AX250-1FG256M

IC FPGA 138 I/O 256FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA

Quantity 1,713 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case256-LBGANumber of I/O138Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-1FG256M – Axcelerator Field Programmable Gate Array (FPGA) IC, 250,000 gates, 256-LBGA

The AX250-1FG256M is an Axcelerator antifuse FPGA from Microchip Technology, delivering 250,000 gates in a single-chip, nonvolatile FPGA architecture. Built on a 0.15 μm CMOS antifuse process with seven metal layers, it provides on-chip embedded SRAM with FIFO control logic, segmentable clocks and embedded PLLs for deterministic, high-performance logic implementations.

Targeted for military-grade and other rugged systems, this device combines security-focused programming technology with a wide operating temperature range and surface-mount 256-LBGA packaging to meet demanding deployment environments.

Key Features

  • Core Performance — 250,000 gates and 4,224 logic elements deliver substantial combinatorial and registered resources for mid-density FPGA designs.
  • Embedded Memory and FIFOs — Approximately 55,296 bits of on-chip RAM organized as configurable RAM blocks; embedded FIFO control logic supports high-performance buffering and data flow control.
  • I/O Flexibility — 138 user I/Os with family-level support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and a variety of single-ended and differential standards, enabling flexible interface choices.
  • Clocking and PLLs — Segmentable clock resources and embedded PLLs (14–200 MHz input range, frequency synthesis capabilities up to 1 GHz) support precise, deterministic timing and high-speed internal operation.
  • Security and Nonvolatile Programming — Antifuse single-chip, nonvolatile architecture with FuseLock programming technology to protect designs from reverse engineering and tampering.
  • Robust Operating Range — Military-grade device with operating temperature from -55°C to 125°C and a core voltage supply range of 1.425 V to 1.575 V for deployment in harsh environments.
  • Package and Mounting — Surface-mount 256-LBGA package (supplier reference: 256-FPBGA, 17×17) for compact board integration.
  • Regulatory — RoHS compliant.

Typical Applications

  • Military and Rugged Systems — Military-grade temperature range and antifuse nonvolatile programming make the device suitable for applications that require long-term field reliability and tamper resistance.
  • High-Performance Data Pathing — Embedded FIFOs, on-chip SRAM and high internal performance support packet buffering, protocol bridging and data stream management.
  • Deterministic Timing Designs — Segmentable clocks and embedded PLLs enable precise timing control for synchronous systems and timing-critical logic.

Unique Advantages

  • Single-Chip Nonvolatile Solution: Antifuse architecture eliminates the need for external configuration memory and provides inherent nonvolatility once programmed.
  • Design Security: FuseLock programming technology protects against reverse engineering and unauthorized access to bitstream information.
  • Wide Temperature Operation: Rated from -55°C to 125°C and specified as military grade, supporting deployment in demanding thermal environments.
  • Flexible I/O and Clocking: Bank-selectable, mixed-voltage I/Os and segmentable clock resources with PLLs enable adaptable interfacing and deterministic system timing.
  • Compact, Surface-Mount Packaging: 256-LBGA (17×17) package provides a high-density mounting option for space-constrained boards.
  • RoHS Compliant: Meets lead-free requirements for modern electronics manufacturing processes.

Why Choose AX250-1FG256M?

The AX250-1FG256M positions itself as a secure, mid-density antifuse FPGA that balances performance, on-chip memory and configurable I/O in a military-grade package. Its single-chip nonvolatile architecture and FuseLock protection are well suited to applications where long-term configurability and design security are priorities.

Designers seeking deterministic timing, embedded FIFO capability and a compact 256-LBGA solution will find the AX250-1FG256M a practical option for rugged and high-reliability systems that require a secure FPGA platform with clear electrical and thermal specifications.

Request a quote or submit a technical inquiry for the AX250-1FG256M to receive pricing and availability information tailored to your project needs.

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