AX2000-1FGG896M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA |
|---|---|
| Quantity | 350 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 586 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-1FGG896M – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA
The AX2000-1FGG896M is a Microchip Axcelerator antifuse FPGA offering up to 2,000,000 equivalent system gates and the AX architecture’s system-level capabilities. It provides a single-chip, nonvolatile solution with large on-chip memory, extensive I/O, and high-performance timing resources for demanding embedded designs.
Targeted at applications requiring high gate density, large I/O counts and extended temperature operation, this device combines embedded SRAM/FIFO control, segmentable clocks and integrated PLLs to support high-throughput digital logic and system integration.
Key Features
- Core Capacity — Approximately 2,000,000 equivalent system gates with 32,256 logic elements, enabling complex logic consolidation on a single device.
- Embedded Memory — Approximately 0.295 Mbits (294,912 total RAM bits) of embedded SRAM with programmable FIFO control logic and variable-aspect RAM blocks.
- I/O Scale and Flexibility — 586 user I/Os with bank-selectable mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL.
- Performance and Timing — System performance targets of 350+ MHz and internal performance up to 500+ MHz; embedded PLLs with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
- Nonvolatile Antifuse Technology — Single-chip, nonvolatile antifuse programming for secure, one-time configuration and design protection via FuseLock programming technology.
- Package and Power — 896-BGA (896-FBGA, 31×31) surface-mount package; nominal core supply between 1.425 V and 1.575 V for low-voltage operation.
- Temperature and Grade — Military grade with an operating temperature range of −55 °C to 125 °C for deployment in harsh environments.
- Design and Test Support — Boundary-scan (IEEE 1149.1 JTAG) support and unique in-system diagnostic capability with Microchip Silicon Explorer II.
- Standards & Throughput — High-performance embedded FIFOs and I/Os capable of 700 Mb/s LVDS operation to support high-speed data interfaces.
- Regulatory — RoHS compliant.
Typical Applications
- Aerospace & Defense — Military-grade temperature range and antifuse nonvolatile security make this device suitable for ruggedized signal processing and system control units.
- High-Performance Communications — Large I/O count, LVDS-capable interfaces and embedded FIFOs support line cards, protocol bridges and high-throughput data movers.
- Embedded Compute & Acceleration — High gate density and abundant logic elements allow integration of complex acceleration functions and custom datapaths.
- Industrial Control — Deterministic timing, segmentable clocks and robust I/O standards support real-time control, motor control interfaces and factory automation modules.
Unique Advantages
- Highly Integrated Single-Chip Solution: Combines up to 2 million equivalent gates, on-chip SRAM and extensive I/O to reduce BOM and simplify board-level design.
- Nonvolatile, Secure Programming: Antifuse technology with FuseLock protects intellectual property and provides one-time, permanent configuration for secure systems.
- Large, Flexible I/O Resources: 586 I/Os with bank-selectable mixed-voltage operation and high-speed differential support enable complex, multi-standard interfaces without extra transceivers.
- High-Speed Timing and PLLs: Embedded PLLs and internal performance capabilities enable deterministic, high-frequency designs and advanced clocking schemes.
- Designed for Harsh Environments: Military grade temperature range (−55 °C to 125 °C) and RoHS compliance support long-term deployment in demanding applications.
Why Choose AX2000-1FGG896M?
The AX2000-1FGG896M positions itself as a high-density, nonvolatile FPGA for developers who need substantial logic capacity, large embedded memory and broad I/O capability in a single device. Its AX antifuse architecture, integrated PLLs and embedded FIFO logic make it well suited for high-throughput, secure and rugged applications where deterministic timing and reliability are required.
Engineers designing advanced communications, defense, and industrial systems will find the combination of performance, on-chip memory and military-grade operating range valuable for reducing system complexity and improving long-term robustness.
If you require pricing or availability, request a quote or submit an inquiry for the AX2000-1FGG896M and our team will respond with current lead-time and purchasing options.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
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