AX2000-1FGG896M

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 350 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-1FGG896M – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

The AX2000-1FGG896M is a Microchip Axcelerator antifuse FPGA offering up to 2,000,000 equivalent system gates and the AX architecture’s system-level capabilities. It provides a single-chip, nonvolatile solution with large on-chip memory, extensive I/O, and high-performance timing resources for demanding embedded designs.

Targeted at applications requiring high gate density, large I/O counts and extended temperature operation, this device combines embedded SRAM/FIFO control, segmentable clocks and integrated PLLs to support high-throughput digital logic and system integration.

Key Features

  • Core Capacity — Approximately 2,000,000 equivalent system gates with 32,256 logic elements, enabling complex logic consolidation on a single device.
  • Embedded Memory — Approximately 0.295 Mbits (294,912 total RAM bits) of embedded SRAM with programmable FIFO control logic and variable-aspect RAM blocks.
  • I/O Scale and Flexibility — 586 user I/Os with bank-selectable mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL.
  • Performance and Timing — System performance targets of 350+ MHz and internal performance up to 500+ MHz; embedded PLLs with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
  • Nonvolatile Antifuse Technology — Single-chip, nonvolatile antifuse programming for secure, one-time configuration and design protection via FuseLock programming technology.
  • Package and Power — 896-BGA (896-FBGA, 31×31) surface-mount package; nominal core supply between 1.425 V and 1.575 V for low-voltage operation.
  • Temperature and Grade — Military grade with an operating temperature range of −55 °C to 125 °C for deployment in harsh environments.
  • Design and Test Support — Boundary-scan (IEEE 1149.1 JTAG) support and unique in-system diagnostic capability with Microchip Silicon Explorer II.
  • Standards & Throughput — High-performance embedded FIFOs and I/Os capable of 700 Mb/s LVDS operation to support high-speed data interfaces.
  • Regulatory — RoHS compliant.

Typical Applications

  • Aerospace & Defense — Military-grade temperature range and antifuse nonvolatile security make this device suitable for ruggedized signal processing and system control units.
  • High-Performance Communications — Large I/O count, LVDS-capable interfaces and embedded FIFOs support line cards, protocol bridges and high-throughput data movers.
  • Embedded Compute & Acceleration — High gate density and abundant logic elements allow integration of complex acceleration functions and custom datapaths.
  • Industrial Control — Deterministic timing, segmentable clocks and robust I/O standards support real-time control, motor control interfaces and factory automation modules.

Unique Advantages

  • Highly Integrated Single-Chip Solution: Combines up to 2 million equivalent gates, on-chip SRAM and extensive I/O to reduce BOM and simplify board-level design.
  • Nonvolatile, Secure Programming: Antifuse technology with FuseLock protects intellectual property and provides one-time, permanent configuration for secure systems.
  • Large, Flexible I/O Resources: 586 I/Os with bank-selectable mixed-voltage operation and high-speed differential support enable complex, multi-standard interfaces without extra transceivers.
  • High-Speed Timing and PLLs: Embedded PLLs and internal performance capabilities enable deterministic, high-frequency designs and advanced clocking schemes.
  • Designed for Harsh Environments: Military grade temperature range (−55 °C to 125 °C) and RoHS compliance support long-term deployment in demanding applications.

Why Choose AX2000-1FGG896M?

The AX2000-1FGG896M positions itself as a high-density, nonvolatile FPGA for developers who need substantial logic capacity, large embedded memory and broad I/O capability in a single device. Its AX antifuse architecture, integrated PLLs and embedded FIFO logic make it well suited for high-throughput, secure and rugged applications where deterministic timing and reliability are required.

Engineers designing advanced communications, defense, and industrial systems will find the combination of performance, on-chip memory and military-grade operating range valuable for reducing system complexity and improving long-term robustness.

If you require pricing or availability, request a quote or submit an inquiry for the AX2000-1FGG896M and our team will respond with current lead-time and purchasing options.

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