AX250-1FGG484
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA |
|---|---|
| Quantity | 634 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 248 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4224 | Number of Logic Elements/Cells | 4224 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AX250-1FGG484 – Axcelerator Field Programmable Gate Array (FPGA) IC 248 55296 484-BGA
The AX250-1FGG484 is an Axcelerator family antifuse FPGA based on Microchip's AX architecture. It provides a single-chip, nonvolatile programmable logic solution with on-chip embedded SRAM/FIFO control, segmentable clock resources and integrated PLLs for deterministic timing and high-performance designs.
With 250,000 equivalent system gates, 4,224 logic elements and approximately 0.055 Mbits (55,296 bits) of embedded memory, this commercial-grade device targets applications requiring high-speed I/O, on-chip buffering and compact surface-mount packaging in a 484-BGA (23×23) footprint.
Key Features
- Core Capacity — 250,000 equivalent system gates and 4,224 logic elements provide substantial logic fabric for custom digital designs.
- Embedded Memory & FIFOs — Approximately 0.055 Mbits (55,296 bits) of embedded SRAM with programmable FIFO control logic for data buffering and width-configurable read/write ports.
- I/O Flexibility — 248 user I/Os with support for multiple voltage standards and LVDS-capable channels (700 Mb/s capability noted in the family specification).
- Clocking & PLLs — Segmentable clock resources and embedded PLLs (14–200 MHz input range, frequency synthesis up to 1 GHz) for precise clock management and high-speed internal timing.
- Nonvolatile Antifuse Technology — Single-chip nonvolatile solution based on a 0.15 µm CMOS antifuse process with seven layers of metal for reliable one-time programmable configurations.
- Power & Package — 1.425 V to 1.575 V core supply range (typical 1.5 V core operation), surface-mount 484-FPBGA package (23×23) for compact board integration.
- Diagnostics & Security — Deterministic timing, in-system diagnostic/debug support and FuseLock™ programming technology to protect against reverse engineering and design theft.
- Compliance — RoHS-compliant manufacturing.
- Commercial Temperature Rating — Rated for 0 °C to 70 °C operation.
Typical Applications
- High-speed Data Interfaces — Use the device's LVDS-capable I/Os and embedded FIFOs to implement high-throughput buffering and interface bridging for serial and parallel links.
- Clock-Intensive Systems — Segmentable clocks and integrated PLLs enable precise clock domain control for telecom, instrumentation or synchronization-focused designs.
- Secure, Nonvolatile Logic — Antifuse-based, single-chip nonvolatile configuration and FuseLock programming make it suitable where in-field security and recoverable configuration are required.
- Custom DSP and Control — 250,000 gates and 4,224 logic elements support custom signal processing, protocol conversion and control logic in compact surface-mount form factors.
Unique Advantages
- Single-Chip Nonvolatile Solution: Antifuse architecture provides one-time programmable, nonvolatile configuration without external configuration memory, simplifying system design.
- Deterministic, High-Performance Timing: Segmentable clocks and PLLs with frequency synthesis capability support tight timing control and high internal performance.
- Flexible I/O Standards: Bank-selectable, mixed-voltage I/Os and support for differential standards (including LVDS) enable interoperability across multiple interface types.
- Embedded FIFO Support: On-chip SRAM blocks with FIFO control reduce external memory needs for streaming and buffering applications.
- Security and IP Protection: FuseLock programming technology helps protect designs from reverse engineering and intellectual property theft.
- Compact, Surface-Mount Packaging: 484-BGA (23×23) package supports dense board layouts while maintaining robust connectivity for 248 I/Os.
Why Choose AX250-1FGG484?
The AX250-1FGG484 combines a substantial logic capacity (250,000 equivalent gates and 4,224 logic elements) with embedded memory and advanced clocking to deliver a compact, deterministic, nonvolatile FPGA solution. Its antifuse-based architecture, integrated PLLs and FIFO support make it suitable for designs that require on-chip buffering, secure configuration and precise timing control.
This commercial-grade device is well suited to engineers and system designers building high-speed interfaces, clocked systems and secure logic implementations where a single-chip, RoHS-compliant, surface-mount FPGA in a 484-BGA package simplifies BOM and board layout while providing the logic and memory resources needed for robust custom designs.
If you would like pricing, lead-time or availability information for AX250-1FGG484, request a quote or submit your requirements to receive a formal response from our team.

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