AX250-1FG484M

IC FPGA 248 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

Quantity 179 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-1FG484M – Axcelerator Field Programmable Gate Array (FPGA), 248 I/O, ~55 kbit RAM, 484-BGA

The AX250-1FG484M is an Axcelerator family FPGA from Microchip Technology based on the AX architecture and CMOS antifuse process. It combines nonvolatile antifuse programming with high-density logic — 250,000 equivalent system gates and 4,224 logic elements — for secure, high-performance embedded logic.

Designed for applications that require robust operation and high-speed I/O, this military-grade, surface-mount device offers broad I/O flexibility, embedded RAM and FIFO resources, and on-chip clocking and PLL capabilities for demanding communications and signal-processing systems.

Key Features

  • Core density — 250,000 equivalent system gates and 4,224 logic elements provide significant programmable logic capacity for mid-range FPGA designs.
  • Embedded memory — Approximately 55 kbits of embedded RAM/FIFO resources enabling local buffering and memory-mapped logic functions.
  • I/O and interface flexibility — 248 user I/Os with support for multi-standard I/O families and LVDS-capable channels up to high data rates; bank-selectable voltages and programmable drive/slew control enable mixed-voltage designs.
  • Clocking and PLLs — Integrated PLL resources and segmentable clock architecture support deterministic timing and frequency synthesis across the device.
  • Power and supply — Nominal 1.5 V core operation with specified supply range of 1.425 V to 1.575 V for the core.
  • Package and mounting — 484-ball BGA (484-FPBGA, 23 × 23) in a surface-mount package suited for dense board-level integration.
  • Rugged operating range — Military-grade device specified for operation from −55 °C to 125 °C.
  • Security and system tools — Antifuse, single-chip nonvolatile programming and FuseLock™ programming technology protect against reverse engineering; in-system diagnostic and debug support is available via Microchip tools documented for the Axcelerator family.

Typical Applications

  • Military and aerospace systems — Military-grade temperature range and robust package make the device suitable for defense electronics requiring nonvolatile programmable logic and secure configuration.
  • High-speed communications — LVDS-capable I/Os and high internal performance support serializer/deserializer front-ends, protocol bridging, and line-rate processing.
  • Signal processing and embedded control — Significant logic capacity and embedded RAM/FIFO resources enable real-time data buffering, preprocessing and custom accelerator functions.
  • Secure, single-chip solutions — Antifuse nonvolatile programming combined with FuseLock technology is well suited to designs needing in-field programmability with built-in design protection.

Unique Advantages

  • Nonvolatile antifuse architecture: Single-chip, one-time-programmable solution eliminates the need for external configuration memory and simplifies secure system design.
  • Deterministic timing and integrated PLLs: On-chip PLLs and segmentable clock resources facilitate stable, high-performance timing for synchronous designs.
  • Bank-selectable, multi-standard I/Os: Flexible I/O voltage selection and programmable drive/slew make the device adaptable to mixed-voltage systems and varied interface standards.
  • Military-grade thermal range: Rated from −55 °C to 125 °C for deployments that require extended environmental tolerance.
  • Compact, high-density package: 484-ball FPBGA (23 × 23) enables a high I/O count and dense board-level integration while maintaining surface-mount assembly compatibility.

Why Choose AX250-1FG484M?

The AX250-1FG484M positions itself as a secure, mid-density FPGA option within the Axcelerator family, delivering 250,000 equivalent gates, extensive I/O, and embedded RAM in a military-grade, surface-mount 484-BGA package. Its antifuse, nonvolatile architecture and FuseLock programming provide a protected configuration model while integrated PLLs and segmentable clocks support high-performance timing requirements.

Choose this device for designs that need a balance of programmable logic capacity, secure one-time configuration, and broad I/O flexibility across challenging thermal environments. The AX250-1FG484M is suitable for customers seeking a durable, high-performance FPGA backed by Microchip's Axcelerator family features and tooling support.

Request a quote or submit an inquiry for AX250-1FG484M to get pricing, availability, and ordering information for your next design.

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