AX2000-1FG896M

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 1,542 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-1FG896M – Axcelerator Field Programmable Gate Array (FPGA), 2,000,000 gates, 586 I/Os, 896‑BGA

The AX2000-1FG896M is an Axcelerator antifuse FPGA from Microchip Technology built on the AX architecture. This single‑chip, nonvolatile FPGA combines high system performance and on‑chip resources for demanding embedded and military applications.

Designed for applications that require deterministic timing, secure programming and high‑speed I/O, the device delivers high internal performance, integrated memory and flexible multi‑standard I/Os in a 896‑FBGA surface‑mount package.

Key Features

  • Core Logic — 2,000,000 equivalent system gates and 32,256 logic elements provide substantial capacity for complex designs.
  • Embedded Memory — Approximately 294,912 bits of embedded SRAM/FIFO with variable‑aspect RAM blocks and programmable FIFO control logic for buffering and dataflow management.
  • I/O Density and Standards — 586 user I/Os with support for mixed voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and bank‑selectable I/O banks; LVDS capable for high‑speed differential links.
  • Performance — System performance of 350+ MHz and internal performance of 500+ MHz as specified for the Axcelerator family.
  • Clocking and PLL — Embedded PLL with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for flexible clock generation and domain crossing.
  • Power and Supply — Core voltage supply range of 1.425 V to 1.575 V, enabling low‑voltage operation consistent with antifuse architecture.
  • Security and Reliability — FuseLock™ programming technology protects against reverse engineering and supports deterministic, user‑controllable timing; boundary‑scan (JTAG) compliant.
  • Package and Temperature — 896‑FBGA (31 × 31) surface‑mount package rated for military grade operation from −55 °C to 125 °C.
  • Development and Diagnostics — In‑system diagnostic and debug capability with Microchip Silicon Explorer II for debugging and validation.

Typical Applications

  • Military and Defense Systems — Military‑grade temperature range and surface‑mount 896‑FBGA packaging make the device suitable for rugged, secure mission‑critical electronics.
  • High‑Performance Signal Processing — Large logic capacity, high internal clock performance and embedded FIFOs support real‑time DSP, sensor fusion and data acquisition designs.
  • High‑Speed Communications — LVDS capable I/Os and high I/O count enable protocol bridging, line cards and high‑throughput interface applications.
  • Secure Embedded Systems — Nonvolatile antifuse programming and FuseLock technology reduce risk of reverse engineering for secure hardware implementations.

Unique Advantages

  • High capacity and density: 2,000,000 equivalent system gates with 32,256 logic elements to implement large, complex functions on a single chip.
  • Integrated memory and FIFOs: Nearly 295 kbits of embedded SRAM/FIFO with programmable control, reducing external memory dependency and simplifying board design.
  • Flexible, high‑speed I/O: 586 I/Os with multi‑voltage operation and LVDS capability support diverse interface standards and high data‑rate links.
  • Secure, nonvolatile programming: Antifuse architecture and FuseLock programming protect IP and provide stable, one‑time programmable configurations.
  • Deterministic timing and clocking: Segmentable clocks and embedded PLLs enable predictable timing closure and robust clock management across domains.
  • Rugged operating range: Rated for −55 °C to 125 °C and delivered in an industry‑grade FBGA package for demanding environments.

Why Choose AX2000-1FG896M?

The AX2000-1FG896M positions itself where high logic capacity, secure nonvolatile configuration and robust I/O converge. It is suited for engineers developing performance‑sensitive, security‑aware systems that require deterministic timing and substantial on‑chip memory and logic resources.

With Microchip’s Axcelerator architecture, embedded PLLs, and on‑chip FIFOs, the device offers a compact, integrated platform that can reduce external components and simplify system design while providing long‑term stability and diagnostic capabilities for development and fielded systems.

Request a quote or submit a sales inquiry to evaluate AX2000-1FG896M for your next project and to discuss availability and ordering details.

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