AX2000-1FGG1152M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 684 294912 1152-BGA |
|---|---|
| Quantity | 444 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FPBGA (35x35) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BGA | Number of I/O | 684 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-1FGG1152M – Axcelerator Field Programmable Gate Array (FPGA) IC 684 294912 1152-BGA
The AX2000-1FGG1152M is an Axcelerator antifuse FPGA built on Microchip’s AX architecture, delivering a single-chip, nonvolatile programmable logic solution. With up to 2,000,000 equivalent system gates, 68 4 user I/Os and abundant embedded memory, it is designed for high-performance, security-conscious designs that require deterministic timing and flexible, multi-standard I/O support.
Targeted at applications where nonvolatile configuration, high I/O density and wide operating temperature are required, the device combines segmentable clocks, embedded PLLs, on-chip SRAM/FIFO blocks and bank-selectable I/O voltage support to simplify system-level integration.
Key Features
- Core Architecture — Antifuse-based AX architecture manufactured on 0.15 μm CMOS with seven layers of metal; up to 2,000,000 equivalent system gates for high-density implementations.
- Logic Capacity — 32,256 logic elements (register and combinatorial resources) to implement complex state machines and datapaths.
- Embedded Memory — Approximately 0.295 Mbits of embedded SRAM/FIFO (294,912 bits) distributed across core RAM blocks with programmable FIFO control logic.
- I/O and Interfaces — Up to 684 user I/Os with support for multi-standard, bank-selectable voltages (1.5V, 1.8V, 2.5V, 3.3V); I/Os include LVDS-capable channels up to 700 Mb/s and registered I/O options.
- Clocking and PLLs — Segmentable clock resources and embedded PLLs with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for precise, high-speed timing control.
- Performance — Datasheet-specified system performance greater than 350 MHz and internal performance exceeding 500 MHz for demanding logic paths.
- Programmability & Security — Single-chip, nonvolatile antifuse solution with FuseLock™ programming technology to protect designs against reverse engineering and unauthorized copying.
- Programmable I/O Controls — Configurable slew rate, drive strength, programmable input delay and weak pull-up/pull-down circuits for signal integrity tuning.
- Package & Mounting — 1152-ball FPBGA package (35 × 35 mm), surface-mount mounting type suitable for high-density board designs.
- Electrical & Environmental — Core supply range 1.425 V to 1.575 V; operating temperature range −55 °C to 125 °C; RoHS compliant; Grade: Military.
Typical Applications
- Secure communications and defense systems — Nonvolatile antifuse configuration and FuseLock programming provide hardware-level design protection and deterministic behavior across power cycles.
- High-speed data acquisition and transport — LVDS-capable I/Os and embedded FIFO memory enable reliable, high-throughput data buffering and interface bridging.
- Deterministic signal processing — Segmentable clocks and on-chip PLLs deliver precise timing and frequency synthesis for real-time processing tasks.
- Mixed-voltage system interfaces — Bank-selectable I/O voltages and multi-standard I/O support simplify integration with diverse peripheral voltages and protocols.
Unique Advantages
- Single-chip, nonvolatile implementation: Eliminates external configuration memory and guarantees immediate, repeatable device configuration on power-up.
- High-density logic and memory: Combine 32,256 logic elements with approximately 0.295 Mbits of embedded SRAM/FIFO to consolidate functions that would otherwise require multiple devices.
- Flexible, multi-standard I/Os: Bank-selectable voltages and support for single-ended and differential standards reduce level-shifting and interface components on the board.
- Deterministic timing and high internal performance: Segmentable clocks, embedded PLLs and documented system/internal performance metrics enable predictable timing closure for complex designs.
- Design protection and in-system diagnostics: FuseLock programming protects intellectual property; built-in diagnostic capabilities support in-system debug and verification.
- Military-grade thermal range: Rated for −55 °C to 125 °C, supporting deployment in extreme-temperature environments where broad thermal tolerance is required.
Why Choose AX2000-1FGG1152M?
The AX2000-1FGG1152M positions itself as a high-performance, nonvolatile antifuse FPGA for designs that require dense logic, significant embedded memory and comprehensive I/O flexibility under a military-grade thermal envelope. Its combination of up to 2,000,000 equivalent system gates, embedded FIFO control, high-speed I/O capability and security-focused programming technology makes it suitable for systems where reliability, determinism and IP protection are critical.
For engineers building high-throughput, secure, and thermally demanding systems, the AX2000-1FGG1152M provides a tightly integrated platform that reduces external components while delivering controlled timing, flexible interfaces and nonvolatile configuration.
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