AX2000-FGG896M

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 1,311 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-FGG896M – Axcelerator FPGA, 2,000,000 Equivalent Gates, 586 I/O, 896-BGA

The AX2000-FGG896M is a Microchip Technology Axcelerator antifuse FPGA offering up to 2,000,000 equivalent system gates in a single-chip, nonvolatile solution. Built on a 0.15 µm CMOS antifuse process with seven metal layers, it targets high-performance, high-security applications that require deterministic timing, on-chip memory and flexible multi-standard I/Os.

With military-grade qualification and an operating range from −55 °C to 125 °C, the device is well suited to systems that demand robust environmental tolerance, secure programming (FuseLock™) and high I/O density presented in an 896-ball BGA (896-FBGA, 31×31) package.

Key Features

  • Core & Logic Up to 2,000,000 equivalent system gates and 32,256 logic elements deliver high integration density for complex digital designs.
  • Embedded Memory & FIFOs Approximately 0.295 Mbits (294,912 bits) of embedded SRAM with programmable FIFO control logic supports wide and independent read/write port configurations.
  • I/O and Interface Flexibility 586 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL; LVDS I/Os capable of 700 Mb/s.
  • Performance & Timing System performance beyond 350 MHz and internal performance beyond 500 MHz are supported, together with segmentable clocks and deterministic, user-controllable timing resources.
  • Phase-Locked Loop (PLL) Embedded PLL with a 14–200 MHz input range and frequency synthesis capability up to 1 GHz enables on-chip clock generation and management.
  • Security & Nonvolatile Programming Antifuse single-chip, nonvolatile architecture with FuseLock™ programming technology protects against reverse engineering and design theft.
  • Package, Power & Temperature Supplied in an 896-BGA (896-FBGA, 31×31) package, the device runs on a core voltage range of 1.425 V to 1.575 V and is rated for military-grade operation from −55 °C to 125 °C.
  • Design and Test Support Boundary-scan (JTAG) and in-system diagnostic/debug capabilities are available for bring-up and production test.

Typical Applications

  • Military & Aerospace Systems Military-grade temperature range and antifuse nonvolatile programming make the part suitable for secure, ruggedized avionics, mission systems and tactical electronics.
  • High-Speed Communications High I/O count and LVDS-capable interfaces support protocol bridging, line cards and backplane interfaces that require multi-gigabit link support and dense I/O.
  • Data Acquisition & Real-Time Processing Embedded SRAM/FIFO resources and deterministic timing enable buffering, preprocessing and high-throughput data handling in instrumentation or sensor systems.
  • Secure, High-Performance Custom Logic Antifuse programming and FuseLock™ protect IP while providing ASIC-like performance for custom controllers, encryption engines or protocol offloads.

Unique Advantages

  • High-density integration: 2,000,000 equivalent system gates and 32,256 logic elements reduce board-level component count for complex designs.
  • Nonvolatile, tamper-resistant programming: Antifuse architecture and FuseLock™ technology provide persistent configuration and protection against reverse engineering.
  • Wide I/O flexibility: Bank-selectable mixed-voltage I/Os and support for LVDS/LVPECL enable interfacing to a broad set of external devices without level-shifting overhead.
  • Deterministic, high-speed operation: Segmentable clocks, embedded PLLs and documented high-frequency performance support timing-critical applications.
  • Ruggedized temperature range: Military-grade −55 °C to 125 °C operation supports deployment in demanding environmental conditions.
  • On-chip memory and FIFOs: Nearly 295 kbits of embedded SRAM with configurable FIFO control simplifies data buffering and streaming functions.

Why Choose AX2000-FGG896M?

The AX2000-FGG896M positions itself as a high-density, secure and high-performance FPGA option for systems that require nonvolatile configuration, high I/O bandwidth and military-grade environmental tolerance. Its combination of 2,000,000 equivalent gates, extensive embedded SRAM/FIFO resources and flexible multi-standard I/Os supports complex protocol handling, real-time processing and secure logic implementations.

Designed for customers building robust, long-life systems—especially in defense, aerospace and high-performance communications—the AX2000-FGG896M offers a scalable, single-chip solution backed by Microchip’s Axcelerator family architecture and on-chip features such as PLLs, segmentable clocks and FuseLock™ protection.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the AX2000-FGG896M.

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