AX1000-1FGG676I

IC FPGA 418 I/O 676FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

Quantity 1,105 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case676-BGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1FGG676I – Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 676-BGA

The AX1000-1FGG676I is an Axcelerator antifuse FPGA built on Microchip's AX architecture, offering a single-chip, nonvolatile solution for designs that require high performance, security and deterministic timing. With 1,000,000 equivalent system gates and 18,144 logic elements, this device targets high-performance embedded systems, telecom and industrial applications that need flexible I/O and embedded memory.

Architected for system-level integration, the device provides mixed-voltage, bank-selectable I/Os, embedded SRAM with FIFO control logic, on-chip PLLs and segmentable clock resources to simplify complex designs while supporting industrial temperature operation.

Key Features

  • Core Capacity 1,000,000 equivalent system gates with 18,144 logic elements to implement complex custom logic and system functions.
  • Embedded Memory & FIFOs Approximately 0.166 Mbits of embedded memory (165,888 bits) organized in configurable RAM blocks and supported by embedded FIFO control logic for data buffering and streaming.
  • I/O Flexibility 418 user I/Os with bank-selectable I/O banks and support for single-ended and differential standards including LVTTL, LVCMOS, LVPECL and LVDS; LVDS capable to 700 Mb/s for high-speed interfaces.
  • High-Speed Performance System performance above 350 MHz and internal performance above 500 MHz, supported by embedded PLLs with frequency synthesis capabilities up to 1 GHz for clock generation and domain crossing.
  • Deterministic Clocking & Timing Segmentable clock resources and deterministic, user-controllable timing for predictable, repeatable timing closure in complex designs.
  • Secure, Nonvolatile Programming Antifuse-based single-chip nonvolatile solution with FuseLock programming technology to protect designs against reverse engineering and design theft.
  • Process & Construction Manufactured on a 0.15 μm CMOS antifuse process with seven metal layers for reliable, high-speed routing and integration.
  • Package, Power & Temperature 676-FBGA (27 × 27) surface-mount package, industrial-grade operation from −40 °C to +85 °C, and core voltage supply range of 1.425 V to 1.575 V. RoHS-compliant.

Typical Applications

  • Telecom & Networking Implement protocol processing, line cards and high-speed serial interfaces using the device's LVDS-capable I/Os, embedded FIFOs and high internal performance.
  • Industrial Control & Automation Deploy deterministic control logic and custom I/O handling within industrial temperature ranges using the device's segmentable clocks and mixed-voltage I/O banks.
  • High-Speed Data Acquisition Buffer and process streaming sensor or ADC data with embedded RAM/FIFO blocks and high-speed I/O channels for low-latency data paths.
  • Secure Embedded Systems Protect IP with antifuse nonvolatile programming and FuseLock technology for designs that require hardware-level program security.

Unique Advantages

  • Highly integrated single-chip solution: Combines nonvolatile logic, embedded memory and PLLs to reduce external components and simplify system design.
  • High-speed deterministic performance: 350+ MHz system and 500+ MHz internal performance with segmentable clocks for predictable timing in complex designs.
  • Flexible, multi-standard I/Os: Support for multiple single-ended and differential standards and bank-selectable voltages enables direct interfacing to diverse peripherals and transceivers.
  • Embedded FIFO and memory architecture: Configurable RAM blocks and FIFO control logic streamline data buffering and width conversion, reducing board-level memory requirements.
  • Security and IP protection: Antifuse programming with FuseLock technology helps mitigate reverse engineering and design theft concerns.
  • Industrial readiness: Surface-mount 676-FBGA package, industrial temperature rating and RoHS compliance suit extended-environment deployments.

Why Choose AX1000-1FGG676I?

The AX1000-1FGG676I is positioned for engineers who need a secure, nonvolatile FPGA with substantial logic capacity and flexible I/O for high-performance embedded and industrial systems. Its combination of 1,000,000 equivalent gates, 18,144 logic elements and embedded memory supports complex designs while reducing the need for external ASICs or discrete components.

With deterministic clocking, high-speed I/O capability and industrial temperature operation, this Axcelerator device offers a robust platform for scalable, reliable designs where performance, integration and IP protection are key considerations.

Request a quote or submit an inquiry to discuss availability, pricing and how AX1000-1FGG676I can fit your next design.

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