AX250-1FG256
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA |
|---|---|
| Quantity | 764 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 138 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-1FG256 – Axcelerator FPGA, 138 I/O, 256-LBGA
The AX250-1FG256 is a Microchip Technology Axcelerator antifuse FPGA based on the AX architecture, delivering a single-chip, nonvolatile solution for high-performance embedded logic. It combines deterministic timing, segmentable clocks, PLL-based clock synthesis and embedded SRAM/FIFO control to address designs requiring secure, ASIC-like performance and on-chip memory integration.
With 250,000 equivalent system gates, 4,224 logic elements and approximately 55 kbits of embedded RAM, this device targets applications that need high internal throughput, flexible I/O standards and a compact 256-LBGA package for surface-mount system integration.
Key Features
- Core Capacity — 250,000 equivalent system gates and 4,224 logic elements provide significant on-chip logic density for complex custom functions.
- Embedded Memory & FIFOs — Approximately 55 kbits of embedded SRAM with programmable FIFO control logic supports packet buffering and data staging on-chip.
- I/O Count & Standards — 138 user I/Os with support for high-speed differential interfaces; LVDS-capable channels rated up to 700 Mb/s as specified in the product family.
- Clocking & PLLs — Segmentable clock resources and embedded PLLs deliver flexible clocking and frequency synthesis to support system timing needs.
- Performance — Family-level system performance documented at 350+ MHz and internal performance up to 500+ MHz to support demanding logic and data-path throughput.
- Nonvolatile Antifuse Technology — Single-chip, nonvolatile programming with FuseLock™ technology to protect intellectual property and prevent reverse engineering.
- Power & Supply — Nominal 1.5 V core operation with specified supply range of 1.425 V to 1.575 V for core power.
- Package & Mounting — 256-LBGA (supplier 256-FPBGA, 17×17) in a surface-mount format for compact board-level integration.
- Commercial Temperature Grade — Rated for 0 °C to 70 °C operation; RoHS-compliant.
- Design & Test Support — Deterministic timing, boundary-scan (JTAG) and in-system diagnostic/debug capability with Microchip Silicon Explorer II as part of the Axcelerator family feature set.
Typical Applications
- High-speed data interfaces — Use the device’s LVDS-capable I/Os and embedded FIFOs for bridging and buffering between high-throughput serial or parallel links.
- Secure/Proprietary logic — Antifuse, nonvolatile programming and FuseLock™ protect designs that require secure bitstream storage and IP protection.
- ASIC replacement / Custom SOC glue logic — 250k gates and integrated memory enable migration of custom functions from ASICs to a reprogrammable FPGA architecture with ASIC-like performance.
- Deterministic real-time control — Segmentable clocks, PLL frequency synthesis and deterministic timing features support real-time logic and control applications requiring predictable timing.
Unique Advantages
- Single-chip nonvolatile solution: Antifuse technology provides permanent configuration without external flash, simplifying system boot and eliminating external configuration components.
- High internal throughput: Documented family-level internal performance up to 500+ MHz and system performance beyond 350 MHz enable dense, high-speed logic implementations.
- Protected intellectual property: FuseLock™ programming technology and antifuse programming reduce risk of reverse engineering for proprietary designs.
- Flexible on-chip memory: Embedded SRAM blocks with programmable FIFO control let you implement buffering and width-configurable memory without external RAM.
- Broad I/O capabilities: Mixed-voltage, bank-selectable I/Os and support for differential standards enable easy interfacing to a variety of system peripherals and high-speed links.
- Compact, surface-mount package: 256-LBGA (17×17) provides a small form factor for board-level space-constrained designs while supporting up to 138 user I/Os.
Why Choose AX250-1FG256?
The AX250-1FG256 is positioned for designers who need a compact, nonvolatile FPGA offering ASIC-like performance, robust on-chip memory and protected programming. With 250k equivalent gates, 4,224 logic elements, and embedded FIFO-capable SRAM, it delivers the integration and deterministic timing required for complex logic, high-speed data handling and secure designs.
Its surface-mount 256-LBGA package, RoHS compliance and a defined commercial temperature range make it a practical choice for space-aware, performance-focused embedded systems. The device’s architecture and in-system debug features support efficient development and long-term maintainability for production deployments.
Request a quote or submit an inquiry to get pricing, availability and support information for the AX250-1FG256. Our team can assist with lead times, packaging options and technical details to help you evaluate this FPGA for your design.

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