AX1000-2FGG676
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA |
|---|---|
| Quantity | 13 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 418 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-2FGG676 – Axcelerator Field Programmable Gate Array (FPGA) IC 418 I/O 165,888-bit RAM 676-BGA
The AX1000-2FGG676 is an Axcelerator-series antifuse FPGA from Microchip Technology built on the AX architecture. It delivers a single-chip, nonvolatile programmable logic solution with approximately 1,000,000 equivalent system gates, 18,144 logic elements, and embedded SRAM/FIFO resources for mid-to-high density designs.
Designed for applications that require deterministic timing, high I/O density and on-chip buffering, this commercial-grade device combines multi-standard I/O capability and embedded PLLs with a 676-ball FBGA package and a 1.425–1.575 V core supply range.
Key Features
- Core Architecture Antifuse-based AX architecture implemented in an advanced 0.15 μm CMOS process with seven metal layers, offering a nonvolatile single-chip solution.
- Logic Capacity Approximately 1,000,000 equivalent system gates realized as 18,144 logic elements for complex combinatorial and sequential logic integration.
- Embedded Memory & FIFOs 165,888 total RAM bits (approximately 0.166 Mbits) with high-performance embedded FIFO control logic and configurable RAM block organizations for buffering and width-configurable ports.
- I/O and Interface Flexibility 418 user I/Os with multi-voltage, bank-selectable support and differential standards including LVDS and LVPECL; I/Os can be programmed for slew rate, drive strength and input pull options.
- Performance and Timing System performance targets in the family include 350+ MHz system operation and 500+ MHz internal performance; segmentable clocks and on-chip PLLs support frequency synthesis and deterministic timing control.
- Power and Supply Specified core voltage range of 1.425 V to 1.575 V (approximately 1.5 V core) to support low-power core operation.
- Package & Mounting 676-FBGA (27 × 27) ball-grid array, surface-mount package optimized for board-level density and thermal conduction.
- Grade & Operating Range Commercial grade device with operating temperature range of 0 °C to 70 °C and RoHS compliance.
- Security and Test FuseLock programming technology and IEEE 1149.1 boundary-scan (JTAG) support for programming protection and testability.
Typical Applications
- Communications & Networking High-speed I/O (including LVDS up to 700 Mb/s capability) and embedded FIFOs make the device suitable for protocol bridging, packet buffering and interface conversion tasks.
- High-Speed Data Acquisition & Test Deterministic timing, on-chip memory and segmentable clocks support data capture, preprocessing and measurement instrumentation functions.
- Signal Processing & DSP Glue Logic Dense logic elements and embedded RAM enable custom DSP pipelines, buffering and glue logic between specialized IP blocks.
- ASIC Replacement & Prototyping Single-chip nonvolatile antifuse architecture and high resource utilization allow use as a compact, permanent implementation or prototype platform for ASIC-bound designs.
Unique Advantages
- Single-Chip, Nonvolatile Solution: Eliminates the need for external configuration memory by using antifuse programming for permanent, reliable configuration.
- High Logic and I/O Density: Around 18,144 logic elements and 418 user I/Os reduce system BOM and simplify board-level partitioning for complex designs.
- Embedded Memory with FIFO Support: Approximately 0.166 Mbits of embedded SRAM and dedicated FIFO control logic enable local buffering and throughput smoothing without external memory.
- Flexible, Multi-Standard I/Os: Bank-selectable I/Os and support for single-ended and differential standards provide interface versatility across mixed-voltage systems.
- Deterministic Timing and On-Chip PLLs: Segmentable clocks and embedded PLLs facilitate precise clocking and frequency synthesis for timing-critical applications.
- Board-Level Density in a Compact Package: 676-FBGA (27 × 27) package provides a high pin-count, surface-mount solution for space-constrained PCBs.
Why Choose AX1000-2FGG676?
The AX1000-2FGG676 positions itself as a high-capacity, deterministic FPGA option within the Axcelerator family, offering a single-chip nonvolatile architecture, significant on-chip RAM and a large complement of I/Os. Its combination of logic density, embedded FIFOs and programmable multi-standard I/Os makes it well suited for designs that require sustained throughput, compact integration and stable, predictable timing.
Engineers and procurement teams seeking a commercial-grade FPGA with approximately 1,000,000 equivalent gates, 18,144 logic elements, and flexible I/O configuration will find this Microchip Axcelerator device a strong candidate for communications, data acquisition, signal processing and ASIC-replacement applications.
Request a quote or submit an inquiry to check current availability, lead times and pricing for AX1000-2FGG676.

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