AX2000-FGG896M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 1,311 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-FGG896M – Axcelerator FPGA, 2,000,000 Equivalent Gates, 586 I/O, 896-BGA
The AX2000-FGG896M is a Microchip Technology Axcelerator antifuse FPGA offering up to 2,000,000 equivalent system gates in a single-chip, nonvolatile solution. Built on a 0.15 µm CMOS antifuse process with seven metal layers, it targets high-performance, high-security applications that require deterministic timing, on-chip memory and flexible multi-standard I/Os.
With military-grade qualification and an operating range from −55 °C to 125 °C, the device is well suited to systems that demand robust environmental tolerance, secure programming (FuseLock™) and high I/O density presented in an 896-ball BGA (896-FBGA, 31×31) package.
Key Features
- Core & Logic Up to 2,000,000 equivalent system gates and 32,256 logic elements deliver high integration density for complex digital designs.
- Embedded Memory & FIFOs Approximately 0.295 Mbits (294,912 bits) of embedded SRAM with programmable FIFO control logic supports wide and independent read/write port configurations.
- I/O and Interface Flexibility 586 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL; LVDS I/Os capable of 700 Mb/s.
- Performance & Timing System performance beyond 350 MHz and internal performance beyond 500 MHz are supported, together with segmentable clocks and deterministic, user-controllable timing resources.
- Phase-Locked Loop (PLL) Embedded PLL with a 14–200 MHz input range and frequency synthesis capability up to 1 GHz enables on-chip clock generation and management.
- Security & Nonvolatile Programming Antifuse single-chip, nonvolatile architecture with FuseLock™ programming technology protects against reverse engineering and design theft.
- Package, Power & Temperature Supplied in an 896-BGA (896-FBGA, 31×31) package, the device runs on a core voltage range of 1.425 V to 1.575 V and is rated for military-grade operation from −55 °C to 125 °C.
- Design and Test Support Boundary-scan (JTAG) and in-system diagnostic/debug capabilities are available for bring-up and production test.
Typical Applications
- Military & Aerospace Systems Military-grade temperature range and antifuse nonvolatile programming make the part suitable for secure, ruggedized avionics, mission systems and tactical electronics.
- High-Speed Communications High I/O count and LVDS-capable interfaces support protocol bridging, line cards and backplane interfaces that require multi-gigabit link support and dense I/O.
- Data Acquisition & Real-Time Processing Embedded SRAM/FIFO resources and deterministic timing enable buffering, preprocessing and high-throughput data handling in instrumentation or sensor systems.
- Secure, High-Performance Custom Logic Antifuse programming and FuseLock™ protect IP while providing ASIC-like performance for custom controllers, encryption engines or protocol offloads.
Unique Advantages
- High-density integration: 2,000,000 equivalent system gates and 32,256 logic elements reduce board-level component count for complex designs.
- Nonvolatile, tamper-resistant programming: Antifuse architecture and FuseLock™ technology provide persistent configuration and protection against reverse engineering.
- Wide I/O flexibility: Bank-selectable mixed-voltage I/Os and support for LVDS/LVPECL enable interfacing to a broad set of external devices without level-shifting overhead.
- Deterministic, high-speed operation: Segmentable clocks, embedded PLLs and documented high-frequency performance support timing-critical applications.
- Ruggedized temperature range: Military-grade −55 °C to 125 °C operation supports deployment in demanding environmental conditions.
- On-chip memory and FIFOs: Nearly 295 kbits of embedded SRAM with configurable FIFO control simplifies data buffering and streaming functions.
Why Choose AX2000-FGG896M?
The AX2000-FGG896M positions itself as a high-density, secure and high-performance FPGA option for systems that require nonvolatile configuration, high I/O bandwidth and military-grade environmental tolerance. Its combination of 2,000,000 equivalent gates, extensive embedded SRAM/FIFO resources and flexible multi-standard I/Os supports complex protocol handling, real-time processing and secure logic implementations.
Designed for customers building robust, long-life systems—especially in defense, aerospace and high-performance communications—the AX2000-FGG896M offers a scalable, single-chip solution backed by Microchip’s Axcelerator family architecture and on-chip features such as PLLs, segmentable clocks and FuseLock™ protection.
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Date Founded: 1989
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