AX1000-2FGG676

IC FPGA 418 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

Quantity 13 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case676-BGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-2FGG676 – Axcelerator Field Programmable Gate Array (FPGA) IC 418 I/O 165,888-bit RAM 676-BGA

The AX1000-2FGG676 is an Axcelerator-series antifuse FPGA from Microchip Technology built on the AX architecture. It delivers a single-chip, nonvolatile programmable logic solution with approximately 1,000,000 equivalent system gates, 18,144 logic elements, and embedded SRAM/FIFO resources for mid-to-high density designs.

Designed for applications that require deterministic timing, high I/O density and on-chip buffering, this commercial-grade device combines multi-standard I/O capability and embedded PLLs with a 676-ball FBGA package and a 1.425–1.575 V core supply range.

Key Features

  • Core Architecture  Antifuse-based AX architecture implemented in an advanced 0.15 μm CMOS process with seven metal layers, offering a nonvolatile single-chip solution.
  • Logic Capacity  Approximately 1,000,000 equivalent system gates realized as 18,144 logic elements for complex combinatorial and sequential logic integration.
  • Embedded Memory & FIFOs  165,888 total RAM bits (approximately 0.166 Mbits) with high-performance embedded FIFO control logic and configurable RAM block organizations for buffering and width-configurable ports.
  • I/O and Interface Flexibility  418 user I/Os with multi-voltage, bank-selectable support and differential standards including LVDS and LVPECL; I/Os can be programmed for slew rate, drive strength and input pull options.
  • Performance and Timing  System performance targets in the family include 350+ MHz system operation and 500+ MHz internal performance; segmentable clocks and on-chip PLLs support frequency synthesis and deterministic timing control.
  • Power and Supply  Specified core voltage range of 1.425 V to 1.575 V (approximately 1.5 V core) to support low-power core operation.
  • Package & Mounting  676-FBGA (27 × 27) ball-grid array, surface-mount package optimized for board-level density and thermal conduction.
  • Grade & Operating Range  Commercial grade device with operating temperature range of 0 °C to 70 °C and RoHS compliance.
  • Security and Test  FuseLock programming technology and IEEE 1149.1 boundary-scan (JTAG) support for programming protection and testability.

Typical Applications

  • Communications & Networking  High-speed I/O (including LVDS up to 700 Mb/s capability) and embedded FIFOs make the device suitable for protocol bridging, packet buffering and interface conversion tasks.
  • High-Speed Data Acquisition & Test  Deterministic timing, on-chip memory and segmentable clocks support data capture, preprocessing and measurement instrumentation functions.
  • Signal Processing & DSP Glue Logic  Dense logic elements and embedded RAM enable custom DSP pipelines, buffering and glue logic between specialized IP blocks.
  • ASIC Replacement & Prototyping  Single-chip nonvolatile antifuse architecture and high resource utilization allow use as a compact, permanent implementation or prototype platform for ASIC-bound designs.

Unique Advantages

  • Single-Chip, Nonvolatile Solution: Eliminates the need for external configuration memory by using antifuse programming for permanent, reliable configuration.
  • High Logic and I/O Density: Around 18,144 logic elements and 418 user I/Os reduce system BOM and simplify board-level partitioning for complex designs.
  • Embedded Memory with FIFO Support: Approximately 0.166 Mbits of embedded SRAM and dedicated FIFO control logic enable local buffering and throughput smoothing without external memory.
  • Flexible, Multi-Standard I/Os: Bank-selectable I/Os and support for single-ended and differential standards provide interface versatility across mixed-voltage systems.
  • Deterministic Timing and On-Chip PLLs: Segmentable clocks and embedded PLLs facilitate precise clocking and frequency synthesis for timing-critical applications.
  • Board-Level Density in a Compact Package: 676-FBGA (27 × 27) package provides a high pin-count, surface-mount solution for space-constrained PCBs.

Why Choose AX1000-2FGG676?

The AX1000-2FGG676 positions itself as a high-capacity, deterministic FPGA option within the Axcelerator family, offering a single-chip nonvolatile architecture, significant on-chip RAM and a large complement of I/Os. Its combination of logic density, embedded FIFOs and programmable multi-standard I/Os makes it well suited for designs that require sustained throughput, compact integration and stable, predictable timing.

Engineers and procurement teams seeking a commercial-grade FPGA with approximately 1,000,000 equivalent gates, 18,144 logic elements, and flexible I/O configuration will find this Microchip Axcelerator device a strong candidate for communications, data acquisition, signal processing and ASIC-replacement applications.

Request a quote or submit an inquiry to check current availability, lead times and pricing for AX1000-2FGG676.

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