with wide input range and frequency synthesis support tight, predictable timing for high-speed designs.
- Single-chip nonvolatile security: Antifuse architecture with FuseLock programming protects IP and removes the need for external configuration memory.
- Industrial-ready operation: Rated −40 °C to 85 °C and packaged in a high-density 896-FBGA for compact, rugged board-level integration in industrial environments.
Why Choose AX2000-2FGG896I?
The AX2000-2FGG896I positions itself as a high-capacity, secure, single-chip FPGA solution for engineers designing industrial and high-performance embedded systems. With a large logic fabric, substantial embedded memory and flexible I/O capabilities, it enables consolidation of complex logic, buffering and interface functions into one nonvolatile device.
This device is appropriate for teams that need deterministic timing, on-chip FIFOs and secure programming in a compact BGA package while operating across an industrial temperature range. The Axcelerator architecture and embedded PLLs provide the timing and interface features necessary to scale high-throughput designs with reduced external component count.
Request a quote or submit an inquiry to evaluate AX2000-2FGG896I for your next design and confirm availability and pricing for your project needs.

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