AX2000-FG896I

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 31 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-FG896I – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

The AX2000-FG896I is an Axcelerator-series antifuse FPGA built on Microchip’s AX architecture. It delivers a single-chip, nonvolatile solution with up to 2,000,000 equivalent system gates, designed for high-performance, deterministic embedded logic and I/O-intensive systems.

With 586 user I/Os, approximately 0.295 Mbits of embedded memory, embedded FIFOs, and on-chip PLLs, this industrial-grade device targets applications that require high I/O density, security against reverse engineering, and reliable operation across a wide temperature range.

Key Features

  • Core & Architecture  Antifuse-based AX architecture providing a single-chip, nonvolatile FPGA solution and up to 2,000,000 equivalent system gates.
  • Logic Resources  32,256 logic elements and 10,752 dedicated flip-flops for large-scale combinatorial and sequential logic integration.
  • Embedded Memory & FIFOs  Approximately 0.295 Mbits of embedded SRAM/FIFO with programmable FIFO control logic and variable-aspect 4,608-bit RAM blocks.
  • High-performance I/Os  586 user I/Os with support for high-speed differential standards (LVDS, LVPECL) and up to 700 Mb/s LVDS-capable channels; bank-selectable, mixed-voltage I/O (1.5V, 1.8V, 2.5V, 3.3V).
  • Clocking & PLLs  Segmentable clock resources and embedded PLL(s) with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
  • Power & Voltage  Core voltage specified between 1.425 V and 1.575 V (1.5V core nominal) for low-power operation.
  • Package & Mounting  896-ball FBGA (31 × 31 mm) surface-mount package (896-BGA / 896-FBGA), designed for high-density board layouts.
  • Industrial Reliability  Industrial operating temperature range of −40°C to 85°C and RoHS-compliant construction.
  • Security & Test  FuseLock™ programming technology to protect against reverse engineering, plus boundary-scan (JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II.

Typical Applications

  • Communications & Networking  High I/O count and LVDS-capable channels support dense, high-speed link interfacing and protocol bridging.
  • High-speed Data Capture & Processing  Embedded FIFOs and on-chip RAM enable buffering and deterministic timing for data acquisition and processing pipelines.
  • Secure and Proprietary Systems  Antifuse nonvolatile programming and FuseLock™ protection are suitable for designs that require IP security and tamper resistance.
  • Industrial Control & Automation  Industrial temperature rating and robust I/O options make the device suitable for demanding industrial logic, control, and interface tasks.

Unique Advantages

  • Highly integrated solution: Combines large logic capacity, on-chip RAM/FIFOs and PLLs to minimize external components and reduce BOM complexity.
  • Nonvolatile, tamper-resistant programming: Antifuse architecture with FuseLock™ protects designs from reverse engineering and unauthorized modification.
  • Deterministic, high-speed operation: Segmentable clocks, user-controllable timing and PLL frequency synthesis support deterministic system-level timing.
  • Extensive I/O flexibility: Bank-selectable mixed-voltage I/Os and support for differential and single-ended standards provide interface versatility for diverse peripherals.
  • Industrial-grade robustness: Specified for −40°C to 85°C operation and RoHS-compliant manufacturing for long-term deployment in industrial environments.
  • Diagnostic and testability: In-system diagnostic capability with Silicon Explorer II and JTAG boundary-scan simplify bring-up and production test.

Why Choose AX2000-FG896I?

The AX2000-FG896I positions itself as a high-capacity, secure FPGA for designs that demand large logic resources, dense I/O, and deterministic performance. Its antifuse, single-chip architecture and embedded memory/FIFO features make it appropriate for systems where nonvolatile configuration, IP protection, and high-speed data handling are priorities.

This device is well suited to engineers building communications equipment, industrial controllers, data acquisition systems, or any application that requires a combination of high I/O count, embedded buffering, and industrial-temperature reliability, while benefiting from Microchip’s diagnostic and security features.

Request a quote or submit a product inquiry to obtain pricing, lead times, and availability for AX2000-FG896I. A sales or distribution channel will provide the next steps for purchase and technical support.

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