AX250-1FGG256I

IC FPGA 138 I/O 256FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA

Quantity 403 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O138Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-1FGG256I – Axcelerator FPGA, 250,000 gates, 256-LBGA

The AX250-1FGG256I is an Axcelerator field programmable gate array (FPGA) device built on Microchip's AX architecture and CMOS antifuse process. It delivers nonvolatile single-chip programmability with antifuse-based configuration and is targeted at industrial applications that require secure, high-performance programmable logic.

With 250,000 equivalent system gates, 4,224 logic elements and embedded memory, the device is suited for designs that demand high internal throughput, deterministic timing, and integrated FIFO/memory resources while operating over industrial temperature and voltage ranges.

Key Features

  • Core Capacity — 250,000 equivalent system gates and 4,224 logic elements provide substantial programmable logic for mid-range FPGA designs.
  • Embedded Memory — Approximately 0.055 Mbits of embedded memory (55,296 bits) with configurable RAM/FIFO blocks and embedded FIFO control logic for buffering and data-path tasks.
  • High Performance — Family datasheet cites system performance of 350+ MHz and internal performance above 500+ MHz; suitable for timing-critical designs that benefit from deterministic timing resources.
  • I/O Flexibility — 138 user I/Os with support for flexible, multi-standard interfaces including differential and single-ended standards; datasheet notes LVDS-capable I/Os (700 Mb/s capable) and bank-selectable mixed-voltage operation.
  • Clocking and PLL — Segmentable clock resources and embedded PLL support (14–200 MHz input range with frequency synthesis up to 1 GHz) for complex clocking schemes and clock-domain management.
  • Security and Nonvolatile Programming — Antifuse, single-chip nonvolatile solution with FuseLock programming technology to protect against reverse engineering and design theft.
  • Power and Supply — Core supply voltage range specified at 1.425 V to 1.575 V for stable core operation.
  • Industrial Grade & Environmental — Rated for operation from −40 °C to 85 °C and RoHS-compliant; mounting type is surface mount for PCB integration.
  • Package — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) to support compact board layouts.

Typical Applications

  • Industrial control and automation — Use the AX250-1FGG256I for deterministic control logic, protocol bridging, and embedded FIFO buffering in industrial systems operating across −40 °C to 85 °C.
  • Secure systems and IP protection — Antifuse programming and FuseLock technology make the device suitable for applications requiring strong protection against reverse engineering and design theft.
  • High-speed data interfacing — LVDS-capable I/Os and embedded FIFOs support high-throughput serial and parallel data paths in communications or data-acquisition modules.
  • ASIC replacement and custom logic — The device provides ASIC-like performance and deterministic timing for applications where a single-chip nonvolatile programmable solution replaces or complements ASIC development.

Unique Advantages

  • Single-chip nonvolatile solution: Antifuse architecture eliminates external configuration memories and streamlines system boot and security.
  • Design security: FuseLock programming protects intellectual property and prevents reverse engineering of programmed logic.
  • Integrated memory and FIFOs: On-chip RAM blocks and embedded FIFO control simplify data buffering and reduce external memory requirements.
  • Deterministic timing and clocking: Segmentable clocks and embedded PLLs enable controlled timing architectures for complex, multi-domain designs.
  • Industrial-ready operation: Specified operation from −40 °C to 85 °C and RoHS compliance support deployment in industrial environments.
  • Compact package: 256-LBGA (256-FPBGA 17×17) supports dense PCB layouts while providing ample I/O for mid-range designs.

Why Choose AX250-1FGG256I?

The AX250-1FGG256I combines a mid-range logic capacity (250,000 gates, 4,224 logic elements) with embedded memory and high-performance clocking to deliver a secure, nonvolatile FPGA solution for industrial designs. Its antifuse-based programming and FuseLock protection make it particularly well suited to applications where IP security and single-chip nonvolatility are priorities.

Engineers and procurement teams seeking a robust, industrial-grade FPGA with flexible I/O, deterministic timing resources, and on-chip FIFO/memory capabilities will find the AX250-1FGG256I a compelling option for replacing or augmenting ASICs and implementing secure, high-throughput logic systems.

Request a quote or submit a pricing and availability inquiry to get specifications and lead-time information for the AX250-1FGG256I.

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