AX2000-FGG896

The AX2000-FGG896 is a commercial-grade Axcelerator antifuse FPGA offering up to 2,000,000 equivalent system gates in a 896‑ball fine BGA. Based on Microchip’s AX architecture and a 0.15 µm CMOS antifuse process, this device delivers nonvolatile single‑chip programmability, on‑chip embedded SRAM/FIFO resources, and a flexible multi‑standard I/O fabric. It targets high‑performance embedded logic, protocol bridging, and system control where deterministic timing, in-system security and integrated memory/FIFO are required.

Key Features

• Core and Architecture AX architecture antifuse FPGA with nonvolatile single‑chip solution and FuseLock programming technology for design security and reverse‑engineering protection.
• Logic Capacity Approximately 2,000,000 equivalent system gates and 32,256 logic elements, enabling large, high‑density logic implementations.
• Embedded Memory & FIFOs Approximately 0.295 Mbits of embedded SRAM/FIFO (294,912 total bits) with variable‑aspect 4,608‑bit RAM blocks and programmable embedded FIFO control logic.
• I/O and Interface Flexibility 586 user I/Os with bank‑selectable mixed‑voltage operation (supporting 1.5V, 1.8V, 2.5V, 3.3V) and support for differential and single‑ended standards including LVDS and LVPECL; LVDS I/Os capable of 700 Mb/s.
• Clocking and PLLs Segmentable clock resources and embedded PLLs (14–200 MHz input range, frequency synthesis up to 1 GHz) for deterministic and user‑controllable timing.
• Performance Family performance targets include 350+ MHz system performance and 500+ MHz internal performance as documented for Axcelerator devices.
• Package and Mounting Surface‑mount 896‑FBGA package (31 × 31 mm fine BGA) suitable for automated PCB assembly.
• Power and Temperature Core voltage supply range 1.425 V to 1.575 V (nominal 1.5 V); commercial operating temperature range 0 °C to 70 °C.
• Diagnostics and Testability In‑system diagnostic and debug capability with Microchip Silicon Explorer II and boundary‑scan (JTAG, IEEE 1149.1) support.
• Standards and Compliance Manufactured with RoHS‑compliant processes.

Typical Applications

• High‑performance protocol bridging — Use the AX2000’s large logic capacity and high‑speed I/Os for custom protocol conversion and multi‑standard interface aggregation.
• Embedded packet buffering and data movers — On‑chip SRAM blocks with programmable FIFO control accelerate buffering and throughput in data path designs.
• Security and control modules — Antifuse nonvolatile programming and FuseLock technology provide a secure programmable platform for protected logic and secure boot functions.
• System timing and clock management — Integrated PLLs and segmentable clock resources support systems that require deterministic timing and frequency synthesis.

Unique Advantages

• Nonvolatile, single‑chip solution: Antifuse programming eliminates the need for external configuration memory, simplifying system design and boot sequencing.
• High logic and memory integration: Large equivalent gate count and nearly 0.295 Mbits of embedded RAM reduce external component count and board area.
• Flexible multi‑standard I/Os: Bank‑selectable voltage domains and both differential and single‑ended I/O standards support mixed‑voltage system integration.
• Deterministic timing with integrated PLLs: On‑chip PLLs and segmentable clocks enable tight timing control for performance‑sensitive applications.
• Security features: FuseLock programming technology helps protect intellectual property and design integrity.
• Commercial availability with RoHS compliance: Designed for commercial temperature systems and built with RoHS‑compliant processes.

Why Choose AX2000-FGG896?

The AX2000-FGG896 positions itself as a high‑capacity, secure, and integrated FPGA option for commercial systems that require large logic density, embedded memory/FIFO resources, and flexible I/O standards. Its antifuse nonvolatile architecture and FuseLock protection deliver a stable, tamper‑resistant programmed device suitable for long‑lifecycle deployments where in‑system programmability and predictable behavior matter.

This device is well suited for engineers implementing complex protocol handling, high‑throughput data paths, and systems needing robust timing control without relying on external configuration devices. The combination of high gate count, substantial embedded RAM, and multi‑standard I/Os offers a compact, integrable solution that reduces BOM complexity and simplifies board‑level design.

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