AX250-1FGG484I
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA |
|---|---|
| Quantity | 5 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-1FGG484I – Axcelerator FPGA IC, 248 I/Os, 484-BGA
The AX250-1FGG484I is an Axcelerator Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX antifuse architecture. This industrial-grade, nonvolatile single-chip solution delivers 250,000 equivalent system gates, 4,224 logic elements and a high I/O count for designs that require dense logic, flexible I/O and in-system security.
Key system attributes include a 484-ball fine-pitch BGA package, a nominal 1.5 V core supply (specified 1.425 V to 1.575 V), an operating range of −40 °C to 85 °C, and approximately 55 kbits of embedded memory — making the device suitable for industrial and embedded applications that need reliable, configurable logic in a compact package.
Key Features
- Core Capacity Provides approximately 250,000 equivalent system gates and 4,224 logic elements for mid-density custom logic implementation.
- Embedded Memory Approximately 55 kbits of on-chip RAM and embedded FIFO control logic to support buffering and local data storage.
- I/O Flexibility 248 user I/Os with bank-selectable, mixed-voltage operation and support for differential and single-ended standards for broad interface compatibility.
- High-Speed I/O Capability LVDS-capable I/Os (family-level spec up to 700 Mb/s) to support high-speed serial links and data acquisition paths.
- Clocking and PLLs Segmentable clock resources and embedded PLLs for on-chip frequency synthesis and deterministic timing control.
- Nonvolatile Antifuse Technology Single-chip, nonvolatile antifuse implementation provides one-time programmability and design security without external configuration memory.
- Security and IP Protection FuseLock™ programming technology protects against reverse engineering and design theft.
- Package and Mounting 484-FPBGA (23 × 23) surface-mount package for compact board integration.
- Power and Temperature Core supply specified 1.425 V–1.575 V and industrial operating range of −40 °C to 85 °C; RoHS-compliant.
- Diagnostic and Test Supports in-system diagnostic capability with Microchip Silicon Explorer II and boundary-scan (JTAG) testing for board-level validation.
Typical Applications
- Industrial control and automation Industrial-grade temperature rating and robust I/O make the device suitable for control logic, sensor aggregation and factory automation systems.
- High-speed data capture and bridging LVDS-capable I/Os and embedded FIFOs support data acquisition front-ends and protocol bridging between high-speed interfaces.
- Security-oriented embedded systems Nonvolatile antifuse programming and FuseLock protection help safeguard IP in secure or field-deployed devices.
- Compact system logic integration High logic density and a 484-BGA footprint enable consolidation of glue logic, protocol handling and custom processing in space-constrained designs.
Unique Advantages
- Nonvolatile, single-chip solution: Eliminates the need for external configuration memory and simplifies boot and security models.
- High I/O count in a compact package: 248 user I/Os and a 484-FPBGA package support complex board-level interfacing within a small footprint.
- Design security built in: FuseLock programming technology and antifuse architecture provide resistance to reverse engineering.
- Deterministic timing and clocking: Segmentable clock resources and on-chip PLLs enable predictable performance for timing-critical designs.
- Industrial-ready electrical and thermal specifications: Specified core supply range and −40 °C to 85 °C operating temperature for reliable operation in industrial environments.
- On-board debug and test support: In-system diagnostics with Microchip Silicon Explorer II and JTAG boundary-scan simplify validation and bring-up.
Why Choose AX250-1FGG484I?
AX250-1FGG484I combines mid-density programmable logic with nonvolatile antifuse technology to deliver a secure, compact and reliable FPGA solution for industrial and embedded applications. Its balance of 250,000 equivalent gates, 4,224 logic elements, abundant I/Os and embedded memory supports a wide range of integration tasks where in-field security and deterministic timing are required.
Designed and supported by Microchip Technology, the device offers built-in diagnostic capabilities and programming features that help shorten development cycles and protect design IP, making it a practical choice for engineers seeking a stable, industrial-grade FPGA platform.
Request a quote or submit a sales inquiry to evaluate AX250-1FGG484I for your next design.

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