AX1000-FG896M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 896-BGA |
|---|---|
| Quantity | 561 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 516 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-FG896M – Axcelerator Field Programmable Gate Array (FPGA) IC, 516 I/Os, 165,888-bit RAM, 896-BGA
The AX1000-FG896M is an Axcelerator antifuse FPGA from Microchip Technology built on the AX architecture. This single-chip, nonvolatile FPGA delivers deterministic timing and on-chip embedded memory for complex, security-conscious designs.
With 1,000,000 gates, 18,144 logic elements and 516 user I/Os in a 896-ball FBGA package, the device targets high-density, high-I/O applications that require military-grade temperature capability and RoHS compliance.
Key Features
- AX Antifuse Architecture & Nonvolatile Configuration Single-chip antifuse technology provides a nonvolatile, one-time programmable solution and includes FuseLock programming for protection against reverse engineering.
- Performance Datasheet-level performance characteristics for the Axcelerator family include system performance above 350 MHz and internal performance over 500 MHz; embedded PLLs support frequency synthesis up to 1 GHz.
- Logic Capacity 1,000,000 equivalent system gates and 18,144 logic elements enable substantive on-chip logic integration for complex designs.
- Embedded Memory & FIFO Approximately 165,888 bits of embedded RAM with variable-aspect RAM blocks and programmable FIFO control logic for flexible buffering and dataflow management.
- I/O Flexibility 516 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for differential standards including LVDS and LVPECL; LVDS capable to 700 Mb/s per datasheet.
- Clocking & Timing Segmentable clock resources and embedded PLLs provide deterministic and user-controllable timing across the device.
- Package & Mounting Supplied in a 896-FBGA (31 × 31) surface-mount package suitable for high-density board designs.
- Military Temperature Grade Rated for operation from -55°C to 125°C and designed to meet military-grade environmental requirements; RoHS compliant.
- Test & Debug Supports boundary-scan testing (IEEE 1149.1 JTAG) and in-system diagnostics and debug with Microchip Silicon Explorer II (as documented in the family datasheet).
Typical Applications
- Military & Aerospace Systems Military-grade temperature range (-55°C to 125°C) and high logic capacity make the AX1000-FG896M suitable for mission-critical embedded processing and control functions.
- Secure Embedded Systems Nonvolatile antifuse configuration and FuseLock programming technology protect designs where IP security and reverse-engineering resistance are required.
- High-Density I/O and Interface Bridging 516 user I/Os and high-speed LVDS-capable interfaces enable complex I/O routing, protocol bridging and high-throughput data paths.
Unique Advantages
- Deterministic, Nonvolatile Implementation: Antifuse-based single-chip configuration provides a permanent, nonvolatile design image with built-in security features.
- High Logic and I/O Density: 1,000,000 gates, 18,144 logic elements and 516 I/Os combine to support complex system integration on a single device, reducing board-level component count.
- Embedded Memory with FIFO Control: Approximately 165,888 bits of on-chip SRAM and programmable FIFO control simplify buffering and dataflow without external memory.
- Robust Timing & Clocking: Segmentable clocks and PLLs with wide input range and frequency synthesis capability enable precise, high-speed timing control.
- Designed for Harsh Environments: Surface-mount 896-FBGA packaging and a -55°C to 125°C operating range make the device suitable for demanding operational conditions.
- Built-in Security & Testability: FuseLock programming and IEEE 1149.1 boundary-scan support aid IP protection and production testability; family-level tools support in-system diagnostics.
Why Choose AX1000-FG896M?
The AX1000-FG896M combines antifuse nonvolatile configuration, high logic density and extensive I/O capability in a military-grade package—providing a deterministic, secure platform for embedded systems that demand sustained performance in challenging environments. Its embedded SRAM/FIFO resources, segmentable clocks and PLLs allow designers to implement complex data paths and timing-sensitive functions on-chip.
This FPGA is well suited to programs that prioritize security, long-term stability and robust timing—especially where nonvolatile, one-time programmable logic and a high I/O count reduce system complexity and part count. Family-level diagnostics and boundary-scan capabilities add production and in-field testability to support deployment and maintenance.
Request a quote or submit an inquiry to get pricing and availability for AX1000-FG896M and to discuss how this Axcelerator FPGA can meet your design requirements.

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