AX2000-1CQ352M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 198 294912 352-BFCQFP with Tie Bar |
|---|---|
| Quantity | 1,487 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 44 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-CQFP (75x75) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BFCQFP with Tie Bar | Number of I/O | 198 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-1CQ352M – Axcelerator Field Programmable Gate Array (FPGA) IC, 2,000,000 gates, 198 I/O, ~0.295 Mbits SRAM, 352‑BFCQFP with Tie Bar
The AX2000-1CQ352M is a military-grade Axcelerator antifuse FPGA based on Microchip’s AX architecture. It delivers up to 2,000,000 equivalent system gates with 32,256 logic elements and approximately 0.295 Mbits of embedded SRAM/FIFO, combining high density, nonvolatile programming, and flexible I/O for demanding applications.
Designed for applications that require deterministic timing, in-system diagnostics and secure programming, this single-chip, nonvolatile solution integrates PLLs, segmentable clocks and embedded FIFO control to support high-performance signal processing and system-level integration.
Key Features
- Core Architecture Antifuse-based AX architecture providing a single-chip, nonvolatile FPGA implementation with deterministic and user-controllable timing.
- Logic Density Up to 2,000,000 equivalent system gates with 32,256 logic elements (cells) to implement complex logic and custom datapaths.
- Embedded Memory & FIFO Approximately 0.295 Mbits of embedded SRAM/FIFO with programmable FIFO control logic and variable-aspect RAM blocks.
- I/O Flexibility 198 user I/Os with support for mixed-voltage operation and a variety of single-ended and differential standards; LVDS-capable channels up to 700 Mb/s.
- Clocking & PLLs Segmentable clock resources plus embedded PLLs (14–200 MHz input range, frequency synthesis capabilities up to 1 GHz) for advanced clock management.
- Process & Reliability Manufactured on a 0.15 µm CMOS antifuse process with seven metal layers; includes FuseLock programming technology to protect against reverse engineering.
- Power Core supply voltage specified at 1.425 V to 1.575 V (nominal 1.5 V) for low-power core operation.
- Package & Mounting Supplied in a 352‑BFCQFP package with tie bar (supplier device package 352‑CQFP, 75 × 75 mm footprint); surface-mount device.
- Environment & Compliance Military grade device with operating temperature range of −55 °C to 125 °C and RoHS-compliant status.
Typical Applications
- Aerospace & Defense systems Mission-critical logic and secure designs that require military-grade temperature ranges, nonvolatile antifuse programming and protection against reverse engineering.
- High-speed data interfaces Systems requiring LVDS-capable I/Os and many user I/Os for multi-channel, high-throughput serial or parallel data paths.
- Embedded signal processing Applications that leverage dense logic and on-chip embedded SRAM/FIFO for packet buffering, protocol handling and custom datapath acceleration.
- Deterministic control systems Designs that need user-controllable timing, segmentable clocks and integrated PLLs for stable, deterministic operation across temperature extremes.
Unique Advantages
- Nonvolatile, single-chip implementation: Antifuse programming provides one-time programmable, nonvolatile logic ideal for secure and stable long-term deployments.
- High logic capacity: 2,000,000 equivalent system gates and 32,256 logic elements enable complex system integration and consolidation of multiple functions onto a single device.
- Flexible, high-speed I/Os: 198 I/Os with multi-standard support and LVDS capability up to 700 Mb/s simplify interfacing to modern high-speed peripherals and links.
- Integrated clocking and PLLs: Segmentable clocks and embedded PLLs with wide input range and frequency synthesis support precise timing and clock-domain management.
- Embedded memory with FIFO support: Approximately 0.295 Mbits of on-chip SRAM with programmable FIFO control eases buffer and streaming data management without external memory.
- Designed for harsh environments: Military-grade temperature range (−55 °C to 125 °C) and robust process technology for reliable operation in demanding conditions.
Why Choose AX2000-1CQ352M?
The AX2000-1CQ352M is positioned for designs that need high-density, nonvolatile FPGA capability with robust security and deterministic timing. Its combination of up to 2,000,000 gates, extensive I/O flexibility, embedded memory/FIFO and integrated PLLs makes it well suited for secure, high-performance applications in defense, aerospace and other environments that require military-grade operation.
Choosing this Axcelerator device offers long-term design stability through antifuse nonvolatility, on-chip resources that reduce external BOM count, and process-level protections that help safeguard intellectual property while delivering the performance required for complex system integration.
Request a quote or submit a pricing inquiry to begin procurement of the AX2000-1CQ352M and evaluate its fit for your next design.

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