AX1000-BG729

IC FPGA 516 I/O 729BGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

Quantity 954 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package729-PBGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case729-BBGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-BG729 – Axcelerator FPGA, 516 I/Os, ~0.166 Mbits Embedded RAM, 729‑BBGA

The AX1000-BG729 is an Axcelerator family Field Programmable Gate Array (FPGA) device built on Microchip’s AX architecture and antifuse-based, nonvolatile programming technology. The device delivers a combination of high system and internal performance, flexible multi‑standard I/Os, and on‑chip embedded SRAM/FIFO resources suitable for designs requiring deterministic timing, secure programming, and high I/O density.

AX1000 combines system-level capabilities—segmentable clocks, embedded PLLs, chip‑wide routing and embedded FIFO control logic—with a high logic capacity and a 729‑ball BGA package, providing an integrated platform for complex digital designs within commercial temperature ranges.

Key Features

  • Core Capacity  Provides 1,000,000 equivalent system gates and 18,144 logic elements (cells) to implement substantial custom logic on a single nonvolatile device.
  • Embedded Memory & FIFOs  Includes 36 core RAM blocks delivering approximately 0.166 Mbits of embedded memory with programmable FIFO control logic and variable-aspect 4,608‑bit RAM block organization options.
  • High‑Performance Timing  Documented system performance of 350+ MHz and internal performance of 500+ MHz, with segmentable clock resources and deterministic, user‑controllable timing.
  • Advanced PLLs  Embedded PLLs support a 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz for flexible clock generation and management.
  • Flexible, High‑Speed I/Os  Up to 516 user I/Os supporting mixed voltages (1.5V, 1.8V, 2.5V, 3.3V), a wide range of single‑ended and differential standards, and LVDS channels capable of 700 Mb/s.
  • Secure, Nonvolatile Programming  Antifuse programming with FuseLock technology provides a single‑chip, nonvolatile solution that protects designs against reverse engineering and unauthorized duplication.
  • Package & Supply  Surface‑mount 729‑BBGA package (supplier package: 729‑PBGA, 35×35 mm); core voltage supply range is 1.425 V to 1.575 V.
  • Commercial Grade & Compliance  Rated for 0 °C to 70 °C operating temperature and RoHS compliant.

Typical Applications

  • High‑speed serial I/O systems  Leverage LVDS‑capable I/Os and high internal performance for board‑level high‑throughput interfaces and data links.
  • Memory‑intensive buffering and FIFO management  Built‑in RAM blocks and programmable FIFO control logic provide on‑chip buffering for streaming data and protocol bridging.
  • Deterministic clocked logic  Segmentable clocks and integrated PLLs enable precise timing control for synchronous digital subsystems.
  • Secure, nonvolatile logic deployment  Antifuse programming and FuseLock technology secure intellectual property in deployed systems that require permanent configuration.

Unique Advantages

  • High logic density: 1,000,000 equivalent gates and 18,144 logic elements let you consolidate complex functions into a single device and reduce board-level BOM.
  • On‑chip memory and FIFO control: 36 RAM blocks (≈0.166 Mbits) with configurable widths and embedded FIFO logic simplify data buffering and reduce external memory requirements.
  • Deterministic performance: Segmentable clocks, deterministic timing and integrated PLLs provide predictable timing for real‑time and latency‑sensitive designs.
  • Broad I/O flexibility: Bank‑selectable, mixed‑voltage I/Os and support for multiple single‑ended and differential standards enable straightforward interfacing to diverse peripherals and subsystems.
  • Secure, one‑time programmable design: Antifuse programming with FuseLock protects IP and prevents reverse engineering, supporting secure product deployment.
  • Commercial temperature and RoHS compliance: Suited for commercial applications requiring RoHS‑compliant components within 0 °C to 70 °C.

Why Choose AX1000-BG729?

AX1000-BG729 positions itself as a high‑capacity, nonvolatile FPGA optimized for designs that need a combination of high logic density, embedded memory/FIFO capability, and flexible, high‑speed I/O in a compact BGA package. Its AX architecture elements—segmentable clocks, PLLs, and chip‑wide routing—support deterministic performance and complex system integration.

This device is well suited for engineering teams that require a secure, on‑chip programmable solution with significant on‑die RAM and I/O resources, enabling reduced component count, simplified board design, and long‑term deployment stability within commercial temperature ranges.

Request a quote or submit a request for pricing and availability for the AX1000-BG729 to evaluate how this Axcelerator FPGA fits your next design.

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