AX2000-1FG896

The AX2000-1FG896 is an Axcelerator antifuse FPGA based on Microchip's AX architecture, delivering up to 2,000,000 equivalent system gates in a single-chip, nonvolatile solution. This surface-mount 896-FBGA device combines dense logic resources with embedded SRAM/FIFO, segmentable clocks and high-performance I/O capability for demanding digital designs.

Targeted at communications, high-speed data and processing applications, the device offers commercial-grade operation (0 °C to 70 °C) with a 1.5 V core supply range (1.425 V to 1.575 V) and RoHS compliance.

Key Features

• Core Capacity and Logic  Up to 2,000,000 equivalent system gates with 32,256 logic elements, enabling high-density logic integration on a single device.
• Embedded Memory  Approximately 294,912 bits of on-chip SRAM/FIFO with 64 core RAM blocks (family profile) and programmable FIFO control logic for buffering and streaming data.
• I/O Flexibility  586 user I/Os on this part with support for bank-selectable I/O standards and multi-voltage operation across I/O banks as documented for the Axcelerator family.
• High-Speed I/O and Interfaces  Family-capable differential and single-ended standards including LVDS and LVPECL, and LVDS-capable rates up to the family-specified 700 Mb/s for high-throughput links.
• Clocking and PLL  Segmentable clock resources and an embedded PLL providing frequency synthesis (family-specified input range 14–200 MHz and synthesis up to 1 GHz) for complex clocking schemes.
• Performance  Family performance metrics include system performance exceeding 350 MHz and internal performance above 500 MHz, supporting latency-sensitive designs.
• Packaging and Mounting  896-ball Fine BGA (31 × 31) surface-mount package (896-FBGA) for compact board-level integration.
• Power and Temperature  1.425–1.575 V core supply range and commercial-grade operating temperature from 0 °C to 70 °C.
• Security and Reliability  Antifuse programming technology and family features such as FuseLock™ protect against reverse engineering and support deterministic timing for production systems.

Typical Applications

• High-Speed Data Transport  Use for link aggregation, protocol bridging and buffering where LVDS-capable I/Os and embedded FIFOs simplify interface and throughput design.
• Communications Infrastructure  Implement datapath logic, packet processing or framing tasks that require dense logic resources and high internal clock rates.
• Video and Image Processing  Handle real-time video preprocessing and buffering using embedded SRAM and high-performance internal clocks to meet frame-rate demands.
• Test & Measurement  Leverage deterministic timing, programmable I/O drive/slew and nonvolatile configuration for stable, repeatable measurement and instrumentation designs.

Unique Advantages

• Single-Chip, Nonvolatile Solution: Antifuse-based architecture delivers a one-time-programmable, nonvolatile configuration that eliminates the need for external configuration memory.
• High Logic Density: Two million equivalent system gates and 32,256 logic elements reduce board-level component count by consolidating complex logic into a single device.
• Flexible, Multi-Standard I/Os: Bank-selectable I/Os and family support for multiple single-ended and differential standards simplify mixed-voltage system design.
• Built-In Data Path Support: Programmable embedded FIFO logic and substantial on-chip SRAM simplify high-throughput buffering and streaming designs, lowering BOM and latency.
• Deterministic Timing and Debug: Deterministic timing resources, segmentable clocks and family-provided in-system diagnostic capabilities support predictable timing closure and debug.
• Compact, Production-Ready Packaging: 896-FBGA (31 × 31) package provides a high-pin-count, compact footprint for space-constrained, high-density applications.

Why Choose AX2000-1FG896?

The AX2000-1FG896 positions itself for designs that require high logic capacity, robust on-chip memory and flexible high-speed I/O in a nonvolatile FPGA. Its combination of 2,000,000 equivalent system gates, approximately 295 kbits of embedded SRAM/FIFO and bank-configurable I/O makes it well suited for communication, data acquisition and processing applications that demand integrated buffering and deterministic timing.

Engineers and procurement teams will find value in the device's high integration density, programmable I/O flexibility and the antifuse-based nonvolatile configuration model, which help reduce BOM complexity and support stable, repeatable deployments across commercial-temperature systems.

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