AX1000-LG624M

IC FPGA 418 I/O 624CLGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 624-BCLGA

Quantity 1,306 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time44 Weeks
Datasheet

Specifications & Environmental

Device Package624-CLGA (32.5x32.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case624-BCLGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-LG624M – Axcelerator FPGA, 1,000,000 Equivalent Gates, 624-BCLGA

The AX1000-LG624M is an Axcelerator field programmable gate array (FPGA) from Microchip Technology that delivers high-density, nonvolatile logic integration on the AX architecture. It combines one million equivalent system gates with embedded SRAM and flexible I/O to address applications requiring high performance, design security and military-grade environmental tolerance.

Built on the Axcelerator antifuse family design, the device provides system-level features such as segmentable clocks, embedded FIFOs, and programmable I/O standards to support complex digital systems and secure implementations.

Key Features

  • Core Logic — 1,000,000 equivalent system gates with 18,144 logic elements, enabling dense logic implementation and complex combinatorial/sequential designs.
  • Embedded Memory & FIFOs — Approximately 0.166 Mbits (165,888 bits) of on-chip RAM with embedded FIFO control logic and variable-aspect RAM block organization for width-configurable read/write ports.
  • I/O Flexibility — 418 user I/Os with multi-standard support (1.5V, 1.8V, 2.5V, 3.3V mixed-voltage operation) and LVDS-capable I/Os (700 Mb/s referenced in family datasheet) for high-speed serial and parallel interfacing.
  • Clocking & PLL — Segmentable clock resources and an embedded phase-locked loop (PLL) providing frequency synthesis capabilities (family datasheet specifies up to 1 GHz synthesis and 14–200 MHz input range).
  • Security & Diagnostics — Nonvolatile antifuse programming with FuseLock™ protection against reverse engineering, plus in-system diagnostic and debug capability via Microchip Silicon Explorer II (family feature).
  • Power & Supply — Core voltage supply specified between 1.425 V and 1.575 V for reliable core operation.
  • Package & Mounting — 624-BCLGA surface-mount package (supplier package: 624-CLGA, 32.5 × 32.5 mm) for high-density system integration.
  • Temperature & Grade — Military grade operation with an operating temperature range of −55°C to 125°C and RoHS-compliant materials.

Typical Applications

  • Military & Aerospace Systems — Military-grade temperature range and antifuse nonvolatile programming suit rugged, secure electronics used in defense and avionics subsystems.
  • High-Speed Data Transport — LVDS-capable I/Os and embedded FIFOs enable protocol bridging, high-speed serial links and data buffering in communications equipment.
  • Signal Processing & Control — Dense logic resources and embedded SRAM support real-time signal processing, protocol offload and embedded control functions.
  • ASIC Replacement & Prototyping — High gate count and deterministic timing resources enable migration of ASIC functionality to a single-chip, nonvolatile FPGA solution.

Unique Advantages

  • High-density integration: One million equivalent gates and 18,144 logic elements reduce board-level component count for complex designs.
  • On-chip memory and FIFO support: Approximately 0.166 Mbits of embedded SRAM with FIFO control simplifies data buffering and memory-mapped designs.
  • Robust I/O versatility: Hundreds of user I/Os with multi-voltage operation and LVDS capability allow flexible interfacing to modern high-speed peripherals.
  • Nonvolatile security: Antifuse programming and FuseLock™ technology provide inherent protection against reverse engineering and unauthorized readout.
  • Designed for demanding environments: Surface-mount 624-BCLGA package and military temperature grade (−55°C to 125°C) support reliability in harsh conditions.
  • In-system debug and testability: Integrated diagnostic features and boundary-scan (IEEE 1149.1) support streamline development and manufacturing test.

Why Choose AX1000-LG624M?

The AX1000-LG624M combines high logic density, embedded memory, and versatile I/O in a military-grade, nonvolatile FPGA package. Its AX family heritage delivers system-level capabilities—segmentable clocks, PLLs, embedded FIFO control and security features—making it suitable for complex digital systems that require deterministic timing and in-field reliability.

This device is targeted at designers who need a compact, integrated FPGA solution with strong security and rugged environmental performance, offering long-term value through reduced BOM, on-chip resources, and Microchip-supported diagnostic features.

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