AX2000-FG896I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 31 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-FG896I – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
The AX2000-FG896I is an Axcelerator-series antifuse FPGA built on Microchip’s AX architecture. It delivers a single-chip, nonvolatile solution with up to 2,000,000 equivalent system gates, designed for high-performance, deterministic embedded logic and I/O-intensive systems.
With 586 user I/Os, approximately 0.295 Mbits of embedded memory, embedded FIFOs, and on-chip PLLs, this industrial-grade device targets applications that require high I/O density, security against reverse engineering, and reliable operation across a wide temperature range.
Key Features
- Core & Architecture Antifuse-based AX architecture providing a single-chip, nonvolatile FPGA solution and up to 2,000,000 equivalent system gates.
- Logic Resources 32,256 logic elements and 10,752 dedicated flip-flops for large-scale combinatorial and sequential logic integration.
- Embedded Memory & FIFOs Approximately 0.295 Mbits of embedded SRAM/FIFO with programmable FIFO control logic and variable-aspect 4,608-bit RAM blocks.
- High-performance I/Os 586 user I/Os with support for high-speed differential standards (LVDS, LVPECL) and up to 700 Mb/s LVDS-capable channels; bank-selectable, mixed-voltage I/O (1.5V, 1.8V, 2.5V, 3.3V).
- Clocking & PLLs Segmentable clock resources and embedded PLL(s) with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
- Power & Voltage Core voltage specified between 1.425 V and 1.575 V (1.5V core nominal) for low-power operation.
- Package & Mounting 896-ball FBGA (31 × 31 mm) surface-mount package (896-BGA / 896-FBGA), designed for high-density board layouts.
- Industrial Reliability Industrial operating temperature range of −40°C to 85°C and RoHS-compliant construction.
- Security & Test FuseLock™ programming technology to protect against reverse engineering, plus boundary-scan (JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II.
Typical Applications
- Communications & Networking High I/O count and LVDS-capable channels support dense, high-speed link interfacing and protocol bridging.
- High-speed Data Capture & Processing Embedded FIFOs and on-chip RAM enable buffering and deterministic timing for data acquisition and processing pipelines.
- Secure and Proprietary Systems Antifuse nonvolatile programming and FuseLock™ protection are suitable for designs that require IP security and tamper resistance.
- Industrial Control & Automation Industrial temperature rating and robust I/O options make the device suitable for demanding industrial logic, control, and interface tasks.
Unique Advantages
- Highly integrated solution: Combines large logic capacity, on-chip RAM/FIFOs and PLLs to minimize external components and reduce BOM complexity.
- Nonvolatile, tamper-resistant programming: Antifuse architecture with FuseLock™ protects designs from reverse engineering and unauthorized modification.
- Deterministic, high-speed operation: Segmentable clocks, user-controllable timing and PLL frequency synthesis support deterministic system-level timing.
- Extensive I/O flexibility: Bank-selectable mixed-voltage I/Os and support for differential and single-ended standards provide interface versatility for diverse peripherals.
- Industrial-grade robustness: Specified for −40°C to 85°C operation and RoHS-compliant manufacturing for long-term deployment in industrial environments.
- Diagnostic and testability: In-system diagnostic capability with Silicon Explorer II and JTAG boundary-scan simplify bring-up and production test.
Why Choose AX2000-FG896I?
The AX2000-FG896I positions itself as a high-capacity, secure FPGA for designs that demand large logic resources, dense I/O, and deterministic performance. Its antifuse, single-chip architecture and embedded memory/FIFO features make it appropriate for systems where nonvolatile configuration, IP protection, and high-speed data handling are priorities.
This device is well suited to engineers building communications equipment, industrial controllers, data acquisition systems, or any application that requires a combination of high I/O count, embedded buffering, and industrial-temperature reliability, while benefiting from Microchip’s diagnostic and security features.
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