AX2000-1CQ256M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 136 294912 256-BFCQFP with Tie Bar |
|---|---|
| Quantity | 944 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 44 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CQFP (75x75) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BFCQFP with Tie Bar | Number of I/O | 136 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32256 | Number of Logic Elements/Cells | 32256 | ||
| Number of Gates | 2000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of AX2000-1CQ256M – Axcelerator Field Programmable Gate Array (FPGA) IC 136 294912 256-BFCQFP with Tie Bar
The AX2000-1CQ256M is an Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture. It delivers a single-chip, nonvolatile FPGA solution with system-level capabilities such as segmentable clocks, embedded PLLs, chip-wide highway routing and embedded SRAM with FIFO control logic.
Designed for high-performance and secure applications, this device combines up to 2,000,000 equivalent system gates with approximately 0.295 Mbits of embedded memory, 32,256 logic elements and 136 user I/Os. It is suitable for military-grade environments with a wide operating temperature range and FuseLock™ programming technology for protection against reverse engineering.
Key Features
- Core and Logic Up to 2,000,000 equivalent system gates and 32,256 logic elements provide large-capacity programmable logic for complex system designs.
- Embedded Memory & FIFOs Approximately 0.295 Mbits (294,912 bits) of embedded SRAM with programmable FIFO control logic and variable-aspect RAM blocks for flexible data buffering and storage.
- I/O Flexibility 136 user I/Os on this variant, with Axcelerator-family support for mixed-voltage bank-selectable I/Os and high-speed differential standards including LVDS (700 Mb/s capable).
- Clocking and Timing Segmentable clock resources and embedded PLLs support precise, user-controllable timing; PLL input range and frequency synthesis capabilities are provided for advanced clock management.
- Nonvolatile Antifuse Technology CMOS antifuse process (0.15 μm, seven layers of metal) provides a single-chip, nonvolatile solution with FuseLock™ programming to protect against reverse engineering and design theft.
- Power and Supply Core supply defined in the product data at 1.425 V to 1.575 V (nominal 1.5 V core) for low-power core operation.
- Package and Mounting Surface-mount 256-BFCQFP package with tie bar; supplier device package listed as 256-CQFP (75×75).
- Environmental and Grade Military grade with an operating temperature range of -55 °C to 125 °C and RoHS compliance.
Typical Applications
- Military and aerospace systems Military-grade temperature range and nonvolatile antifuse configuration make this device suitable for secure, rugged deployments and mission-critical FPGA functions.
- High-performance communications High internal and system performance, LVDS-capable I/Os and embedded FIFOs support protocol bridging, line-rate buffering and high-speed data interfaces.
- Secure and IP-sensitive designs FuseLock™ programming technology and antifuse nonvolatile configuration provide protection against reverse engineering for sensitive hardware implementations.
- Complex system integration Large logic capacity, embedded SRAM and rich clocking/PLL resources enable consolidated system functions and custom hardware acceleration on a single chip.
Unique Advantages
- Single-chip nonvolatile solution: Eliminates the need for external configuration memory by using antifuse technology for persistent configuration.
- High logic and memory density: Combines 32,256 logic elements with approximately 0.295 Mbits of embedded memory to support complex designs and on-chip buffering.
- Designed for secure deployments: FuseLock™ programming technology helps protect intellectual property and design integrity.
- Robust thermal range: Military-grade operation from -55 °C to 125 °C enables use in harsh and demanding environments.
- Flexible I/O and clocking: Bank-selectable I/O standards, high-speed differential capability and segmentable clocks with PLLs simplify integration with system-level interfaces.
- Established process technology: Manufactured on a 0.15 μm CMOS antifuse process with seven metal layers for proven performance characteristics.
Why Choose AX2000-1CQ256M?
The AX2000-1CQ256M positions itself as a high-capacity, secure, nonvolatile FPGA for applications that require substantial programmable logic, embedded SRAM and rugged, military-grade operation. Its combination of large logic resources, embedded FIFO-capable memory, flexible I/O and programmable clocking makes it well-suited for engineers consolidating complex system functions into a single device.
This device appeals to teams building secure, long-life systems that require deterministic timing, robust environmental performance and on-chip configuration protection, while benefiting from Microchip’s Axcelerator family architecture and features such as PLLs, segmentable clocks and FuseLock programming.
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