AX1000-BGG729

The AX1000-BGG729 is an Axcelerator family Field Programmable Gate Array (FPGA) IC built on Microchip's AX architecture and CMOS antifuse process. It delivers a single-chip, nonvolatile implementation with high I/O density and embedded memory, suitable for designs that require deterministic timing and high-performance logic integration.

Designed for commercial-temperature applications, this device combines up to 1,000,000 equivalent system gates, 516 user I/Os, and approximately 0.166 Mbits of embedded SRAM/FIFO to support complex interface, buffering and signal-processing tasks while maintaining design security and footprint compatibility.

Key Features

• Core Architecture & Security AX architecture with antifuse programming and FuseLock™ programming technology for nonvolatile configuration and protection against reverse engineering.
• Logic Capacity 1,000,000 equivalent system gates with 18,144 logic elements to implement large custom logic functions on a single device.
• Embedded Memory & FIFOs Approximately 0.166 Mbits of embedded SRAM/FIFO (165,888 total bits) using variable-aspect 4,608-bit RAM blocks with configurable port widths and embedded FIFO control logic.
• High-Density I/O 516 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for LVDS and other differential/ single-ended standards, including 700 Mb/s LVDS-capable channels.
• Performance & Clocking System-level performance greater than 350 MHz and internal performance exceeding 500 MHz, with segmentable clock resources and embedded PLLs (14–200 MHz input range, frequency synthesis up to 1 GHz).
• Package & Power Surface-mount 729-BBGA package (supplier device package: 729-PBGA, 35×35). Core voltage supply: 1.425 V to 1.575 V.
• Commercial Operating Range Rated for commercial operation from 0 °C to 70 °C and RoHS-compliant for regulatory conformance.
• System Diagnostics & Test Built-in boundary-scan (IEEE 1149.1 JTAG) and unique in-system diagnostic and debug capability with Microchip Silicon Explorer II.

Typical Applications

• High-speed data aggregation — High I/O count and LVDS-capable channels enable multi-lane data capture, framing and buffering for communications and acquisition front-ends.
• Protocol bridging and interface conversion — Mixed-voltage, bank-selectable I/Os allow combining multiple standards and implementing protocol translation on a single device.
• Embedded FIFO buffering — On-chip FIFO control and embedded SRAM provide deterministic buffering for streaming data and packet handling.
• Secure, single-chip implementations — Nonvolatile antifuse programming and FuseLock protect configuration and intellectual property for permanent or production designs.

Unique Advantages

• Single-chip, nonvolatile solution: Eliminates external configuration memory and simplifies system boot and security models.
• High I/O density with mixed-voltage support: Reduces board-level level-shifting and external interface logic by supporting multiple I/O standards across banks.
• Built-in deterministic timing: Segmentable clocks and embedded PLLs enable predictable system timing for latency-sensitive designs.
• Embedded memory with FIFO control: Integrated SRAM blocks and FIFO logic simplify data buffering, reduce BOM, and lower latency compared with external memory solutions.
• Design protection and diagnostics: FuseLock programming and in-system diagnostic capabilities help protect IP and accelerate debug during development and manufacturing.
• Footprint-compatible packaging: 729-BBGA (729-PBGA 35×35) package options support compact board layouts and surface-mount assembly.

Why Choose AX1000-BGG729?

The AX1000-BGG729 positions itself as a high-capacity, high-I/O Axcelerator FPGA for commercial-temperature applications that need nonvolatile configuration, deterministic timing and embedded buffering. With 1,000,000 equivalent gates, 18,144 logic elements, embedded SRAM/FIFO and flexible multi-standard I/Os, it addresses complex interface consolidation and high-performance logic requirements on a single chip.

Choose this device when you need a secure, footprint-compatible FPGA that brings together performance, embedded memory and extensive I/O flexibility for production designs operating within the 0 °C to 70 °C commercial range.

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