AX1000-LG624M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 624-BCLGA |
|---|---|
| Quantity | 1,306 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 44 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 624-CLGA (32.5x32.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 624-BCLGA | Number of I/O | 418 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-LG624M – Axcelerator FPGA, 1,000,000 Equivalent Gates, 624-BCLGA
The AX1000-LG624M is an Axcelerator field programmable gate array (FPGA) from Microchip Technology that delivers high-density, nonvolatile logic integration on the AX architecture. It combines one million equivalent system gates with embedded SRAM and flexible I/O to address applications requiring high performance, design security and military-grade environmental tolerance.
Built on the Axcelerator antifuse family design, the device provides system-level features such as segmentable clocks, embedded FIFOs, and programmable I/O standards to support complex digital systems and secure implementations.
Key Features
- Core Logic — 1,000,000 equivalent system gates with 18,144 logic elements, enabling dense logic implementation and complex combinatorial/sequential designs.
- Embedded Memory & FIFOs — Approximately 0.166 Mbits (165,888 bits) of on-chip RAM with embedded FIFO control logic and variable-aspect RAM block organization for width-configurable read/write ports.
- I/O Flexibility — 418 user I/Os with multi-standard support (1.5V, 1.8V, 2.5V, 3.3V mixed-voltage operation) and LVDS-capable I/Os (700 Mb/s referenced in family datasheet) for high-speed serial and parallel interfacing.
- Clocking & PLL — Segmentable clock resources and an embedded phase-locked loop (PLL) providing frequency synthesis capabilities (family datasheet specifies up to 1 GHz synthesis and 14–200 MHz input range).
- Security & Diagnostics — Nonvolatile antifuse programming with FuseLock™ protection against reverse engineering, plus in-system diagnostic and debug capability via Microchip Silicon Explorer II (family feature).
- Power & Supply — Core voltage supply specified between 1.425 V and 1.575 V for reliable core operation.
- Package & Mounting — 624-BCLGA surface-mount package (supplier package: 624-CLGA, 32.5 × 32.5 mm) for high-density system integration.
- Temperature & Grade — Military grade operation with an operating temperature range of −55°C to 125°C and RoHS-compliant materials.
Typical Applications
- Military & Aerospace Systems — Military-grade temperature range and antifuse nonvolatile programming suit rugged, secure electronics used in defense and avionics subsystems.
- High-Speed Data Transport — LVDS-capable I/Os and embedded FIFOs enable protocol bridging, high-speed serial links and data buffering in communications equipment.
- Signal Processing & Control — Dense logic resources and embedded SRAM support real-time signal processing, protocol offload and embedded control functions.
- ASIC Replacement & Prototyping — High gate count and deterministic timing resources enable migration of ASIC functionality to a single-chip, nonvolatile FPGA solution.
Unique Advantages
- High-density integration: One million equivalent gates and 18,144 logic elements reduce board-level component count for complex designs.
- On-chip memory and FIFO support: Approximately 0.166 Mbits of embedded SRAM with FIFO control simplifies data buffering and memory-mapped designs.
- Robust I/O versatility: Hundreds of user I/Os with multi-voltage operation and LVDS capability allow flexible interfacing to modern high-speed peripherals.
- Nonvolatile security: Antifuse programming and FuseLock™ technology provide inherent protection against reverse engineering and unauthorized readout.
- Designed for demanding environments: Surface-mount 624-BCLGA package and military temperature grade (−55°C to 125°C) support reliability in harsh conditions.
- In-system debug and testability: Integrated diagnostic features and boundary-scan (IEEE 1149.1) support streamline development and manufacturing test.
Why Choose AX1000-LG624M?
The AX1000-LG624M combines high logic density, embedded memory, and versatile I/O in a military-grade, nonvolatile FPGA package. Its AX family heritage delivers system-level capabilities—segmentable clocks, PLLs, embedded FIFO control and security features—making it suitable for complex digital systems that require deterministic timing and in-field reliability.
This device is targeted at designers who need a compact, integrated FPGA solution with strong security and rugged environmental performance, offering long-term value through reduced BOM, on-chip resources, and Microchip-supported diagnostic features.
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