AX1000-BGG729M

IC FPGA 516 I/O 729BGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

Quantity 58 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package729-PBGA (35x35)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case729-BBGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-BGG729M – Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

The AX1000-BGG729M is a Microchip Technology Axcelerator antifuse FPGA built on the AX architecture. This single-chip, nonvolatile FPGA integrates 1,000,000 equivalent system gates with 18,144 logic elements and high-density embedded memory, delivering a solution for applications that require deterministic timing, on-chip memory, and flexible I/O standards.

Designed for military-grade environments, the device targets high-reliability embedded systems where performance, security and long-term stability are required. Typical use cases include high-speed data interfaces, on-board protocol processing, and compute- and I/O-intensive control systems.

Key Features

  • Core Architecture AX antifuse-based FPGA architecture providing a single-chip, nonvolatile solution with 1,000,000 equivalent system gates and deterministic, user-controllable timing.
  • Logic Resources 18,144 logic elements (equivalent cells) suitable for medium-to-high density logic implementations.
  • Embedded Memory 36 core RAM blocks totaling 165,888 bits of embedded RAM (approximately 0.166 Mbits) with variable-aspect 4,608-bit RAM blocks and embedded FIFO control logic.
  • High-Performance Timing Segmentable clock resources (4 hardwired, 4 routed) and embedded PLLs supporting an input range of 14–200 MHz with frequency synthesis up to 1 GHz; documented system performance figures include 350+ MHz system performance and 500+ MHz internal performance.
  • I/O Flexibility 516 user I/Os across 8 I/O banks supporting mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and a range of single-ended and differential standards including LVDS and LVPECL; I/Os provide programmable slew rate, drive strength and input pull options.
  • High-Speed Interfaces LVDS-capable I/Os up to 700 Mb/s and support for registered and hot-swap compliant I/Os (except PCI).
  • Security & Programming Antifuse programming with FuseLock technology to protect against reverse engineering and design theft.
  • Package & Mounting 729-BBGA package (supplier package: 729-PBGA, 35 × 35 mm) with surface-mount mounting type and RoHS-compliant packaging option.
  • Power & Temperature Core voltage supply specified at 1.425 V to 1.575 V and an operating temperature range of −55 °C to 125 °C, suitable for military-grade thermal environments.

Typical Applications

  • High-speed data transport and protocol bridging — Use the AX1000-BGG729M for LVDS and other high-speed serial interfaces, leveraging its high-performance I/Os and embedded FIFO support to handle streaming data efficiently.
  • Deterministic control systems — Implement timing-sensitive state machines and control logic where deterministic, user-controllable timing and onboard PLLs are required.
  • Secure, nonvolatile logic implementations — Deploy designs with built-in antifuse programming and FuseLock protection for applications where IP protection and nonvolatile configuration are important.
  • Memory-intensive embedded functions — Take advantage of the device’s 36 RAM blocks and embedded FIFO control logic for packet buffering, frame storage, or data reformatting tasks.

Unique Advantages

  • Nonvolatile, single-chip solution: Eliminates the need for external configuration memory and supports secure, permanent programming via antifuse technology.
  • Deterministic timing with on-chip PLLs: Segmentable clocks and multiple PLLs enable predictable timing closure for real-time and high-speed designs.
  • Flexible I/O standards: Bank-selectable, mixed-voltage I/Os and programmable output characteristics reduce external level-shifting and simplify board design.
  • Embedded memory with FIFO control: On-chip RAM blocks and FIFO logic shrink BOM and improve data-path performance by keeping buffering on-chip.
  • Military-grade thermal capability: Wide operating temperature range (−55 °C to 125 °C) supports deployments in demanding environments.
  • Design security: FuseLock programming technology provides an added layer of protection against reverse engineering.

Why Choose AX1000-BGG729M?

The AX1000-BGG729M combines a high-density logic fabric with dedicated on-chip memory, flexible high-speed I/Os and antifuse nonvolatile programming to deliver a stable, secure FPGA platform for demanding embedded systems. Its AX architecture and embedded PLLs provide deterministic timing and performance characteristics that are well suited to data transport, control and security-sensitive applications.

This device is targeted at designers and procurement teams needing a rugged, military-grade FPGA solution with high logic capacity, significant embedded RAM and a rich set of I/O standards—all in a compact 729-BBGA surface-mount package. The combination of on-chip FIFOs, programmable I/O attributes and FuseLock security offers long-term design stability and IP protection for mission-critical projects.

Request a quote or submit an inquiry to obtain pricing and availability for the AX1000-BGG729M and to discuss how it fits into your next design.

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