AX2000-CQ352M

IC FPGA 198 I/O 352CQFP
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 198 294912 352-BFCQFP with Tie Bar

Quantity 369 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time44 Weeks
Datasheet

Specifications & Environmental

Device Package352-CQFP (75x75)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP with Tie BarNumber of I/O198Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-CQ352M – Axcelerator Field Programmable Gate Array (FPGA) IC 198 294912 352-BFCQFP with Tie Bar

The AX2000-CQ352M is a military-grade Axcelerator FPGA from Microchip Technology based on the AX architecture and antifuse CMOS process. It delivers a nonvolatile, single-chip FPGA solution with architectural features intended for high-performance, secure embedded designs.

Built for applications that require deterministic timing, high-speed I/O and on-chip buffering, this device combines up to 2,000,000 equivalent system gates with embedded SRAM/FIFO, segmentable clocks and integrated PLLs to support demanding logic and interface requirements.

Key Features

  • Core Performance 350+ MHz system performance and 500+ MHz internal performance are specified; integrated PLLs support a 14–200 MHz input range and frequency synthesis up to 1 GHz.
  • Logic Capacity Approximately 2,000,000 equivalent system gates with 32,256 logic elements (cells), providing substantial capacity for complex logic integration.
  • Embedded Memory & FIFOs Approximately 0.295 Mbits of embedded SRAM/FIFO (294,912 bits) with programmable FIFO control logic and variable-aspect 4,608-bit RAM blocks.
  • I/O Flexibility 198 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V), bank-selectable I/Os, and multiple single-ended and differential standards including LVDS and LVPECL; LVDS-capable channels up to 700 Mb/s are supported.
  • Security & Reliability Antifuse-based nonvolatile programming and FuseLock technology protect against reverse engineering and design theft; boundary-scan (JTAG) support enables standard test access.
  • Package, Power & Thermal Surface-mount 352-BFCQFP package with tie bar (supplier package: 352-CQFP, 75×75). Core supply range is 1.425 V to 1.575 V. Rated operating temperature range is –55 °C to 125 °C. RoHS compliant.
  • System Resources Segmentable clock resources and deterministic, user-controllable timing make the device suitable for designs that demand predictable timing behavior and in-system diagnostics via Microchip Silicon Explorer II.

Typical Applications

  • Military & Defense Systems — Military-grade temperature range (–55 °C to 125 °C) and antifuse nonvolatile configuration make the device suitable for secure, rugged embedded electronics in defense applications.
  • High-Speed Communications — LVDS-capable I/Os (up to 700 Mb/s) and high internal performance allow use in data transport, backplane interfacing and protocol bridging.
  • Packet Buffering & Data Processing — Embedded SRAM/FIFO and programmable FIFO control logic support data buffering, packet handling and high-throughput streaming operations.
  • Secure, Deterministic Control — Deterministic timing, segmentable clocks and on-chip PLLs suit real-time control systems that require predictable timing and secure, single-chip configuration.

Unique Advantages

  • Single-chip, nonvolatile solution: Antifuse technology provides a one-time-programmable, nonvolatile configuration that avoids external configuration memory.
  • High-performance timing and synthesis: Integrated PLLs, segmentable clocks and documented internal performance targets deliver precise timing control and frequency synthesis up to 1 GHz.
  • Flexible multi-standard I/Os: Mixed-voltage, bank-selectable I/Os and support for both single-ended and differential standards simplify interfacing across a wide range of peripherals and signaling environments.
  • Security features: FuseLock programming technology helps protect IP against reverse engineering and design theft.
  • Robust packaging and thermal range: Surface-mount 352-BFCQFP packaging and a –55 °C to 125 °C operating range support deployment in temperature-challenging and mission-critical environments.
  • Integrated memory and FIFO control: Nearly 295 kbits of embedded RAM with programmable FIFO logic reduces external memory requirements for many buffering and streaming applications.

Why Choose AX2000-CQ352M?

AX2000-CQ352M positions a high-capacity, high-performance Axcelerator FPGA into designs that require nonvolatile configuration, deterministic timing and robust I/O flexibility. Its combination of approximately 2,000,000 equivalent system gates, embedded SRAM/FIFO, integrated PLLs and security features makes it well suited for secure communications, data processing and military-grade embedded systems.

The device provides long-term design value through antifuse nonvolatile programming, comprehensive I/O options and support for in-system diagnostics, enabling designers to consolidate logic, reduce external components and maintain secure, predictable operation in demanding environments.

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