AX2000-2FGG896I

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 921 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-2FGG896I – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

The AX2000-2FGG896I is an Axcelerator family antifuse FPGA from Microchip Technology, offering a single-chip, nonvolatile programmable solution based on the AX architecture. It delivers high raw capacity—approximately 2,000,000 equivalent system gates—with 32,256 logic elements and approximately 0.295 Mbits of embedded SRAM/FIFO, making it suitable for demanding industrial and high-performance embedded applications.

Designed for secure, high-speed systems, the device combines segmentable clocks, embedded PLLs, flexible mixed-voltage I/Os and embedded FIFO control logic to accelerate data processing, interface bridging and timing-critical designs while supporting industrial temperature operation.

Key Features

  • Core Capacity  Approximately 2,000,000 equivalent system gates with 32,256 logic elements to implement large, complex logic functions.
  • Embedded Memory  Approximately 294,912 bits of on-chip SRAM in multiple core RAM blocks with configurable widths and embedded FIFO control logic for efficient buffering and packet handling.
  • I/O and Interface Flexibility  586 user I/Os with support across multiple voltage domains; differential and single-ended standards and up to 700 Mb/s LVDS-capable I/Os are supported by the Axcelerator family architecture.
  • High-Speed Timing  Segmentable clock resources and embedded PLLs (14–200 MHz input range, with frequency synthesis capabilities up to 1 GHz) enable deterministic, user-controllable timing for high-performance designs.
  • Performance  System performance targets published for the family include 350+ MHz system performance and 500+ MHz internal performance for timing-critical logic paths.
  • Power and Voltage  Core supply range specified at 1.425 V to 1.575 V (nominal 1.5 V core operation) for low-power core operation.
  • Package and Mounting  896-ball fine BGA (896-FBGA, 31 × 31 mm footprint) surface-mount package for high-density PCB integration.
  • Industrial Temperature  Rated for operation from −40 °C to 85 °C for industrial applications.
  • Design Security  FuseLock programming technology provides protection against reverse engineering and unauthorized access to design bitstreams.
  • Standards & Testability  Supports boundary-scan testing compliant with IEEE 1149.1 (JTAG) and includes in-system diagnostic and debug capability with vendor tools.

Typical Applications

  • High-speed data aggregation and protocol bridging  On-chip FIFOs, high I/O density and LVDS-capable interfaces make the device suitable for packet buffering, protocol conversion and data-path stabilization in networking or telecom equipment.
  • Industrial control and automation  Industrial temperature range, deterministic timing resources and abundant logic elements support motor control, motion systems and real-time control logic implementations.
  • Secure embedded systems  Nonvolatile antifuse technology and FuseLock programming provide a hardware-secure platform for designs where IP protection and single-chip nonvolatility are required.
  • High-performance signal processing  Large logic capacity and embedded memory blocks enable implementation of complex DSP pipelines, custom accelerators and data-processing engines.

Unique Advantages

  • High logic capacity with embedded memory: Combine 32,256 logic elements and approximately 0.295 Mbits of SRAM to integrate large logic functions and local buffering on a single device, reducing board-level complexity.
  • Flexible, mixed-voltage I/O support: Bank-selectable I/O voltages and multiple supported standards simplify mixed-signal interfacing and help minimize level-shifting components.
  • Deterministic timing and high internal performance: Segmentable clocks and on-chip PLLs with wide input range and frequency synthesis support tight, predictable timing for high-speed designs.
  • Single-chip nonvolatile security: Antifuse architecture with FuseLock programming protects IP and removes the need for external configuration memory.
  • Industrial-ready operation: Rated −40 °C to 85 °C and packaged in a high-density 896-FBGA for compact, rugged board-level integration in industrial environments.

Why Choose AX2000-2FGG896I?

The AX2000-2FGG896I positions itself as a high-capacity, secure, single-chip FPGA solution for engineers designing industrial and high-performance embedded systems. With a large logic fabric, substantial embedded memory and flexible I/O capabilities, it enables consolidation of complex logic, buffering and interface functions into one nonvolatile device.

This device is appropriate for teams that need deterministic timing, on-chip FIFOs and secure programming in a compact BGA package while operating across an industrial temperature range. The Axcelerator architecture and embedded PLLs provide the timing and interface features necessary to scale high-throughput designs with reduced external component count.

Request a quote or submit an inquiry to evaluate AX2000-2FGG896I for your next design and confirm availability and pricing for your project needs.

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