AX2000-FG896M

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 133 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-FG896M – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

The AX2000-FG896M is an Axcelerator antifuse FPGA built on Microchip's AX architecture, offering a single-chip, nonvolatile solution for high-performance, secure logic integration. Designed for military-grade applications, it delivers up to 2,000,000 equivalent system gates with embedded memory, flexible high-speed I/Os and on-chip clocking and PLL resources for demanding signal-processing and system-control tasks.

Key Features

  • Core Logic — Provides approximately 2,000,000 equivalent system gates implemented as 32,256 logic elements (10,752 dedicated registers and 21,504 combinatorial cells) for complex logic and state-machine designs.
  • Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of embedded SRAM/FIFO with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for buffering and packet handling.
  • High‑Speed I/Os — 586 user I/Os with multi-standard, bank-selectable support (1.5V, 1.8V, 2.5V, 3.3V); LVDS-capable channels up to 700 Mb/s and programmable slew rate/drive strength.
  • Clocking and PLLs — Segmentable clock resources and embedded PLLs supporting 14–200 MHz inputs and frequency synthesis up to 1 GHz for deterministic clock distribution and high-speed timing requirements.
  • Performance — System-level performance capabilities documented up to 350+ MHz system performance and 500+ MHz internal performance, supporting demanding timing budgets.
  • Nonvolatile Security — Antifuse programming with FuseLock™ technology for single-chip, nonvolatile configuration and protection against reverse engineering.
  • Power and Supply — Core supply range specified at 1.425 V to 1.575 V (nominal 1.5 V core) to support low-power operation; I/O banks support mixed-voltage operation.
  • Package and Thermal — 896-BGA package (896-FBGA, 31 × 31) and military-grade operating temperature range from −55 °C to +125 °C.
  • Test and Debug — Boundary-scan (IEEE 1149.1 JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II.

Typical Applications

  • Military and Aerospace Systems — Rugged, military-grade temperature range and nonvolatile antifuse configuration make the device suitable for secure, long-life mission electronics and control systems.
  • High‑Speed Data Transport — LVDS-capable I/Os and embedded FIFOs enable high-throughput serial/parallel data buffering and protocol bridging in communications and telemetry equipment.
  • Signal Processing and Acceleration — Large logic capacity and fast internal performance support real-time signal processing, protocol offload, and hardware acceleration tasks.

Unique Advantages

  • Single‑Chip Nonvolatile Solution: Antifuse architecture eliminates external configuration memory and secures bitstreams on-chip, simplifying system design and boot behavior.
  • Deterministic Timing and High Clock Rates: Segmentable clocks and on-chip PLLs enable controlled, high-speed timing suitable for deterministic system designs.
  • Flexible, Mixed‑Voltage I/O: Bank-selectable I/O standards and programmable drive/slew make board-level interfacing simpler across multiple voltage domains.
  • Embedded SRAM with FIFO Control: On-chip memory blocks with programmable FIFO support reduce external memory requirements and lower BOM complexity.
  • Military‑Grade Thermal Range: Specified operation from −55 °C to +125 °C addresses applications that require extended environmental robustness.

Why Choose AX2000-FG896M?

The AX2000-FG896M combines a high gate-count antifuse FPGA architecture with substantial embedded memory, extensive I/O capability and integrated clocking to deliver a compact, secure and deterministic platform for mission-critical designs. Its combination of 32,256 logic elements, approximately 0.295 Mbits of embedded RAM/FIFO, and 586 flexible I/Os in an 896-BGA package makes it appropriate for customers building secure communications, high-speed data processing, and ruggedized systems.

With military-grade temperature performance and on-chip nonvolatile configuration, the AX2000-FG896M is positioned for long-life, high-reliability deployments where integration density, timing control and security are priorities.

Request a quote or submit a procurement inquiry to learn more about availability and ordering for the AX2000-FG896M. Technical datasheet and product documentation are available to support evaluation and integration.

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