AX2000-FGG896I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 510 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-FGG896I – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
The AX2000-FGG896I is an Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture. It delivers a high-density, nonvolatile programmable fabric with up to 2,000,000 equivalent system gates and 32,256 logic elements for complex digital designs.
Designed for industrial-grade embedded systems, the device combines high I/O density, integrated embedded SRAM/FIFO, and segmentable clock and PLL resources to support high-performance data-paths, protocol bridging and timing-critical applications.
Key Features
- Core Architecture & Capacity — Antifuse-based Axcelerator architecture providing up to 2,000,000 equivalent system gates and 32,256 logic elements for dense logic integration.
- Embedded Memory — Approximately 0.295 Mbits of embedded SRAM/FIFO (294,912 bits) with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for efficient buffering and data handling.
- I/O & Interfaces — 586 user I/Os with support for mixed voltage operation across banks and differential standards; I/Os capable of LVDS operation up to 700 Mb/s.
- Clocking & PLLs — Segmentable clock resources and on-chip PLLs for flexible clock management and frequency synthesis.
- Performance — Architecture supports high internal performance suitable for demanding system-level timing (refer to device datasheet for detailed timing specifications).
- Power — Core voltage range specified at 1.425 V to 1.575 V for the device.
- Package & Mounting — 896-ball BGA package (896-FBGA, 31 × 31) in a surface-mount form factor, suitable for space-efficient board designs.
- Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 85 °C.
- Security & Test — Antifuse, nonvolatile programming with support for boundary-scan (JTAG) and FuseLock programming technology as part of the Axcelerator family feature set.
- Standards & Process — Manufactured on an advanced 0.15 μm CMOS antifuse process with multiple metal layers for reliable routing and performance.
Typical Applications
- High-Speed Data Interfaces — LVDS-capable I/Os and embedded FIFOs make the AX2000 suitable for buffering, serialization/deserialization and protocol bridging in high-throughput links.
- Industrial Control & Automation — Industrial operating temperature and high logic density support complex motor control, sensor aggregation and deterministic timing functions.
- Telecommunications & Networking — Large logic and memory resources enable packet processing, traffic management and custom protocol engines.
- Embedded System Acceleration — On-chip RAM and abundant logic elements allow hardware acceleration of compute-intensive tasks and custom signal processing pipelines.
Unique Advantages
- High-density, nonvolatile integration: Antifuse programming delivers single-chip, nonvolatile logic integration that preserves design state without external configuration memory.
- Large on-chip RAM and FIFO support: Nearly 0.295 Mbits of embedded memory with programmable FIFO control reduces external memory needs for many buffering and streaming applications.
- Extensive I/O flexibility: Hundreds of user I/Os with mixed-voltage banking and support for differential standards enable broad interfacing options without auxiliary components.
- Industrial temperature rating: Qualified for −40 °C to 85 °C operation to meet demanding environmental requirements in industrial systems.
- Compact, board-friendly packaging: 896-ball FBGA (31 × 31) offers high I/O count in a compact surface-mount form factor to save PCB area.
Why Choose AX2000-FGG896I?
The AX2000-FGG896I combines the Axcelerator antifuse architecture with high logic capacity, substantial embedded memory, and broad I/O capabilities to address complex, timing-sensitive embedded designs. Its industrial temperature rating and compact 896-BGA packaging make it suitable for dense, rugged systems that require on-chip, nonvolatile programmability.
For engineers building high-throughput data paths, protocol bridges, or hardware-accelerated functions, this device offers a balance of integration and deterministic performance while reducing external component count and configuration complexity.
Request a quote or submit an inquiry for pricing and availability to evaluate the AX2000-FGG896I for your next design.

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