AX2000-FG896M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 133 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-FG896M – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
The AX2000-FG896M is an Axcelerator antifuse FPGA built on Microchip's AX architecture, offering a single-chip, nonvolatile solution for high-performance, secure logic integration. Designed for military-grade applications, it delivers up to 2,000,000 equivalent system gates with embedded memory, flexible high-speed I/Os and on-chip clocking and PLL resources for demanding signal-processing and system-control tasks.
Key Features
- Core Logic — Provides approximately 2,000,000 equivalent system gates implemented as 32,256 logic elements (10,752 dedicated registers and 21,504 combinatorial cells) for complex logic and state-machine designs.
- Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of embedded SRAM/FIFO with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for buffering and packet handling.
- High‑Speed I/Os — 586 user I/Os with multi-standard, bank-selectable support (1.5V, 1.8V, 2.5V, 3.3V); LVDS-capable channels up to 700 Mb/s and programmable slew rate/drive strength.
- Clocking and PLLs — Segmentable clock resources and embedded PLLs supporting 14–200 MHz inputs and frequency synthesis up to 1 GHz for deterministic clock distribution and high-speed timing requirements.
- Performance — System-level performance capabilities documented up to 350+ MHz system performance and 500+ MHz internal performance, supporting demanding timing budgets.
- Nonvolatile Security — Antifuse programming with FuseLock™ technology for single-chip, nonvolatile configuration and protection against reverse engineering.
- Power and Supply — Core supply range specified at 1.425 V to 1.575 V (nominal 1.5 V core) to support low-power operation; I/O banks support mixed-voltage operation.
- Package and Thermal — 896-BGA package (896-FBGA, 31 × 31) and military-grade operating temperature range from −55 °C to +125 °C.
- Test and Debug — Boundary-scan (IEEE 1149.1 JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II.
Typical Applications
- Military and Aerospace Systems — Rugged, military-grade temperature range and nonvolatile antifuse configuration make the device suitable for secure, long-life mission electronics and control systems.
- High‑Speed Data Transport — LVDS-capable I/Os and embedded FIFOs enable high-throughput serial/parallel data buffering and protocol bridging in communications and telemetry equipment.
- Signal Processing and Acceleration — Large logic capacity and fast internal performance support real-time signal processing, protocol offload, and hardware acceleration tasks.
Unique Advantages
- Single‑Chip Nonvolatile Solution: Antifuse architecture eliminates external configuration memory and secures bitstreams on-chip, simplifying system design and boot behavior.
- Deterministic Timing and High Clock Rates: Segmentable clocks and on-chip PLLs enable controlled, high-speed timing suitable for deterministic system designs.
- Flexible, Mixed‑Voltage I/O: Bank-selectable I/O standards and programmable drive/slew make board-level interfacing simpler across multiple voltage domains.
- Embedded SRAM with FIFO Control: On-chip memory blocks with programmable FIFO support reduce external memory requirements and lower BOM complexity.
- Military‑Grade Thermal Range: Specified operation from −55 °C to +125 °C addresses applications that require extended environmental robustness.
Why Choose AX2000-FG896M?
The AX2000-FG896M combines a high gate-count antifuse FPGA architecture with substantial embedded memory, extensive I/O capability and integrated clocking to deliver a compact, secure and deterministic platform for mission-critical designs. Its combination of 32,256 logic elements, approximately 0.295 Mbits of embedded RAM/FIFO, and 586 flexible I/Os in an 896-BGA package makes it appropriate for customers building secure communications, high-speed data processing, and ruggedized systems.
With military-grade temperature performance and on-chip nonvolatile configuration, the AX2000-FG896M is positioned for long-life, high-reliability deployments where integration density, timing control and security are priorities.
Request a quote or submit a procurement inquiry to learn more about availability and ordering for the AX2000-FG896M. Technical datasheet and product documentation are available to support evaluation and integration.

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