AX2000-2FG896I

IC FPGA 586 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

Quantity 151 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case896-BGANumber of I/O586Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32256Number of Logic Elements/Cells32256
Number of Gates2000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of AX2000-2FG896I – Axcelerator Field Programmable Gate Array (FPGA) IC 586 294912 896-BGA

The AX2000-2FG896I is an Axcelerator antifuse FPGA built on Microchip's AX architecture, delivering a single-chip, nonvolatile programmable solution with up to 2,000,000 equivalent system gates. Designed for industrial-grade embedded systems, it combines high-performance logic, embedded SRAM/FIFO control, segmentable clocking and on-chip PLLs to address high-throughput data processing, communications and industrial control applications.

Key Features

  • Core & architecture  AX antifuse architecture providing up to 2,000,000 equivalent system gates and deterministic, user-controllable timing for complex logic integration.
  • Logic density  32,256 logic elements (cells) to implement large-scale programmable logic functions.
  • Embedded memory  Approximately 0.295 Mbits of embedded SRAM/FIFO (294,912 bits) with programmable FIFO control logic and configurable read/write port widths.
  • I/O flexibility  586 user I/Os with bank-selectable I/O support and mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) including differential standards such as LVDS and LVPECL; LVDS capable to 700 Mb/s.
  • Clocking & PLLs  Segmentable clock resources and on-chip PLLs with a 14–200 MHz input range and frequency synthesis up to 1 GHz for precision timing and clock management.
  • Performance  System-level performance targets published for the Axcelerator family include 350+ MHz system performance and 500+ MHz internal performance.
  • Power & supply  Core supply specified from 1.425 V to 1.575 V for the device core.
  • Package & mounting  896-ball BGA package (896-FBGA, 31 × 31 footprint), surface-mount mounting for compact board integration.
  • Temperature & grade  Industrial-grade operation across −40°C to 85°C.
  • Security & reliability  Nonvolatile antifuse programming with FuseLock programming technology to protect designs against reverse engineering; boundary-scan (JTAG) support for board-level test.
  • Design control  Features such as 100% pin locking and high resource utilization support deterministic pinouts and reliable production designs.
  • Standards & integration  Programmable output slew rates and drive strengths, registered I/Os, and hot-swap–compliant I/Os (except PCI) for flexible system interfacing.

Typical Applications

  • High-speed communications  Use embedded FIFOs, LVDS-capable I/Os and on-chip PLLs for data buffering, serialization and clock-domain crossing in networking equipment and transceivers.
  • Industrial control  Industrial-temperature rating and robust I/O configuration make the device suitable for motion control, PLC front-ends and factory automation logic.
  • Data processing & custom acceleration  Large logic capacity and abundant logic elements are ideal for hardware accelerators, packet processing and protocol offload functions.
  • Embedded system integration  Single-chip nonvolatile implementation with mixed-voltage banks enables consolidation of glue logic, interface bridging and system timing in compact embedded designs.

Unique Advantages

  • Nonvolatile, single-chip solution: Eliminates the need for external configuration memory by using antifuse technology, simplifying system initialization and securing bitstream confidentiality.
  • High logic and memory capacity: Combines roughly 2,000,000 equivalent gates with approximately 0.295 Mbits of embedded memory to support complex algorithms and on-chip buffering.
  • Flexible I/O standards: Bank-selectable, multi-voltage I/Os and programmable drive/slew settings ease mixed-signal board integration and support a wide range of interface standards.
  • Deterministic timing and advanced clocking: Segmentable clocks and on-chip PLLs with wide input and synthesis ranges enable controlled timing architectures across large designs.
  • Industrial-grade robustness: Rated for −40°C to 85°C and supplied in a compact FBGA package, facilitating deployment in industrial environments.
  • Design protection and testability: FuseLock programming and IEEE 1149.1 boundary-scan support help protect intellectual property and streamline manufacturing test.

Why Choose AX2000-2FG896I?

The AX2000-2FG896I positions itself as a high-capacity, industrial-grade antifuse FPGA that brings ASIC-like performance and nonvolatile programmability to demanding embedded and communications designs. With substantial logic resources, embedded SRAM/FIFO control and a broad set of I/O capabilities, it is suited for engineers consolidating complex logic, implementing high-throughput interfaces or requiring secure, single-chip programmable solutions.

Built on Microchip's AX antifuse architecture and supplied in a 896-FBGA surface-mount package, the device offers a combination of performance, timing control and security that supports long-term design scalability and robust deployment in industrial applications.

Request a quote or submit an inquiry to receive pricing, lead-time and ordering information for the AX2000-2FG896I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up