AX250-1FGG256M

The AX250-1FGG256M is an Axcelerator antifuse FPGA offering 250,000 equivalent system gates with 4,224 logic elements and approximately 55 kbits of embedded RAM/FIFO. Built on the AX architecture and a 0.15 µm CMOS antifuse process with seven metal layers, it provides a single-chip, nonvolatile programmable solution for high-performance, secure embedded systems.

Designed for applications that require robust I/O flexibility, deterministic timing and secure programming, this device targets military and other temperature-critical markets where reliability, wide operating range and embedded system integration are priorities.

Key Features

• Core & Architecture AX architecture with antifuse programming technology delivering a single-chip nonvolatile solution and 250,000 equivalent system gates.
• Logic Resources 4,224 logic elements (cells) and up to 10,752 dedicated flip-flops on family devices—provides substantial combinatorial and sequential resources for complex logic designs.
• Embedded Memory & FIFOs 55,296 total RAM bits (embedded RAM/FIFO) with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for high-throughput buffering.
• I/O Flexibility 138 user I/Os with bank-selectable mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V), support for single-ended and differential standards including LVDS and LVPECL, and 700 Mb/s LVDS-capable channels.
• Clocking & PLL Segmentable clock resources plus an embedded PLL with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for flexible clock management.
• Power Core supply range 1.425 V to 1.575 V (1.5 V core), supporting low-power operation consistent with the Axcelerator family.
• Package & Temperature 256-LBGA package (supplier package: 256-FPBGA 17×17) and military-grade operating temperature range of −55 °C to 125 °C.
• Security & Test FuseLock™ programming technology to protect designs, IEEE 1149.1 (JTAG) boundary-scan support, and in-system diagnostic/debug capability with Microchip Silicon Explorer II.
• Manufacturing & Compliance Manufactured on an advanced 0.15 µm CMOS antifuse process with seven metal layers; RoHS-compliant.

Typical Applications

• Military & Aerospace Systems — Ideal for mission-critical control, signal processing and interface bridging where wide-temperature operation (−55 °C to 125 °C) and nonvolatile configuration are required.
• High-Speed Communications — Use in line cards, backplane interfaces and serializers/deserializers that benefit from LVDS-capable I/Os and embedded FIFO memory for high-throughput data buffering.
• Secure Embedded Platforms — Suitable where design security and protection against reverse engineering are important thanks to antifuse programming and FuseLock technology.
• Industrial Control & Instrumentation — Deterministic timing, segmentable clocks and robust I/O standards make it appropriate for precision control, data acquisition and test equipment.

Unique Advantages

• Secure, Nonvolatile Configuration: Antifuse programming and FuseLock protect intellectual property and eliminate the need for external configuration memory.
• Flexible Mixed-Voltage I/Os: Bank-selectable I/O voltages and broad protocol support reduce external level-shifting and simplify multi-domain interfacing.
• Deterministic Timing and On-Chip PLLs: Segmentable clocks and embedded PLLs provide precise, controllable timing for synchronized system designs.
• Embedded FIFO and RAM Resources: On-chip 55,296 bits of RAM and programmable FIFO logic enable efficient data buffering and high-throughput processing without large external memory.
• Wide Operating Range: Military-grade temperature rating (−55 °C to 125 °C) and robust packaging support deployment in harsh environments.
• Testability and Diagnostics: JTAG boundary-scan compliance and Microchip Silicon Explorer II support facilitate in-system diagnostics and bring-up.

Why Choose AX250-1FGG256M?

The AX250-1FGG256M combines a secure, nonvolatile antifuse architecture with substantial on-chip logic and memory resources to meet the needs of applications that demand reliable long-term configuration, robust I/O flexibility and precise timing. Its military-grade temperature range and RoHS compliance make it suitable for field-deployed systems where environmental resilience matters.

This device is a fit for designers seeking a single-chip FPGA solution that balances performance, security and integration—reducing external components while providing diagnostic and test capabilities backed by the Axcelerator family architecture.

Request a quote or submit a procurement inquiry for AX250-1FGG256M to obtain pricing and availability information.