AX2000-2FGG896
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 828 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-2FGG896 – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
The AX2000-2FGG896 is an Axcelerator family antifuse FPGA implementing Microchip's AX architecture as a single-chip, nonvolatile solution. It provides high-density programmable logic with 2,000,000 equivalent system gates and 32,256 logic elements for designs that require substantial on-chip logic and I/O resources.
Engineered for commercial applications, this device combines embedded SRAM/FIFO control, flexible multi-standard I/Os and on-chip PLLs to address high-performance digital processing, high-throughput interfacing and designs that require deterministic timing and design security.
Key Features
- Core Logic 2,000,000 equivalent system gates and 32,256 logic elements provide large-scale programmable logic capacity for complex designs.
- Embedded Memory & FIFOs Approximately 0.295 Mbits (294,912 bits) of embedded SRAM with programmable FIFO control logic and variable-aspect 4,608-bit RAM blocks supporting multiple width organizations.
- I/O Count & Standards 586 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL; LVDS I/Os are capable of 700 Mb/s.
- Clocking & PLLs Segmentable clock resources plus embedded PLLs with a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
- Performance Documented system-level performance of 350+ MHz and internal performance of 500+ MHz for timing-critical implementations.
- Power & Supply Core supply range 1.425 V to 1.575 V (1.5V core voltage for low-power operation) to match system power budgets.
- Package & Mounting 896-ball BGA (896-FBGA, 31 × 31) surface-mount package suitable for compact, high-density board layouts.
- Security & Programming Antifuse-based nonvolatile programming with FuseLock™ technology to protect designs against reverse engineering and unauthorized copying.
- Process & Reliability Manufactured on an advanced 0.15 μm CMOS antifuse process with seven metal layers to support high-performance routing and signal integrity.
- Compliance RoHS-compliant.
- Commercial Temperature Range Rated for 0 °C to 70 °C operation for commercial-grade systems.
Typical Applications
- High-performance communications equipment Use the device's high I/O count, LVDS capability and embedded FIFOs for packet processing, protocol bridging and high-speed link interfacing.
- Data buffering and protocol conversion Embedded SRAM and programmable FIFO logic enable efficient on-chip buffering for data stream alignment and width conversion between interfaces.
- Secure, IP-protected designs Antifuse nonvolatile programming and FuseLock™ support development of security-sensitive systems that require protection against reverse engineering.
- High-density digital processing Large logic capacity and deterministic timing resources make the device suitable for complex state machines, custom accelerators and control logic.
Unique Advantages
- High-density programmable logic: 2,000,000 equivalent gates and 32,256 logic elements reduce the need for multi-chip solutions and simplify system architecture.
- On-chip memory with FIFO control: Nearly 0.295 Mbits of embedded SRAM plus programmable FIFO logic supports high-throughput data flows without external memory in many designs.
- Flexible, multi-standard I/Os: Bank-selectable mixed-voltage I/Os and broad standard support (LVTTL/LVCMOS, LVDS, LVPECL, PCI variants, GTL+/HSTL/SSTL) enable direct interfacing to diverse system peripherals.
- Deterministic timing and clocking: Segmentable clock resources and on-chip PLLs provide predictable timing and high-frequency synthesis for performance-critical functions.
- Nonvolatile, secure programming: Antifuse technology with FuseLock™ protects intellectual property and preserves configuration without external flash or configuration memory.
- Commercial-grade, RoHS-compliant: Designed for standard commercial temperature operation (0 °C to 70 °C) and compliant with RoHS requirements for regulatory conformity.
Why Choose AX2000-2FGG896?
The AX2000-2FGG896 targets designs that require large programmable logic capacity, a high count of flexible I/Os and embedded memory for on-chip buffering. Its antifuse, nonvolatile architecture and FuseLock™ protection make it appropriate where design security and deterministic timing are priorities.
This device is well suited to engineers building commercial systems that need high internal performance, multi-standard interfacing and integrated clocking/PLL resources while maintaining a compact BGA package and RoHS compliance.
Request a quote or submit your design requirements to receive pricing and availability information for AX2000-2FGG896.

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