AX250-1FGG256I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 138 55296 256-LBGA |
|---|---|
| Quantity | 403 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 138 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-1FGG256I – Axcelerator FPGA, 250,000 gates, 256-LBGA
The AX250-1FGG256I is an Axcelerator field programmable gate array (FPGA) device built on Microchip's AX architecture and CMOS antifuse process. It delivers nonvolatile single-chip programmability with antifuse-based configuration and is targeted at industrial applications that require secure, high-performance programmable logic.
With 250,000 equivalent system gates, 4,224 logic elements and embedded memory, the device is suited for designs that demand high internal throughput, deterministic timing, and integrated FIFO/memory resources while operating over industrial temperature and voltage ranges.
Key Features
- Core Capacity — 250,000 equivalent system gates and 4,224 logic elements provide substantial programmable logic for mid-range FPGA designs.
- Embedded Memory — Approximately 0.055 Mbits of embedded memory (55,296 bits) with configurable RAM/FIFO blocks and embedded FIFO control logic for buffering and data-path tasks.
- High Performance — Family datasheet cites system performance of 350+ MHz and internal performance above 500+ MHz; suitable for timing-critical designs that benefit from deterministic timing resources.
- I/O Flexibility — 138 user I/Os with support for flexible, multi-standard interfaces including differential and single-ended standards; datasheet notes LVDS-capable I/Os (700 Mb/s capable) and bank-selectable mixed-voltage operation.
- Clocking and PLL — Segmentable clock resources and embedded PLL support (14–200 MHz input range with frequency synthesis up to 1 GHz) for complex clocking schemes and clock-domain management.
- Security and Nonvolatile Programming — Antifuse, single-chip nonvolatile solution with FuseLock programming technology to protect against reverse engineering and design theft.
- Power and Supply — Core supply voltage range specified at 1.425 V to 1.575 V for stable core operation.
- Industrial Grade & Environmental — Rated for operation from −40 °C to 85 °C and RoHS-compliant; mounting type is surface mount for PCB integration.
- Package — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) to support compact board layouts.
Typical Applications
- Industrial control and automation — Use the AX250-1FGG256I for deterministic control logic, protocol bridging, and embedded FIFO buffering in industrial systems operating across −40 °C to 85 °C.
- Secure systems and IP protection — Antifuse programming and FuseLock technology make the device suitable for applications requiring strong protection against reverse engineering and design theft.
- High-speed data interfacing — LVDS-capable I/Os and embedded FIFOs support high-throughput serial and parallel data paths in communications or data-acquisition modules.
- ASIC replacement and custom logic — The device provides ASIC-like performance and deterministic timing for applications where a single-chip nonvolatile programmable solution replaces or complements ASIC development.
Unique Advantages
- Single-chip nonvolatile solution: Antifuse architecture eliminates external configuration memories and streamlines system boot and security.
- Design security: FuseLock programming protects intellectual property and prevents reverse engineering of programmed logic.
- Integrated memory and FIFOs: On-chip RAM blocks and embedded FIFO control simplify data buffering and reduce external memory requirements.
- Deterministic timing and clocking: Segmentable clocks and embedded PLLs enable controlled timing architectures for complex, multi-domain designs.
- Industrial-ready operation: Specified operation from −40 °C to 85 °C and RoHS compliance support deployment in industrial environments.
- Compact package: 256-LBGA (256-FPBGA 17×17) supports dense PCB layouts while providing ample I/O for mid-range designs.
Why Choose AX250-1FGG256I?
The AX250-1FGG256I combines a mid-range logic capacity (250,000 gates, 4,224 logic elements) with embedded memory and high-performance clocking to deliver a secure, nonvolatile FPGA solution for industrial designs. Its antifuse-based programming and FuseLock protection make it particularly well suited to applications where IP security and single-chip nonvolatility are priorities.
Engineers and procurement teams seeking a robust, industrial-grade FPGA with flexible I/O, deterministic timing resources, and on-chip FIFO/memory capabilities will find the AX250-1FGG256I a compelling option for replacing or augmenting ASICs and implementing secure, high-throughput logic systems.
Request a quote or submit a pricing and availability inquiry to get specifications and lead-time information for the AX250-1FGG256I.

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