AX250-1FGG484

IC FPGA 248 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

Quantity 634 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BGANumber of I/O248Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4224Number of Logic Elements/Cells4224
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AX250-1FGG484 – Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA

The AX250-1FGG484 is an Axcelerator family antifuse FPGA based on Microchip's AX architecture. It provides a single-chip, nonvolatile programmable logic solution with on-chip embedded SRAM/FIFO control, segmentable clock resources and integrated PLLs for deterministic timing and high-performance designs.

With 250,000 equivalent system gates, 4,224 logic elements and approximately 0.055 Mbits (55,296 bits) of embedded memory, this commercial-grade device targets applications requiring high-speed I/O, on-chip buffering and compact surface-mount packaging in a 484-BGA (23×23) footprint.

Key Features

  • Core Capacity — 250,000 equivalent system gates and 4,224 logic elements provide substantial logic fabric for custom digital designs.
  • Embedded Memory & FIFOs — Approximately 0.055 Mbits (55,296 bits) of embedded SRAM with programmable FIFO control logic for data buffering and width-configurable read/write ports.
  • I/O Flexibility — 248 user I/Os with support for multiple voltage standards and LVDS-capable channels (700 Mb/s capability noted in the family specification).
  • Clocking & PLLs — Segmentable clock resources and embedded PLLs (14–200 MHz input range, frequency synthesis up to 1 GHz) for precise clock management and high-speed internal timing.
  • Nonvolatile Antifuse Technology — Single-chip nonvolatile solution based on a 0.15 µm CMOS antifuse process with seven layers of metal for reliable one-time programmable configurations.
  • Power & Package — 1.425 V to 1.575 V core supply range (typical 1.5 V core operation), surface-mount 484-FPBGA package (23×23) for compact board integration.
  • Diagnostics & Security — Deterministic timing, in-system diagnostic/debug support and FuseLock™ programming technology to protect against reverse engineering and design theft.
  • Compliance — RoHS-compliant manufacturing.
  • Commercial Temperature Rating — Rated for 0 °C to 70 °C operation.

Typical Applications

  • High-speed Data Interfaces — Use the device's LVDS-capable I/Os and embedded FIFOs to implement high-throughput buffering and interface bridging for serial and parallel links.
  • Clock-Intensive Systems — Segmentable clocks and integrated PLLs enable precise clock domain control for telecom, instrumentation or synchronization-focused designs.
  • Secure, Nonvolatile Logic — Antifuse-based, single-chip nonvolatile configuration and FuseLock programming make it suitable where in-field security and recoverable configuration are required.
  • Custom DSP and Control — 250,000 gates and 4,224 logic elements support custom signal processing, protocol conversion and control logic in compact surface-mount form factors.

Unique Advantages

  • Single-Chip Nonvolatile Solution: Antifuse architecture provides one-time programmable, nonvolatile configuration without external configuration memory, simplifying system design.
  • Deterministic, High-Performance Timing: Segmentable clocks and PLLs with frequency synthesis capability support tight timing control and high internal performance.
  • Flexible I/O Standards: Bank-selectable, mixed-voltage I/Os and support for differential standards (including LVDS) enable interoperability across multiple interface types.
  • Embedded FIFO Support: On-chip SRAM blocks with FIFO control reduce external memory needs for streaming and buffering applications.
  • Security and IP Protection: FuseLock programming technology helps protect designs from reverse engineering and intellectual property theft.
  • Compact, Surface-Mount Packaging: 484-BGA (23×23) package supports dense board layouts while maintaining robust connectivity for 248 I/Os.

Why Choose AX250-1FGG484?

The AX250-1FGG484 combines a substantial logic capacity (250,000 equivalent gates and 4,224 logic elements) with embedded memory and advanced clocking to deliver a compact, deterministic, nonvolatile FPGA solution. Its antifuse-based architecture, integrated PLLs and FIFO support make it suitable for designs that require on-chip buffering, secure configuration and precise timing control.

This commercial-grade device is well suited to engineers and system designers building high-speed interfaces, clocked systems and secure logic implementations where a single-chip, RoHS-compliant, surface-mount FPGA in a 484-BGA package simplifies BOM and board layout while providing the logic and memory resources needed for robust custom designs.

If you would like pricing, lead-time or availability information for AX250-1FGG484, request a quote or submit your requirements to receive a formal response from our team.

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